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7622363 |
Semiconductor substrate, semiconductor device, light emitting diode and producing method therefor
A semiconductor substrate including a gallium arsenide layer is obtained by executing a step of preparing a first substrate having a separating layer constituted of germanium and a gallium arsenide...
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7622362 |
Method for manufacturing semiconductor device
According to the present invention, there is provided a method for manufacturing a semiconductor device that includes preparing a first semiconductor substrate and a second semiconductor substrate,...
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7622361 |
Method for manufacturing semiconductor device
It is an object of the invention to provide a peeling method which does not damage a peeling layer, and to perform peeling not only a peeling layer having a small-size area but also an entire...
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7622330 |
Semiconductor substrates having useful and transfer layers
A method of fabricating composite substrates by associating a plurality of transfer layers in spaced relation upon a single intermediate support; providing a support layer on each transfer layer to...
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7622324 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
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7615468 |
Methods for making substrates and substrates formed therefrom
A method for making substrates for use in optics, electronics, or opto-electronics. The method may include transferring a seed layer onto a receiving support and depositing a useful layer onto the...
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7615464 |
Transfer method with a treatment of a surface to be bonded
A method for minimizing or avoiding contamination of a receiving handle wafer during transfer of a thin layer from a donor wafer. This method includes one step of providing a donor wafer and a...
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7615462 |
Etch stop layer for silicon (Si) via etch in three-dimensional (3-D) wafer-to-wafer vertical stack
A method of forming a silicon (Si) via in vertically stacked wafers is provided with a contact plug extending from selected metallic lines of a top wafer and an etch stop layer formed prior to the...
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7614137 |
Method of manufacturing a magnetic slider head
Embodiments of the invention relate to manufacturing method of a magnetic head slider which flies stably even with a reduced peripheral speed resulting from a trend toward a magnetic disk having a...
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7608522 |
Method for fabricating a hybrid orientation substrate
A method for fabricating a hybrid orientation substrate includes steps of providing a direct silicon bonding (DSB) wafer having a first substrate with (100) crystalline orientation and a second...
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7608521 |
Producing SOI structure using high-purity ion shower
Disclosed are methods for making SOI and SOG structures using purified ion shower for implanting ions to the donor substrate. The purified ion shower provides expedient, efficient, low-cost and...
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7608520 |
Method for bonding substrate, bonded substrate, and direct bonded substrate
The present invention relates to a method for laminating substrates, including locating positioning a surface of a first substrate and a surface of a second substrate at positions close to each...
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7605058 |
Wafer dividing method
A wafer dividing method is provided that includes a protective plate sticking step of sticking the face of the wafer to the face of a protective plate by a pressure sensitive adhesive material...
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7605054 |
Method of forming a device wafer with recyclable support
A method for forming a device wafer with a recyclable support by providing a wafer having first and second surfaces, with at least the first surface of the wafer comprising a semiconductor material...
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7605053 |
Glass-based SOI structures
Semiconductor-on-insulator (SOI) structures, including large area SOI structures, are provided which have one or more regions composed of a layer of a substantially single-crystal semiconductor...
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7605052 |
Method of forming an integrated circuit having a device wafer with a diffused doped backside layer
A method for forming a diffused, doped backside layer on a device wafer oxide bonded to a handle wafer in an integrated circuit is provided. The method comprises forming a thermal bond oxide layer...
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7605051 |
Method for forming internal electrode pattern and method for manufacturing multilayer ceramic electronic component using same
A method for forming an internal electrode pattern having a predetermined shape includes the following: a step of forming a conductive layer by applying a metal paste on a first support, the metal...
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7605050 |
Method of bonding a polymer surface to a conducting or semiconducting surface and application of the same
The invention relates to a method of bonding a polymer surface to an electrically conductive or semiconductive surface, which method is characterized in that it comprises:
a) the...
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7605022 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
A method of fabricating a three-dimensional semiconductor device is provided along with a three-dimensional semiconductor device fabricated thereby. The method includes forming a heat conductive...
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7602046 |
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
The invention relates to a recyclable donor wafer that includes a substrate and a formed layer thereon, wherein the formed layer has a thickness sufficient to provide (a) at least two useful layers...
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7601613 |
Manufacturing method of bonded wafer
In a first ion implantation step (a1), a delamination-intended ion implantation layer 3 is formed by implanting ions at a dosage less than a critical dosage from the insulating film 2 side of a...
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7601612 |
Method for forming solder joints for a flip chip assembly
A method for forming a solder joint for a package arrangement with a dispersed Sn microstructure provides a flip chip on a package, with a flip chip having solder bumps to be connected by eutectic...
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7601611 |
Method of fabricating a semiconductor hetero-structure
A method of fabricating a structure that includes at least one semiconductor material for applications in microelectronics, optoelectronics or optics. The method includes transferring, onto a...
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7601236 |
Method of manufacturing display device
To provide a method of manufacturing a display device having an excellent impact resistance property with high yield, in particular, a method of manufacturing a display device having an optical...
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7598153 |
Method and structure for fabricating bonded substrate structures using thermal processing to remove oxygen species
A method for fabricating bonded substrate structures, e.g., silicon on silicon. In a specific embodiment, the method includes providing a thickness of single crystal silicon material transferred...
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7598152 |
Device and method for bonding wafers
The invention relates to a device and a corresponding method for bonding wafers along their corresponding surfaces.
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7598145 |
Method for producing Si1-yGey based zones with different contents in Ge on a same substrate by condensation of germanium
A method for producing a microelectronic device comprising a plurality of Si 1-y Ge y based semi-conductor zones (wherein 0<y≦1) that have different respective Germanium contents.
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7598099 |
Method of controlling a fabrication process using an iso-dense bias
Embodiments of controlling a fabrication process using an iso-dense bias are generally described herein. Other embodiments may be described and claimed.
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7595545 |
Anodic bonding apparatus, anodic bonding method, and method of producing acceleration sensor
An anodic bonding apparatus includes a first electrode and a second electrode. The first electrode has a first surface, and the second electrode has a second surface facing the first surface. The...
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7595223 |
Process for bonding and electrically connecting microsystems integrated in several distinct substrates
A process for bonding two distinct substrates that integrate microsystems, including the steps of forming micro-integrated devices in at least one of two substrates using micro-electronic...
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7592239 |
Flexible single-crystal film and method of manufacturing the same
The present invention relates to a flexible single-crystal film and a method of manufacturing the same from a single-crystal wafer. That is, the present invention can manufacture a...
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7588998 |
Method for producing a semiconductor element
A method for producing a semiconductor component, in particular a thin-film component, a semiconductor layer being separated from a substrate by irradiation with a laser beam having a plateaulike...
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7588997 |
Method of fabricating a thin film
A method of fabricating a thin film is disclosed. The method comprises: implanting ions by bombarding a face of a substrate comprising a semiconductor material to form a concentrated layer of the...
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7586154 |
Method for fabricating a substrate with useful layer on high resistivity support
A substrate suitable for producing a high frequency electronic circuit. This substrate includes a support substrate having a controlled amount of interstitial oxygen and which is treated to...
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7585748 |
Process for manufacturing a multilayer structure made from semiconducting materials
The invention relates to a process for manufacturing a multilayer structure made from semiconducting materials that include an active layer, a support layer and an electrically insulating layer...
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7585747 |
Low temperature hermetic bonding at water level and method of bonding for micro display application
A spatial light modulator is fabricated by bonding a capping layer over a wafer bearing active reflecting surfaces utilizing a low temperature bonding agent capable of providing a hermetic seal,...
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7582540 |
Method for manufacturing SOI wafer
This method for manufacturing an SOI wafer includes: a step of forming insulating films in a front surface and a mirror-polished rear surface of an active layer wafer; a step of removing the...
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7582513 |
Electronic device and method for producing electronic devices
One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the substrate, wherein the layer thickness...
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7579621 |
Integrated BST microwave tunable devices using buffer layer transfer method
A BST microwave device includes a single crystal oxide wafer. A silicon dioxide layer is formed on the single crystal oxide layer. A silicon substrate is bonded on the silicon dioxide layer. A BST...
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7579268 |
Method of manufacturing an integrated circuit
A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated chip, wherein the active faces of the...
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7579259 |
Simplified method of producing an epitaxially grown structure
Method to produce a structure consisting of depositing a material by columnar epitaxy on a crystalline face of a substrate ( 2 ), of continuing so that the columns ( 4 ) give a continuous layer ( 5...
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7579258 |
Semiconductor interconnect having adjacent reservoir for bonding and method for formation
A semiconductor device and method has interconnects with adjoining reservoir openings. A dielectric layer is formed as part of an uppermost of the one or more interconnect layers. Openings formed...
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7579257 |
Sample separating apparatus and method, and substrate manufacturing method
This invention is to provide a technique of separating bonded substrate stacks having porous layers at a high yield. A separating apparatus ( 100 ) has a pair of substrate holding portions ( 270,...
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7579229 |
Semiconductor device and semiconductor substrate
In order to provide a semiconductor device having a field effect transistor with a low power consumption and a high speed by use of the combination of Si and an element such as Ge, C or the like of...
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7578891 |
Adhesive bonding sheet, semiconductor device using the same, and method for manufacturing such semiconductor device
An adhesive bonding sheet having an optically transmitting supporting substrate and an adhesive bonding layer, and being used in both a dicing step and a semiconductor element adhesion step,...
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7575988 |
Method of fabricating a hybrid substrate
A method of fabricating a hybrid substrate by direct bonding of donor and receiver substrates where each substrate has a respective front face and surface, with the front face of the receiver...
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7572739 |
Tape removal in semiconductor structure fabrication
A semiconductor structure fabrication method for removing a tape physically attached to a device side of the semiconductor substrate by an adhesive layer of the tape, wherein the adhesive layer...
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7572649 |
Device transferring system, device transferring method, and display manufacturing method
A device transferring system includes a first substrate support portion on which to mount a first substrate, a second substrate support portion for supporting a second substrate opposed to the...
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7566632 |
Lock and key structure for three-dimensional chip connection and process thereof
A method positions a first wafer with respect to a second wafer such that key studs on the first wafer are fit (positioned) within lock openings in the second wafer. The key studs contact...
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7566631 |
Low temperature fusion bonding with high surface energy using a wet chemical treatment
Described is a wet chemical surface treatment involving NH 4 OH that enables extremely strong direct bonding of two wafer such as semiconductors (e.g., Si) to insulators (e.g., SiO 2 ) at low...
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