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7580176 |
Electrical characterization of interferometric modulators
Disclosed herein are methods and systems for testing the electrical characteristics of reflective displays, including interferometric modulator displays. In one embodiment, a controlled voltage is...
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7556970 |
Method of repairing damaged film having low dielectric constant, semiconductor device fabricating system and storage medium
A damaged layer repairing method repairs a damaged layer formed in a surface of a SiOCH film having a low dielectric constant film, containing silicon, carbon, oxygen and hydrogen and formed on a...
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7550381 |
Contact clean by remote plasma and repair of silicide surface
Method for recovering treated metal silicide surfaces or layers are provided. In at least one embodiment, a substrate having an at least partially oxidized metal silicide surface disposed thereon...
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7547561 |
Advanced process control model incorporating a target offset term
An advanced process control (APC) architecture comprising a process model that incorporates a target offset term is provided. The APC architecture may be applied to a so-called develop inspect...
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7547560 |
Defect identification system and method for repairing killer defects in semiconductor devices
A method for improving semiconductor yield by in-line repair of defects during manufacturing comprises inspecting dies on a wafer after a selected layer is formed on the dies, identifying defects...
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7544520 |
Method for the application of a protective coating to a thermally stressed component
A method for applying a heat insulation layer ( 11, 12, 13 ) or a metallic protective layer to a thermally stressed component ( 200 ) having a basic material ( 10 ) in order to eliminate local...
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7541595 |
Electromagnetic radiation detecting apparatus, radiation detecting apparatus, radiation detecting system and laser processing method
As to an electromagnetic radiation detecting apparatus, a radiation detecting apparatus, a radiation detecting system and a laser processing method, a TFT is disposed on an insulating substrate. A...
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7541200 |
Treatment of low k films with a silylating agent for damage repair
The present invention provides methods of repairing damage to low-k dielectric film that is incurred by commonly used processes in IC fabrication. The methods may be integrated into an IC...
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7507590 |
Method of manufacturing array substrate and method of manufacturing organic EL display device
The size of a foreign substance which is present between a cathode and an anode and which contributes to a short circuit therebetween is measured. On the basis of the measured size, the wavelength...
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7504345 |
Method for eliminating defects from semiconductor materials
Using a helium cryostat, the temperature for a substrate wafer(s) is reduced to 2.2 Kelvin over a period of twenty-four hours. Next, a soak segment will hold the temperature of the substrate wafer...
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7504267 |
Apparatus and method for cleaning glass substrates using a cool hydrogen flame
Contaminants from surfaces of temperature sensitive substrates, such as glass substrates are removed by exposing the surfaces to a hydrogen Surface-mixed diffusion flame for a predetermined...
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7477773 |
Method for inspecting a pattern and method for manufacturing a semiconductor chip having a circuit pattern
A method for inspecting a pattern includes measuring, in a first direction, a width of a reference pattern at plural positions in the reference patter; measuring, in a second direction, a width of...
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7476552 |
Method of reworking a semiconductor structure
The present invention allows correcting malfunctions occurring in the formation of a cap layer on an electrical element in a semiconductor substrate. It is detected whether a malfunction occurred...
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7470553 |
Built-in design edit structures
In an IC structure and method for debugging or adjusting the parameters of an IC circuitry, edit structures are formed in the IC device and are connected to desired portions of the IC circuitry buy...
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7469457 |
Method of removing integrated circuit chip package and detachment jig therefor
A detachment jig is placed on a printed circuit board. Advancement of an inclined surface of the detachment jig is received on a solder bump of solid state disposed between the printed circuit...
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7449348 |
Feedback control of imprint mask feature profile using scatterometry and spacer etchback
The present invention relates generally to photolithographic systems and methods, and more particularly to systems and methodologies that facilitate compensating for retrograde feature profiles on...
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7449347 |
Repairing method of a thin film transistor array
A repairing method of thin film transistor array is provided. The repairing method of thin film transistor array can remove a residue between pixel electrodes so as to prevent the residue from...
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7445944 |
Packaging substrate and manufacturing method thereof
A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units...
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7431624 |
Method of manufacturing organic EL element
A method of manufacturing an organic EL element includes applying a reverse bias to an organic EL element with an inverse layered structure until a current density of the organic EL element at an...
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7427516 |
Method for patching up thin-film transistor circuits on a display panel by local thin-film deposition
A method for patching up thin-film transistor (TFT) circuit patterns on a display panel comprises the following steps. Firstly, a mask having an opening is placed above the display panel and the...
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7410814 |
Process and apparatus for cleaning silicon wafers
An effective electropurge process and apparatus for wet processing of semiconductor wafers applies electrical charges to the wafer surface with an ample voltage sufficient to provide an effective...
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7410813 |
Method of parallel lapping a semiconductor die
In a lapping process for lapping away layers from a semiconductor device, where the region of interest is located near an edge or corner of the device, the method includes adding additional...
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7405088 |
Method for analyzing fail bit maps of waters and apparatus therefor
A failure analysis method according to the invention includes inputting the positions of failures in multiple wafers of an input device; preparing multiple sections in the multiple wafers;...
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7399646 |
Magnetic devices and techniques for formation thereof
Techniques for forming a magnetic device are provided. In one aspect, a method of forming a via hole self-aligned with a magnetic device comprises the following steps. A dielectric layer is formed...
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7374955 |
Method of manufacturing silicon wafer
The present invention provides a method of manufacturing a silicon wafer where a defect does not exist at a wafer surface layer part on which a device is formed, without affecting productivity and...
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7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film...
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7294440 |
Method to selectively correct critical dimension errors in the semiconductor industry
A method to correct critical dimension errors during a semiconductor manufacturing process. The method includes providing a first semiconductor device. The first semiconductor device is analyzed to...
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7288418 |
Process for treating substrates for the microelectronics industry, and substrates obtained by this process
A process for treating substrates for the microelectronics or optoelectronics industry, wherein the substrates include on at least one of their faces a working layer in which components are...
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7285428 |
Production method of electron source and image display
In a production method of an electron source wherein a plurality of electron-emitting devices are connected by and driven by matrix wirings, the upper wiring of the matrix wiring is partially...
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7279343 |
De-packaging process for small outline transistor packages
A method to de-packaging a semiconductor device to access and test the die within the package. The method involves initially removing molding compound from a first surface of the package to expose...
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7276385 |
Methods of laser repairing a circuit, compositions and equipment for such methods, and structures formed from such methods
Methods for repairing an electrical circuit; compositions, inks and equipment for making such repairs; and repair structures formed by the methods. The method generally includes the steps of: (a)...
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7258586 |
Method for manufacturing an organic electroluminescence display
When any of pixels is not lit in an organic EL display having an organic EL layer between a first electrode and a second electrode, an organic layer of the pixel is observed. If the organic layer...
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7236847 |
Systems and methods for closed loop defect reduction
Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An...
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7220604 |
Method and apparatus for repairing shape, and method for manufacturing semiconductor device using those
The invention relates to a method for enabling repair of a defect in a substrate, particularly the invention provides a method and apparatus for enabling repair of a pattern shape in a...
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7214548 |
Apparatus and method for flattening a warped substrate
A method, apparatus, and computer program product for flattening a warped substrate. The substrate is placed on a planar surface of a clamping apparatus in direct mechanical contact with the planar...
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7208325 |
Refreshing wafers having low-k dielectric materials
A low-k dielectric layer having a composition of silicon, oxygen and carbon is removed from a wafer. The low-k dielectric layer is removed by exposing a surface of the low-k dielectric layer to an...
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7193321 |
IC package, inspection method of IC package mounting body, repairing method of IC package mounting body, and inspection pin for IC package mounting body
Disclosed is an IC package including an interpose substrate and lands for external connection disposed on a face of the interpose substrate in a grid pattern, the interpose substrate having a...
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7192789 |
Method for monitoring an ion implanter
A method for monitoring an ion implanter is disclosed. In one embodiment, the method comprises providing a wafer, forming a barrier layer on the surface of the wafer wherein the barrier layer has a...
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7153709 |
Method and apparatus for calibrating degradable components using process state data
The present invention is generally directed to various methods and systems for calibrating degradable components using process state data. In one illustrative embodiment, the method includes...
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7148073 |
Methods and systems for preparing a copper containing substrate for analysis
Methods and systems for preparing a substrate for analysis are provided. One method includes removing a portion of a copper structure on the substrate using an etch chemistry in combination with an...
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7148072 |
Method and apparatus for oxidizing conductive redeposition in TMR sensors
A method and apparatus for oxidizing conductive redeposition in TMR sensors is disclosed. A TMR barrier layer is etched. Redeposition material is oxidized and the barrier is healed using an...
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7126232 |
Defect repair apparatus for an electronic device
A method is described for repairing failure points, regions or locations in an electronic device to have a perfect function when a semiconductor device including an LCD of other electronic device...
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7125729 |
Method for opening the plastic housing of an electronic module
In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a...
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7083991 |
Method of in-situ treatment of low-k films with a silylating agent after exposure to oxidizing environments
Method and apparatus for using a silylating agent after exposure to an oxidizing environment for repairing damage to low-k dielectric films are described. Plasma photoresist removal, or ashing, may...
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7067332 |
Method for die removal from plastic packages
A method for removing a die from a plastic package. The first step of the method is to remove the package's cap. Next, the package and the die within it are placed on a hot plate and heated up....
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7063987 |
Backside failure analysis of integrated circuits
Backside failure analysis of integrated circuits. In one embodiment, a method of preparing a device under test (DUT) for an image based diagnostic testing is disclosed. The method comprises...
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7045369 |
Method of fabricating and/or repairing a light emitting device
A method of repairing a light emitting device which makes high quality image display possible even if a pin hole is formed during formation of an EL layer is provided. The method of repairing a...
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7037732 |
Method and device for cutting wire formed on semiconductor substrate
Method and device for cutting a wire with a small number of processing operations. The method includes forming a cut portion by scanning the semiconductor substrate with a focused ion beam to cut...
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7029993 |
Method for treating substrates for microelectronics and substrates obtained according to said method
The invention relates to a method for treating substrates ( 50 ) for microelectronics or optoelectronics, whereby said substrates comprise a useful layer ( 52 ) on at least one of the surfaces...
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7029927 |
Method of repairing an integrated electronic circuit using a formed electrical isolation
A method of repairing a defect in an integrated electronic circuit caused by an incorrect lithographic mask includes the formation of an electrical isolation between two conducting parts of the...
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