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9040385 Mechanisms for cleaning substrate surface for hybrid bonding  
Embodiments of mechanisms for cleaning a surface of a semiconductor wafer for a hybrid bonding are provided. The method for cleaning a surface of a semiconductor wafer for a hybrid bonding...
9040360 Methods of manufacture of bottom port multi-part surface mount MEMS microphones  
Methods for manufacturing multiple bottom port, surface mount microphones, each containing a micro-electro-mechanical system (MEMS) microphone die, are disclosed. Each surface mount microphone...
9041147 Semiconductor substrate, thin film transistor, semiconductor circuit, liquid crystal display apparatus, electroluminescent apparatus, semiconductor substrate manufacturing method, and semiconductor substrate manufacturing apparatus  
According to a semiconductor substrate (40), a space (A) between a plurality of Si thin film (16), which are provide apart from one another on the insulating substrate (30), is (I) larger than a...
9040355 Sensor package and method of forming same  
A method (70) of forming sensor packages (20) entails providing a sensor wafer (74) having sensors (30) formed on a side (26) positioned within areas (34) delineated by bonding perimeters (36),...
9035474 Method for manufacturing a semiconductor substrate  
The invention relates to a method for manufacturing a semiconductor substrate, in particular, a semiconductor-on-insulator substrate by providing a donor substrate and a handle substrate, forming...
9034728 Direct bonding process using a compressible porous layer  
A method for direct bonding between a first element and a second element, including at least the following steps: deposition of at least one first porous layer on at least one face of the first...
9034727 Methods and structures for forming integrated semiconductor structures  
The invention provides methods and structures for fabricating a semiconductor structure and particularly for forming a semiconductor structure with improved planarity for achieving a bonded...
9029269 Wafer bonding system and method for bonding and debonding thereof  
A method of treating the surface of a semiconductor wafer through the formation of a bonding system is provided in order to enhance the handling of the wafer during subsequent processing...
9029238 Advanced handler wafer bonding and debonding  
A method for processing a semiconductor wafer includes applying a release layer to a transparent handler. An adhesive layer, that is distinct from the release layer, is applied between a...
9029234 Physical design symmetry and integrated circuits enabling three dimentional (3D) yield optimization for wafer to wafer stacking  
One of the wafers in a semiconductor wafer to wafer stack can be rotated a predefined number of positions, relative to a previous wafer in the stack, and bonded in the position in which the...
9024432 Bottom port multi-part surface mount MEMS microphone  
A surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the package to...
9023689 Top port multi-part surface mount MEMS microphone  
A top-port, surface mount package for a micro-electro-mechanical system (MEMS) microphone die is disclosed. The surface mount package features a substrate with metal pads for surface mounting the...
9018078 Method of making a 3D integrated circuit  
A method for manufacturing an integrated circuit, including the steps of forming first transistors on a first semiconductor layer; depositing a first insulating layer above the first semiconductor...
9018738 Silicon layer transfer substrate and method of manufacturing semiconductor substrate  
A silicon layer transfer substrate includes a silicon substrate of a first substrate, a sacrificial layer, and a transfer silicon layer transferred to a second substrate, wherein the sacrificial...
9018077 Methods for wafer bonding, and for nucleating bonding nanophases  
Substrates may be bonded according to a method comprising contacting a first bonding surface of a first substrate with a second bonding surface of a second substrate to form an assembly; and...
9017563 Plating method of circuit substrate, production method of plated circuit substrate, and silver etching liquid  
Provided is a plating method of a circuit substrate comprising a conductive pattern in which a metal layer containing at least silver and copper is exposed on an outer surface. The plating method...
9012311 Method for producing a semiconductor body having a recombination zone, semiconductor component having a recombination zone, and method for producing such a semiconductor component  
In a method for producing a semiconductor body, impurities which act as recombination centers in the semiconductor body and form a recombination zone are introduced into the semiconductor body...
9013650 Peeling method and method for manufacturing display device using the peeling method  
The present invention provides a simplifying method for a peeling process as well as peeling and transcribing to a large-size substrate uniformly. A feature of the present invention is to peel a...
9006857 Platform comprising an infrared sensor  
An IR sensor includes a suspended micro-platform having a support layer and a device layer disposed thereon. IR absorbers are disposed in or on the device layer. IR radiation received by the IR...
9006081 Methods of processing substrates  
Methods of manufacturing a plurality of semiconductor chips are provided. The method may include providing a middle layer between a substrate and a carrier to combine the carrier with the...
9004135 Method and apparatus for bonding together two wafers by molecular adhesion  
The invention provides a method of bonding a first wafer onto a second wafer by molecular adhesion, the method comprising applying a point of initiation of a bonding wave between the first and...
9004366 Wireless devices including printed integrated circuitry and methods for manufacturing and using the same  
Printed integrated circuitry and attached antenna and/or inductor for sensors, electronic article surveillance (EAS), radio frequency (RF) and/or RF identification (RFID) tags and devices, and...
9006844 Process and structure for high temperature selective fusion bonding  
A method to prevent movable structures within a MEMS device, and more specifically, in recesses having one or more dimension in the micrometer range or smaller (i.e., smaller than about 10...
9006082 Film transferable logic circuit, and methods for providing film transferable logic circuit  
A filmic circuit includes a circuit portion and a carrier layer. The circuit portion includes a logic circuit that includes, for example, plural logic gates configurable to receive an input and...
9006015 Dual layer microelectromechanical systems device and method of manufacturing same  
Exemplary microelectromechanical system (MEMS) devices, and methods for fabricating such are disclosed. An exemplary method includes providing a silicon-on-insulator (SOI) substrate, wherein the...
8999812 Graphene devices and methods of manufacturing the same  
A graphene device may include a channel layer including graphene, a first electrode and second electrode on a first region and second region of the channel layer, respectively, and a capping layer...
8999821 Fin formation by epitaxial deposition  
Methods of forming a fin structure for a field effect transistor are described. The methods may include the operations of patterning a mandrel on a surface of a substrate, and depositing an...
9001520 Microelectronic structures having laminated or embedded glass routing structures for high density packaging  
Embodiments of the present description relate to the field of fabricating microelectronic structures. The microelectronic structures may include a glass routing structure formed separately from a...
8997822 Substrate inverting device, substrate inverting method, and peeling system  
According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit...
8999813 Focal plane array and method for manufacturing the same  
A method of forming a focal plane array by: forming a first wafer having sensing material provided on a surface, which is covered by a sacrificial layer, the sensing material being a thermistor...
8993411 Method for forming pad in wafer with three-dimensional stacking structure  
A method for forming a pad in a wafer with a three-dimensional stacking structure is disclosed. The method includes bonding a device wafer that includes an Si substrate and a handling wafer,...
8993408 Method for detaching a silicon thin film by means of splitting, using triple implantation  
A process for detaching a silicon thin film from a donor substrate by cleaving, includes implanting species within the donor substrate to form a weak layer. The species are implanted at a depth at...
8993370 Reverse stack structures for thin-film photovoltaic cells  
In one embodiment, a method includes depositing a photoactive layer onto a first substrate, depositing a contact layer onto the photoactive layer, attaching a second substrate onto the contact...
8993461 Method for curing defects in a semiconductor layer  
A method for curing defects associated with the implantation of atomic species into a semiconductor layer transferred onto a receiver substrate, wherein the semiconductor layer is thermally...
8987114 Bonded semiconductor structures and method of forming same  
Methods of forming semiconductor structures include transferring a portion (116a) of a donor structure to a processed semiconductor structure (102) that includes at least one non-planar surface....
8980671 Semiconductor device and manufacturing method of semiconductor device  
A manufacturing method of a semiconductor device according to embodiments includes forming a photodiode layer, which is an active region including a photodiode, on a main surface of a first...
8981531 Composite wafer and method for manufacturing the same  
A composite wafer 10 includes a supporting substrate 12 and a semiconductor substrate 14 which are bonded to each other by direct bonding. The supporting substrate 12 is a translucent alumina...
8975158 Method for permanently bonding wafers  
A method for bonding of a first contact surface of a first substrate to a second contact surface of a second substrate. The method comprises: forming at least one reservoir in at least one...
8975156 Method of sealing two plates with the formation of an ohmic contact therebetween  
A method of sealing a first wafer and a second wafer each made of semiconducting materials, including: implanting a metallic species in at least the first wafer, assembling the first wafer and the...
8975750 Electronic device  
In a conventional electronic device and a method of manufacturing the same, reduction in cost of the electronic device is hindered because resin used in an interconnect layer on the solder ball...
8975160 Manufacturing method for semiconductor device  
According to one embodiment, a first adhesive layer is formed on one major surface of a first substrate. The first substrate and a second substrate are adhered using a second adhesive layer that...
8975157 Carrier bonding and detaching processes for a semiconductor wafer  
The present invention provides a temporary carrier bonding and detaching process. A first surface of a semiconductor wafer is mounted on a first carrier by a first adhesive, and a first isolation...
8970045 Methods for fabrication of semiconductor structures including interposers with conductive vias, and related structures and devices  
Methods of fabricating semiconductor devices that include interposers include the formation of conductive vias through a material layer on a recoverable substrate. A carrier substrate is bonded...
8963293 High resistivity silicon-on-insulator substrate and method of forming  
A semiconductor structure and a method of forming the same. In one embodiment, a method of forming a silicon-on-insulator (SOI) wafer substrate includes: providing a handle substrate; forming a...
8962449 Methods for processing semiconductor devices  
Methods of forming a semiconductor structure include exposing a carrier substrate to a silane material to form a coating, removing a portion of the coating at least adjacent a periphery of the...
8962447 Bonded strained semiconductor with a desired surface orientation and conductance direction  
According to various method embodiments, a semiconductor layer is oriented to a substrate. The semiconductor layer has a surface orientation and is oriented to the substrate to provide a desired...
8963337 Thin wafer support assembly  
A semiconductor wafer assembly formed by bonding a support wafer to a thin wafer using a double-sided bonding release tape. The support wafer provides support for the thin target wafer such that...
8962358 Double substrate multi-junction light emitting diode array structure  
The present disclosure provides one embodiment of a light-emitting structure. The light-emitting structure includes a carrier substrate having first metal features; a transparent substrate having...
8962448 Computer readable medium encoded with a program for fabricating 3D integrated circuit device using interface wafer as permanent carrier  
A computer readable medium is provided that is encoded with a program comprising instructions for performing a method for fabricating a 3D integrated circuit structure. Provided are an interface...
8956952 Multilayer substrate structure and method of manufacturing the same  
A multilayer substrate structure comprises a substrate, a thermal matching layer formed on the substrate and a lattice matching layer above the thermal matching layer. The thermal matching layer...