Matches 101 - 150 out of 287 < 1 2 3 4 5 6 >
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7026223 Hermetic electric component package  
An electric component package having a base and a lid, the base and lid defining a hermetically sealed cavity therebetween for accommodating an electric component. The base includes at least one...
7023063 Arrangement of microstructures  
A method referred to as a “cellular damascene method” utilizes a multiplicity of regularly arranged closed cavities referred to as “cells”, which are produced in a patterning layer. The...
7015074 Vacuum package fabrication of integrated circuit components  
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and...
7011986 Method for manufacturing a housing for a chip with a micromechanical structure  
In a housing manufacturing method a base is provided with first contact elements with a photolithographically patternable layer that is patterned for exposing the contact elements. A chip with a...
7008817 Method for manufacturing micro electro-mechanical systems using solder balls  
A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of...
7005319 Global planarization of wafer scale package with precision die thickness control  
In accordance with the present invention, a method for producing at least two different chips with a controlled total chip thickness such that when these chips are placed into a corresponding...
7001825 Semiconductor structures having multiple conductive layers in an opening, and methods for fabricating same  
In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and...
6998327 Thin film transfer join process and multilevel thin film module  
A thin film transfer join process in which a multilevel thin film structure is formed on a carrier, the multilevel thin film structure is joined to a final substrate and then the carrier is...
6993826 Method of manufacturing a probe array  
An optical-pickup slider is characterized in that a light-transmitting-property substrate is bonded to a surface of a layer having a tapered through hole, on which surface a larger opening of the...
6991948 Method of electrical characterization of a silicon-on-insulator (SOI) wafer  
A method of characterizing a silicon-on-insulator (SOI) wafer, comprised of an insulating layer sandwiched between a semiconductor top layer and a semiconductor substrate, includes moving a pair of...
6982019 Method for manufacturing a batch of multi-layered cells, such as liquid crystal display cells, or electrochemical photovoltaic cells  
The present invention concerns a method for manufacturing a plurality of multi-layered cells, particularly liquid crystal display cells, or electrochemical photovoltaic cells, or a combination of...
6982191 Methods relating to forming interconnects and resulting assemblies  
Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component...
6979597 Wafer-level package with silicon gasket  
A gasket encloses a hermetically sealed environment between a cap wafer and a base wafer. The gasket is bonded to the base wafer using bonding material. The bonding material can be one or more of...
6969667 Electrical device and method of making  
An electrical device includes a plurality of integrated circuits respectively fabricated in a first substrate bonded to a second substrate by a bond that deforms above, but not below, a deformation...
6967145 Method of maintaining photolithographic precision alignment after wafer bonding process  
A method of maintaining photolithographic precision alignment for a wafer after being bonded, wherein two cavities are formed at the rear surface of a top wafer at the position corresponding to...
6965107 Semiconductor-based encapsulated infrared sensor and electronic device  
An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess...
6955976 Method for dicing wafer stacks to provide access to interior structures  
Methods for dicing wafer stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first...
6955975 Method for joining a silicon plate to a second plate  
A method for joining a silicon plate to a second plate, a laser beam being directed through the silicon plate at the second plate. In the process, the wavelength of the laser beam is selected in...
6951797 Method relating to anodic bonding  
The present invention relates to a method of bonding a first member ( 110, 210, 130, 230, 410, 430, 510, 530, 610 ) to a second silicon member ( 120, 220, 420 a, 420 b, 600 ) through anodic...
6946360 Fluid pressure bonding  
An improved method of bonding involves using direct fluid pressure to press together the layers to be bonded. Advantageously one or more of the layers are sufficiently flexible to provide wide area...
6942750 Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication  
A method of low-temperature (150-300° C.) patterned wafer bonding of complex 3D MEMS comprising providing a first pre-processed wafer having a first surface and a second pre-processed wafer having...
6939784 Wafer scale package and method of assembly  
A plurality of electronic circuits and associated signal lines are positioned at respective locations on a base wafer. A cover wafer, which fits over the base wafer, includes a corresponding like...
6930021 Mask and method of manufacturing the same, electro-luminescence device and method of manufacturing the same, and electronic instrument  
A method of manufacturing a mask includes: attaching a second substrate having a plurality of penetrating holes to a first substrate having an opening. The second substrate is attached such that...
6908828 Support-integrated donor wafers for repeated thin donor layer separation  
Processes that may be used in producing electronic, optoelectronic, or optical components may be provided. The processes may involve preparing a reusable donor wafer for donating a thin layer of...
6905945 Microwave bonding of MEMS component  
Bonding of MEMs materials is carried out using microwave. High microwave absorbing films are placed within a microwave cavity, and excited to cause selective heating in the skin of the material....
6900113 Method for producing bonded wafer and bonded wafer  
The present invention provides a method for producing a bonded wafer comprising at least an ion implantation process where at least either hydrogen ions or rare gas ions are implanted into a first...
6893936 Method of Forming strained SI/SIGE on insulator with silicon germanium buffer  
A method is disclosed for forming a semiconductor wafer having a strained Si or SiGe layer on an insulator layer. The method produces a structure having a SiGe buffer layer between the insulator...
6890778 Vertical cavity surface emitting laser and a method of fabrication thereof  
An electrically pumped VCSEL and a method of its fabrication are presented. The VCSEL comprises an active cavity material sandwiched between top and bottom DBR stacks, the top DBR having at least...
6890834 Electronic device and method for manufacturing the same  
An Al film is formed on a cap wafer and the Al film is patterned into a ring-shaped film. Dry etching is performed by using the ring-shaped film as a mask to form a drum portion enclosing a recess...
6881648 Semiconductor wafer having a thin die and tethers and methods of making the same  
A semiconductor wafer ( 70 ) that includes a support body ( 72 ), at least one thin die ( 20, 60 ), and a plurality of tethers ( 78, 178 ). The support body ( 72 ) is made of a semiconductor...
6878566 Method of reinforcing a mechanical microstructure  
A mechanical microstructure including a deformable first layer overhanging a second layer and defining a cavity set back from an external face of the deformable first layer and having an abutment...
6879035 Vacuum package fabrication of integrated circuit components  
A method for manufacturing integrated circuit device lids includes creating a lid cavity on the surface of a lid wafer, forming a sealing surface on the lid wafer that surrounds the lid cavity, and...
6878638 Multi-level integrated circuit for wide-gap substrate bonding  
An integrated circuit includes a substrate having an etched surface and a non-etched surface. The etched surface contains circuit elements and the non-etched surface contains a bonding surface. The...
6875671 Method of fabricating vertical integrated circuits  
A method for fabricating a vertical integrated circuit is disclosed. Integrated circuits are fabricated on a substrate with layers of predetermined weak and strong bond regions where deconstructed...
6872650 Ball electrode forming method  
A ball electrode forming method comprises steps of: preparing a semiconductor apparatus having a plurality of electrode pads; arranging a mask having an upper surface and a lower surface, an area...
6872902 MEMS device with integral packaging  
A MEMS device and method of making same is disclosed. In one embodiment, a micro-switch includes a base assembly comprising a movable structure bearing a contact pad. The base assembly is...
6852570 Method of manufacturing a stacked semiconductor device  
A method of manufacturing a semiconductor device which can solve a problem in which a wafer is warped by the influence of thermal contraction of a sealing resin due to a difference in thermal...
6852574 Method of forming a leadframe for a semiconductor package  
A method of forming a leadframe ( 10 ) provides blocking fulcrums ( 21,23 ) adjacent to the leads ( 12,13,14 , and 15 ). During the process of encapsulating the leadframe ( 10 ), the blocking...
6846725 Wafer-level package for micro-electro-mechanical systems  
A method for forming wafers having through-wafer vias for wafer-level packaging of devices, the method comprising the steps of depositing metal on one of two wafers; bonding the two wafers using...
6846724 Method for fabricating a microelectromechanical system (MEMS) device using a pre-patterned bridge  
A method for fabricating MEMS structures includes etching a recess in either an upper surface of a substrate that is bonded to a wafer that ultimately forms the MEMS structure, or to the lower...
6844241 Fabrication of semiconductor structures having multiple conductive layers in an opening  
In some embodiments, a circuit structure comprises a semiconductor substrate, an opening passing through the substrate between a first side of the substrate and a second side of the substrate, and...
6825055 Method for assembling integral type electronic component and integral type electronic component  
An integral type electronic component is formed of a first board and a second board by storing and holding electronic components to component storage parts of the first board and electrically...
6825098 Method for fabricating microstructures and arrangement of microstructures  
A method referred to as a “cellular damascene method” utilizes a multiplicity of regularly arranged closed cavities referred to as “cells”, which are produced in a patterning layer. The...
6815278 Ultra-thin silicon-on-insulator and strained-silicon-direct-on-insulator with hybrid crystal orientations  
The invention provides integrated semiconductor devices that are formed upon an SOI substrate having different crystal orientations that provide optimal performance for a specific device....
6815739 Radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates  
A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”)...
6797591 Method for forming a semiconductor device and a semiconductor device formed by the method  
A method for forming a multi-layer semiconductor device ( 1 ) having a lower silicon layer ( 4 ), an intermediate silicon layer ( 5 ) within which micro-mirrors ( 10 ) are formed and an upper...
6790775 Method of forming a through-substrate interconnect  
Methods of fabricating a through-substrate interconnect for a microelectronics device, the device including a substrate having a frontside and a backside, are disclosed. Some embodiments of the...
6767757 High-vacuum packaged microgyroscope and method for manufacturing the same  
A high-vacuum packaged microgyroscope for detecting the inertial angular velocity of an object and a method for manufacturing the same. In the high-vacuum packaged microgyroscope, a substrate with...
6753205 Method for manufacturing a structure comprising a substrate with a cavity and a semiconductor integrated circuit bonded to a contact pad located in the cavity  
Semiconductor dies are bonded to contact pads formed in a substrate's cavity. Vias through the substrate open into the cavity. Conductive lines passing through the vias connect the contact pads in...
6736983 Method for producing microcomponents  
Micro-components having at least one individual layer are produced according to the method, which have functional layers 3 on the walls of inner structures, for example of flow channels. The...
Matches 101 - 150 out of 287 < 1 2 3 4 5 6 >