|
Match
|
Document |
Document Title |
|
|
7622315 |
Tunable laser source with integrated optical modulator
A tunable laser source with integrated optical modulator. The tunable laser source is a widely tunable semiconductor laser that is comprised of an active region on top of a thick, low bandgap,...
|
|
|
7608471 |
Method and apparatus for integrating III-V semiconductor devices into silicon processes
Method and apparatus for fabricating semiconductor devices, for example, III-V semiconductor devices, having a desired substrate, for example, a silicon substrate. A method for fabricating...
|
|
|
7598154 |
Manufacturing method of semiconductor device
Size of a chipping is made small, suppressing blinding of a blade, when performing dicing of a wafer. When cutting a wafer, cutting is performed so that the portion of a V character-shaped...
|
|
|
7585689 |
Method for manufacturing semiconductor laser device and method for inspecting semiconductor laser bar
A method for manufacturing a semiconductor laser device in which a first conductivity type cladding layer, and active layer, a second conductivity type first cladding layer, and a second...
|
|
|
7579205 |
Method of fabricating light emitting device and thus-fabricated light emitting device
A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer...
|
|
|
7579202 |
Method for fabricating light emitting diode element
The present invention discloses a method for fabricating a light emitting diode element, which incorporates an epitaxial process with an etching process to etch LED epitaxial layers bottom up and...
|
|
|
7572657 |
Method for fabrication of semiconductor light-emitting device and the device fabricated by the method
A method for producing a semiconductor light-emitting device includes stacking at least a first conductive type semiconductor layer ( 2 ), an active layer ( 3 ) and a second conductive type...
|
|
|
7571538 |
Vacuum fixing jig for semiconductor device
The present invention relates to a Jig and method of manufacturing a semiconductor substrate including the back grind step, the dicing step, the pick up step, and the die bonding step of the wafer;...
|
|
|
7569409 |
Isolation structures for CMOS image sensor chip scale packages
Isolation structure for CMOS image sensor device chip scale packages and fabrication methods thereof. A CMOS image sensor chip scale package includes a transparent substrate configured as a support...
|
|
|
7556975 |
Method for manufacturing backside-illuminated optical sensor
A CCD portion 3 is formed on a front surface side of a semiconductor substrate 1 . A region of a back surface side of semiconductor substrate 1 that corresponds to CCD portion 3 is thinned...
|
|
|
7547572 |
Method of protecting semiconductor chips from mechanical and ESD damage during handling
A method and apparatus are provided for protecting a semiconductor device from damage. The method includes the steps of providing a active semiconductor device on a surface of the semiconductor...
|
|
|
7544265 |
Method of fabricating a release substrate
The invention relates to a method of fabricating a release substrate produced from semiconductor materials, the method comprising creating a reversible connection between two substrate release...
|
|
|
7514280 |
Method for packaging organic light emitting display with frit seal and reinforcing structure
Disclosed is a method for packaging an organic light emitting display having a reinforcing member between a first substrate and a second substrate by rolling a roll retaining a curable material on...
|
|
|
7510898 |
Method of manufacturing image display device and method of dividing device
A manufacturing method of manufacturing an image display device having a wiring and a display element electrically connected to the wiring, comprising a step of dividing a device having the wiring...
|
|
|
7491580 |
Method of manufacturing electro-optical device
There is provided a method of manufacturing an electro-optical device from a large substrate that is cut into a plurality of first substrates having a chip shape. In the electro-optical device,...
|
|
|
7485548 |
Die loss estimation using universal in-line metric (UILM)
A system predicts die loss for a semiconductor wafer by using a method referred to as universal in-line metric (UILM). A wafer inspection tool detects defects on the wafer and identifies the...
|
|
|
7479399 |
System and method for providing automated sample preparation for plan view transmission electron microscopy
A system and method is described for providing automated sample preparation for plan view transmission electron microscopy. A sample wafer is microcleaved from a semiconductor wafer and mounted on...
|
|
|
7456035 |
Flip chip light emitting diode devices having thinned or removed substrates
In a method for fabricating a flip-chip light emitting diode device, epitaxial layers ( 14, 114 ) are deposited on a growth substrate ( 16, 116 ) to produce an epitaxial wafer. A plurality of light...
|
|
|
7452739 |
Method of separating semiconductor dies
A method for the separation of multiple dies during semiconductor fabrication is described. On an upper surface of a semiconductor wafer containing multiple dies, metal layers are deposited...
|
|
|
7451539 |
Method of making a conformal electromagnetic interference shield
An electromagnetic shield for an electronic module includes a surface finish that is applied to the surface of an electronic module so as to minimize the size of the shield. Once the shield is in...
|
|
|
7443096 |
Organic electroluminescent device, method of manufacturing the same, and electronic apparatus
An organic electroluminescent (EL) device reduces or suppresses display irregularities and enhances or improves display characteristics, when a large-sized organic EL device is formed by bonding...
|
|
|
7439162 |
Method of dividing wafer into individual devices after forming a recessed portion of the wafer and making thickness of wafer uniform
The present invention grinds the rear surface side of a device area to form a recessed portion and an annular reinforcement part on the outer periphery of the recessed portion, removes the annular...
|
|
|
7435607 |
Method of wafer laser processing using a gas permeable protective tape
A laser processing method for forming a deteriorated layer, which has been once molten and then re-solidified, in the inside of a wafer by applying a pulse laser beam capable of passing through the...
|
|
|
7432119 |
Light emitting diode with conducting metal substrate
Systems and methods for fabricating a light emitting diode include forming a multilayer epitaxial structure above a carrier substrate; depositing at least one metal layer above the multilayer...
|
|
|
7427526 |
Deposited thin films and their use in separation and sacrificial layer applications
This invention uses large surface to volume ratio materials for separation, release layer, and sacrificial material applications. The invention outlines the material concept, application designs,...
|
|
|
7413965 |
Method of manufacturing a thin-film circuit substrate having penetrating structure, and protecting adhesive tape
A method of manufacturing a thin-film circuit substrate, containing: (a) gouging a surface of a circuit substrate in a depth at least approximately equal to a thickness of a final product of the...
|
|
|
7405138 |
Manufacturing method of stack-type semiconductor device
A semiconductor device capable mounting semiconductor elements having different functions without increasing the area of the semiconductor device, and its manufacturing method are presented. A part...
|
|
|
7405095 |
Method for producing color-wheel segments
A method for producing from a plate-shaped substrate circular sections for use for instance in a color wheel encompasses inter alia such steps as positioning predefined edge break lines in such...
|
|
|
7399682 |
Wafer processing method
A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined...
|
|
|
7396780 |
Method for laser processing of wafer
A method of carrying out the laser processing of a wafer with a laser beam processing machine comprising a chuck table for holding a wafer, a laser beam application means for applying a laser beam...
|
|
|
7393770 |
Backside method for fabricating semiconductor components with conductive interconnects
A backside method for fabricating a semiconductor component with a conductive interconnect includes the step of providing a semiconductor substrate having a circuit side, a backside, and a...
|
|
|
7387951 |
Method of dicing semiconductor wafer into chips, and apparatus using this method
The invention relates to a semiconductor wafer dicing method of dicing a semiconductor wafer along parting lines into chips. The semiconductor wafer in which parting lines along which the...
|
|
|
7384811 |
Method of separating semiconductor wafer, and separating apparatus using the same
With respect to a work obtained by joining a semiconductor wafer and a supporting member to each other via a both-faced adhesive sheet having heating separability, the surface of the supporting...
|
|
|
7364930 |
Method for producing micromechanical and micro-optic components consisting of glass-type materials
What is proposed here is a method of structuring surfaces of glass-type materials and variants of this method, comprising the following steps of operation: providing a semiconductor substrate,...
|
|
|
7358156 |
Compound semiconductor device and method of manufacturing the same
A method of manufacturing a compound semiconductor device comprises forming a scribed groove extending from an edge of a major surface of a laminated body to an internal region on the first major...
|
|
|
7348193 |
Hermetic seals for micro-electromechanical system devices
The invention is directed to a hermetically sealed device and a method for making such device. The device includes optical, micro-electromechanical, electronic and opto-electronic devices, having a...
|
|
|
7326590 |
Method for manufacturing ball grid array package
A method for manufacturing a ball grid array package includes the steps of providing a substrate strip having a plurality of sub-substrate strips wherein each has an upper surface and a lower...
|
|
|
7316937 |
Method for manufacturing a solid-state image sensing device, such as a CCD
Light detecting elements are formed in areas marked off by scribe lines on a semiconductor substrate, and color filters are deposited in such a manner as to cover the formed areas of the light...
|
|
|
7303932 |
Support body for semiconductor element, method for manufacturing the same and semiconductor device
A semiconductor device comprises a semiconductor element and a support body made of a stack of ceramic layers having a recess in which electrical conductors are electrically connected with the...
|
|
|
7297950 |
Transmission electron microscope specimen and method of manufacturing the same
A transmission electron microscope (TEM) specimen and a method of manufacturing the specimen are provided. The specimen comprises an analysis point. The specimen is formed by forming a dimple at a...
|
|
|
7297566 |
Method for producing a display unit
A display device is formed by burying at least part of a light emitting device in an insulating material, wherein a drive electrode for the light emitting device is formed so as to be extracted on...
|
|
|
7291510 |
Method for manufacturing semiconductor device
The inventive method for manufacturing a semiconductor device is a method for manufacturing a semiconductor device using irradiation with laser light to partition a substrate having semiconductor...
|
|
|
7291509 |
Method for fabricating a plurality of semiconductor chips
A semiconductor material ( 5 ) is grown in the windows ( 4 ) of a patterned mask layer ( 3 ) on a substrate ( 1 ). The semiconductor material ( 5 ) grows together over the mask layer ( 3 ) with...
|
|
|
7285811 |
MRAM device for preventing electrical shorts during fabrication
The present invention provides an MRAM cell which minimizes the occurrence of electrical shorts during fabrication. A first conductor is provided in a trench in an insulating layer and an upper...
|
|
|
7285436 |
Method of manufacturing a semiconductor light-emitting device
A semiconductor light-emitting device exhibits high reflectance even with less number of pairs of light-reflecting layers, and allows light emitted from the active layer to be effectively extracted...
|
|
|
7285431 |
Method for manufacturing a GaN based LED of a black hole structure
This invention relates to a method for manufacturing a GaN based LED of a back hole structure, and the method comprises: epitaxially growing an N type GaN layer, a multi-quantum wells emitting...
|
|
|
7280715 |
Formation of cleaved grooves in a passivation layer formed over a surface of a wafer prior to wafer singulation
Cleaved grooves, also referred to herein as “cleave streets”, are formed exclusively in a wafer passivation layer overlaying a wafer to provide for correctly aligned and sharp cleaves prior to...
|
|
|
7265032 |
Protective layer during scribing
A method including forming a chemically soluble coating on a plurality exposed contacts on a surface of a circuit substrate; scribing the surface of the substrate along scribe areas; and after...
|
|
|
7256108 |
Method for reducing semiconductor die warpage
An anti-warpage backgrinding tape ( 11 ) is secured to the circuit side ( 12 ) of a semiconductor wafer ( 14 ). The backside ( 16 ) of the wafer is background. The backside of the wafer is secured...
|
|
|
7247509 |
Method for manufacturing solid-state imaging devices
A solid-state imaging device is manufactured according to the steps below. A lattice-shaped rib forming member, which is an aggregation of a plurality of frame-shaped ribs for configuring a...
|