Matches 51 - 100 out of 287 < 1 2 3 4 5 6 >
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7341924 Method for manufacturing semiconductor device  
A method of separating a lamination body with high yield without damaging the lamination body is provided. Further, a method of manufacturing a lightweight, flexible semiconductor device, which is...
7338896 Formation of deep via airgaps for three dimensional wafer to wafer interconnect  
A method for forming deep via airgaps in a semiconductor substrate is disclosed comprising the steps of patterning a hole in the substrate, partly fill said hole with a sacrificial material (e.g....
7332413 Semiconductor wafers including one or more reinforcement structures and methods of forming the same  
Methods of forming semiconductor devices include thinning a region of a semiconductor wafer and forming at least one semiconductor die laterally within a thinned region of the wafer. One or more...
7332411 Systems and methods for wafer bonding by localized induction heating  
A system and method bond wafers using localized induction heating. One or more induction micro-heaters are formed with a first substrate to be bonded. A second substrate is positioned in intimate...
7320928 Method of forming a stacked device filler  
Numerous embodiments of a stacked device filler and a method of formation are disclosed. In one embodiment, a method of forming a stacked device filler comprises forming a material layer between...
7307005 Wafer bonding with highly compliant plate having filler material enclosed hollow core  
The present invention discloses a method that includes: providing two wafers; forming raised contacts on the two wafers; aligning the two wafers; bringing together the raised contacts; locally...
7303976 Wafer bonding method  
One embodiment of a micro-electronic device includes a substrate including micro-electronic components thereon, and a cover including a ring of sealing material secured to the substrate and a...
7300813 Method for manufacturing micro-machined switch using pull-up type contact pad  
The present invention relates to the manufacture of a semiconductor switch for use in a variety of communication systems, and particularly to the manufacture of a RF micro-machined switch of...
7300823 Apparatus for housing a micromechanical structure and method for producing the same  
Apparatus for housing a micromechanical structure, and a method for producing the housing. The apparatus has a substrate having a main side on which the micromechanical structure is formed, a...
7297562 Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns  
A circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns provides a high-density mounting and interconnect structure for...
7291513 Hermetic wafer-level packaging for MEMS devices with low-temperature metallurgy  
A method is disclosed for making a wafer-level package for a plurality of MEMS devices. The method involves preparing a MEMS wafer and a lid wafer, each having respective bonding structures. The...
7288464 MEMS packaging structure and methods  
A MEMS article is made by forming a MEMS device on a first substrate, providing a second substrate, depositing a layer of etchable dielectric material, forming at least one lateral post-bond...
7285844 Multiple internal seal right micro-electro-mechanical system vacuum package  
A Multiple Internal Seal Ring (MISR) Micro-Electro-Mechanical System (MEMS) vacuum package that hermetically seals MEMS devices using MISR. The method bonds a capping plate having metal seal rings...
7265027 Bond method and structure using selective application of spin on glass  
A method for bonding substrate structures. The method includes providing a transparent substrate structure, the transparent substrate structure comprising a face region and an incident light...
7259080 Glass-type planar substrate, use thereof, and method for the production thereof  
The invented method is distinguished by a combination of the following method steps: provision of a semiconductor planar substrate composed of a semiconductor material, reduction of the...
7244663 Wafer reinforcement structure and methods of fabrication  
A method of fabricating a thinned, reinforced semiconductor wafer is disclosed. Particularly, a semiconductor wafer may be provided and a plurality of separate semiconductor dice may be formed upon...
7220656 Strained semiconductor by wafer bonding with misorientation  
One aspect of the present invention relates to a method for forming a strained semiconductor structure. In various embodiments, at least two strong bonding regions are defined for a desired bond...
7214324 Technique for manufacturing micro-electro mechanical structures  
A technique for manufacturing a micro-electro mechanical structure includes a number of steps. Initially, a cavity is formed into a first side of a handling wafer, with a sidewall of the cavity...
7205211 Method for handling semiconductor layers in such a way as to thin same  
This invention relates to a method for making a thin layer starting from a wafer comprising a front face with a given relief, and a back face, comprising steps consisting of: a) obtaining a...
7192842 Method for bonding wafers  
A first wafer is provided, and a photosensitive masking-and-bonding pattern is formed on the surface of the first wafer. Then, an etching process using the photosensitive masking-and-bonding...
7192841 Method of wafer/substrate bonding  
A method of bonding two components by depositing an amorphous and non-hydrogenated intermediate layer ( 2 ) on one of the components ( 1,4 ) and arranging the components ( 1,4 ) in spaced...
7176072 Strained silicon devices transfer to glass for display applications  
A method of fabricating strained silicon devices for transfer to glass for display applications includes preparing a wafer having a silicon substrate thereon; forming a relaxed SiGe layer on the...
7176106 Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging  
A method for forming device packages includes forming a perimeter comprising a reactive foil and a bonding material interposed between a first wafer and a second wafer, pressing the first and the...
7176107 Hybrid substrate and method for fabricating the same  
A hybrid substrate, i.e., a substrate fabricated from different materials, and method for fabricating the same are presented. The hybrid substrate is configured for fabricating more than two...
7160478 Method for producing electronic componets  
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or...
7153718 Micromechanical component as well as a method for producing a micromechanical component  
A micromechanical component having a substrate beneath at least one structured layer, in the structured layer at least one functional structure being formed, a cap which covers the functional...
7141176 Methods and apparatuses for assembling elements onto a substrate  
Methods and apparatuses for assembling elements onto a substrate. The surfaces of the elements and/or the substrate are treated and the elements are dispensed over the substrate in a slurry. In one...
7135383 Composite structure with high heat dissipation  
A composite structure is disclosed that includes a support wafer and a layered structure on the support wafer. The layered structure includes at least one layer of a monocrystalline material and at...
7118991 Encapsulation wafer process  
A method of processing a wafer, and particularly a cap wafer configured for mating with a device wafer in the production of a die package. Masking layers are deposited on oxide layers present on...
7105421 Silicon on insulator field effect transistor with heterojunction gate  
A field effect transistor (FET) is formed on a silicon on insulator (SOI) substrate in the thin silicon layer above the insulating buried oxide layer. The channel region is lightly doped with a...
7098117 Method of fabricating a package with substantially vertical feedthroughs for micromachined or MEMS devices  
A vacuum or hermetic packaged micromachined or MEMS device and methods for manufacturing the device so that the device has at least one substantially vertical feedthrough are provided. In a first...
7094665 Exfoliating method, transferring method of thin film device, and thin film device, thin film integrated circuit device, and liquid crystal display device produced by the same  
A transferring method including providing a substrate, forming a transferred layer over the substrate, joining a transfer member to the transferred layer, and removing the transferred layer from...
7090325 Liquid drop discharge head and manufacture method thereof, micro device ink-jet head ink cartridge and ink-jet printing device  
A liquid drop discharge head includes a chip ( 21 ) that is formed by separation of a silicon wafer ( 20 ). The silicon wafer ( 20 ) has a first direction and a second direction which are mutually...
7078317 Method and system for source switching and in-situ plasma bonding  
A system for in-situ plasma treatment. The system has a processing chamber, e.g., plasma chamber. The system has a first susceptor coupled within the chamber and a second susceptor facing the first...
7078320 Partial wafer bonding and dicing  
Disclosed is a method of manufacturing integrated circuit chips that partially joins an integrated circuit wafer to a supporting wafer at a limited number of joining points. Once joined, the...
7078318 Method for depositing III-V semiconductor layers on a non-III-V substrate  
The invention relates to a method for depositing thick III-V semiconductor layers on a non-III-V substrate, particularly a silicon substrate, by introducing gaseous starting materials into the...
7069652 Method for producing laminated smart cards  
A smart card is laminated from at least two layers of paper or film as a mounting material. A first of the layers is fitted with a semiconductor chip and a second layer has connecting contacts as...
7071012 Methods relating to the reconstruction of semiconductor wafers for wafer-level processing  
Methods relating to the reconstruction of semiconductor wafers for wafer-level processing are disclosed. Selected semiconductor dice having alignment cavities formed in a surface thereof are placed...
7067344 Method of manufacturing an external force detection sensor  
A method of manufacturing an external force detection sensor in which a sensor element is formed by through-hole dry etching of an element substrate, and an electrically conductive material is used...
RE39143 Method for making a wafer-pair having sealed chambers  
A method for fabricating a wafer-pair having at least one recess in one wafer and the recess formed into a chamber with the attaching of the other wafer which has a port plugged with a deposited...
7064004 Induction-based heating for chip attach  
A method for bonding a semiconductor die to a substrate is described. The method comprises arranging a semiconductor die, an interconnect, and a substrate in a suitable configuration and using...
7056807 Barrier structure against corrosion and contamination in three-dimensional (3-D) wafer-to-wafer vertical stack  
A three-dimensional (3-D) integrated chip system is provided with a first wafer including one or more integrated circuit (IC) devices, metallic lines deposited via an interlevel dielectric (ILD) on...
7052948 Film or layer made of semi-conductive material and method for producing said film or layer  
The invention relates to a film or a layer made of semi-conducting material with low defect density in the thin layer, and a SOI-disk with a thin silicon layer exhibiting low surface roughness,...
7049207 Isolating method and transferring method for semiconductor devices  
A method of isolating semiconductor devices by wet etching of a semiconductor laminate structure formed on a substrate includes providing an etching stop layer having at least two layers between...
7049624 Member and member manufacturing method  
A porous structure with high uniformity is provided even when evaluated at a high resolution (high evaluation standard) of several or several ten nm or less. By applying this porous structure to...
7045440 Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates  
A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”)...
7041227 Method for revealing crystalline defects and/or stress field defects at the molecular adhesion interface of two solid materials  
A process for permitting defects or stresses in a structure to be revealed, including (a) securing by molecular bonding of a face of a first element containing crystalline material with a face of a...
7041577 Process for manufacturing a substrate and associated substrate  
A process for producing a substrate is described. The process includes providing an assembly having a first layer weakly bonded to a temporary support at an interface therebetween. At least a...
7042105 Methods for dicing wafer stacks to provide access to interior structures  
Methods for dicing water stacks are provided. Preferably, the method includes the steps of: (1) providing a wafer stack having a first wafer and a second wafer; (2) exposing a portion of the first...
7037805 Methods and apparatus for attaching a die to a substrate  
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes...
Matches 51 - 100 out of 287 < 1 2 3 4 5 6 >