|
Match
|
Document |
Document Title |
|
|
7622357 |
Semiconductor device structures with backside contacts for improved heat dissipation and reduced parasitic resistance
The present invention relates to a device structure that comprises a substrate with front and back surfaces, and at least one semiconductor device with a first conductive structure located in the...
|
|
|
7618871 |
Method for the production of a bipolar transistor comprising an improved base terminal
For the production of an improved bipolar transistor comprising a low-resistance base terminal, a dielectric layer is deposited over the semiconductor substrate and is highly doped via an...
|
|
|
7615455 |
Integrated circuit bipolar transistor
A bipolar transistor having a base region resting by its lower surface on a collector region and surrounded with a first insulating layer, a base contact conductive region in contact with an...
|
|
|
7611953 |
Bipolar transistor with isolation and direct contacts
A bipolar transistor has a collector that is contacted directly beneath a base-collector junction by metallization to reduce collector resistance. A conventional reach-through and buried layer, as...
|
|
|
7605046 |
Active matrix structure for a display device and method for its manufacture
The invention relates to an active matrix structure and method for manufacturing the active matrix structure for a display device, wherein the structure includes: providing a matrix substrate with...
|
|
|
7598148 |
Non-self-aligned heterojunction bipolar transistor and a method for preparing a non-self-aligned heterojunction bipolar transistor
The present invention refers to a method for preparing a non-self-aligned heterojunction bipolar transistor comprising: preparing a patterned emitter metal on an emitter epi layer of a HBT epi...
|
|
|
7595249 |
Bipolar transistors with vertical structures
A method for fabricating a bipolar transistor includes forming a vertical sequence of semiconductor layers, forming an implant mask on the last formed semiconductor layer, and implanting dopant...
|
|
|
7579230 |
High voltage BICMOS device and method for manufacturing the same
A high voltage BICMOS device and a method for manufacturing the same, which may improve the reliability of the device by securing a distance between adjacent DUF regions, are provided. The high...
|
|
|
7564117 |
Bipolar transistor having variable value emitter ballast resistors
Methods of forming and structures of a relatively large bipolar transistor is provided. The method includes forming a collector in a semiconductor region. Forming a base contiguous with a portion...
|
|
|
7563685 |
Bipolar-transistor and method for the production of a bipolar-transistor
The invention relates to NPN and PNP bipolar transistors and to a method for the production thereof, said transistors being characterised by a particularly high collector-emitter and collector-base...
|
|
|
7550790 |
D/A conversion circuit and semiconductor device
A D/A conversion circuit with a small area is provided. In the D/A conversion circuit, according to a digital signal transmitted from address lines of an address decoder, one of four gradation...
|
|
|
7544572 |
Multi-operational mode transistor with multiple-channel device structure
A multiple operating mode transistor is provided in which multiple channels having different respective operational characteristics are employed. Multiple channels have threshold voltages that are...
|
|
|
7541248 |
Integrated semiconductor device and method of manufacturing thereof
An integrated semiconductor device containing semiconductor elements that have respective desired on-resistances and breakdown voltages achieves appropriate characteristics as a whole of the...
|
|
|
7538395 |
Method of forming low capacitance ESD device and structure therefor
In one embodiment, the ESD device uses highly doped P and N regions deep within the ESD device to form a zener diode that has a controlled breakdown voltage.
|
|
|
7521328 |
Methods of fabricating bipolar transistor with emitter and collector in separate device isolation trenches
A bipolar transistor and method of fabricating the same is disclosed. Particularly, a bipolar transistor may have an emitter and a collector diffusion layer in the sidewalls and the bottom of a...
|
|
|
7521327 |
High fT and fmax bipolar transistor and method of making same
A high f T and f max bipolar transistor includes an emitter, a base, and a collector. The emitter has a lower portion and an upper portion that extends beyond the lower portion. The base includes...
|
|
|
7517768 |
Method for fabricating a heterojunction bipolar transistor
A bipolar transistor with a SiGe:C film and a seed layer forming beneath the SiGe:C film and methods of making same. The method includes placing a substrate in a reactor chamber and introducing a...
|
|
|
7494887 |
Method and apparatus for fabricating heterojunction bipolar transistors with simultaneous low base resistance and short base transit time
A method for fabricating heterojunction bipolar transistors that exhibit simultaneous low base resistance and short base transit times, which translate into semiconductor devices with low power...
|
|
|
7492011 |
Semiconductor device and manufacturing method of semiconductor device
To present a semiconductor device mounting ESD protective device appropriately applicable to transistors mutually different in dielectric strength, and its manufacturing method. The semiconductor...
|
|
|
7488662 |
Self-aligned vertical PNP transistor for high performance SiGe CBiCMOS process
A structure and a process for a self-aligned vertical PNP transistor for high performance SiGe CBiCMOS process. Embodiments include SiGe CBiCMOS with high-performance SiGe NPN transistors and PNP...
|
|
|
7485537 |
Method of fabricating a vertical bipolar transistor with a majority carrier accumulation layer as a subcollector for SOI BiCMOS with reduced buried oxide thickness
The present invention provides a a method of fabricating bipolar junction transistors (BJTs) on selected areas of a very thin buried oxide (BOX) using a conventional silicon-on-insulator (SOI)...
|
|
|
7485486 |
Photodiode for multiple wavelength operation
A method of a fabricating a multiple wavelength adapted photodiode and resulting photodiode includes the steps of providing a substrate having a first semiconductor type surface region on at least...
|
|
|
7473610 |
Local collector implant structure for heterojunction bipolar transistors and method of forming the same
A method of forming a heterojunction bipolar transistor (HBT) device is disclosed. The method includes forming an intrinsic base layer over a collector layer; forming a sacrificial block structure...
|
|
|
7473609 |
Surface treatment in preparation for contact placement
A contact is formed on indium-phosphide material. Regions of the indium-phosphide material are exposed. An energetic bombardment is performed on exposed regions of the indium-phosphide material....
|
|
|
7470594 |
System and method for controlling the formation of an interfacial oxide layer in a polysilicon emitter transistor
A method is disclosed for controlling the formation of an interfacial oxide layer in a polysilicon emitter transistor device. The interfacial oxide layer is formed between an underlying substrate...
|
|
|
7470558 |
Method for manufacturing solid-state imaging device, and solid-state imaging device
A method for manufacturing a solid-state imaging device, comprising: a step of forming an imaging portion comprising a photoelectric conversion portion and a charge transfer portion that transfers...
|
|
|
7462546 |
Collector tailored structures for integration of binary junction transistors
A bipolar transistor is formed in an integrated BiCMOS process. A buried layer is formed in a semiconductor body. An intrinsic dilute mask is formed over the buried layer that covers at least a...
|
|
|
7459368 |
Method for manufacturing integrated circuits having silicon-germanium heterobipolar transistors
Method for manufacturing integrated circuits having silicon-germanium heterobipolar transistors, wherein a collector semiconductor region is created, an etch stop layer is created on a connection...
|
|
|
7459367 |
Method of forming a vertical P-N junction device
A P-N junction device and method of forming the same are disclosed. The P-N junction device may include a P-N diode, a PiN diode or a thyristor. The P-N junction device may have a monocrystalline...
|
|
|
7456070 |
Method of fabricating a bipolar transistor with high breakdown voltage collector
A method of fabricating a transistor that includes a doped buried region within a semiconductor body. The doped buried region includes a portion having a first thickness and a second thickness, the...
|
|
|
7449388 |
Method for forming multiple doping level bipolar junctions transistors
A process for forming bipolar junction transistors having a plurality of different collector doping densities on a semiconductor substrate and an integrated circuit comprising bipolar junction...
|
|
|
7446009 |
Manufacturing method for semiconductor device
A semiconductor device manufacturing method including forming a conductive layer and a silicon film on a semiconductor substrate including an active region, forming an emitter electrode containing...
|
|
|
7442617 |
Method for manufacturing bipolar transistor
A method for manufacturing a bipolar transistor comprising: forming a device isolation layer in a device isolation region of a semiconductor substrate having therein first and second well regions...
|
|
|
7442616 |
Method of manufacturing a bipolar transistor and bipolar transistor thereof
A bipolar transistor ( 100 ) is manufactured using the following processes: (a) forming a base electrode layer ( 129 ) as a portion of a base electrode over a semiconductor substrate ( 110 ); (b)...
|
|
|
7439608 |
Symmetric bipolar junction transistor design for deep sub-micron fabrication processes
Described herein are embodiments of a bipolar junction transistor including a plurality of base terminal rings having an emitter terminal ring between any two base terminal rings of the plurality...
|
|
|
7432169 |
Method for manufacturing semiconductor device
An excessive etch in the conventional manufacturing process causes a roughened surface of a contact bottom, resulting in an increased variation in characteristics of semiconductor devices. A...
|
|
|
7422952 |
Method of forming a BJT with ESD self protection
A ballasting region is placed between the base region and the collector contact of a bipolar junction transistor to relocate a hot spot away from the collector contact of the transistor. Relocating...
|
|
|
7422951 |
Method of fabricating self-aligned bipolar transistor
The present invention provides a method of fabricating a self-aligned bipolar transistor, by which the fabricating method can be simplified by forming P+ and N+ junctions by self-alignment and by...
|
|
|
7414298 |
Super self-aligned collector device for mono-and hetero bipolar junction transistors, and method of making same
The invention relates to a process of forming a compact bipolar junction transistor (BJT) that includes forming a self-aligned collector tap adjacent the emitter stack and an isolation structure. A...
|
|
|
7387918 |
Method of forming a silicon controlled rectifier structure with improved punch through resistance
When a high-voltage, such as from an ESD pulse, is placed across a silicon controlled rectifier, which includes an NPN transistor and a PNP transistor that is connected to the NPN transistor, the...
|
|
|
7371650 |
Method for producing a transistor structure
A method for fabricating a transistor structure with a first and a second bipolar transistor having different collector widths is presented. The method includes providing a semiconductor substrate,...
|
|
|
7354840 |
Method for opto-electronic integration on a SOI substrate
According to an exemplary embodiment, a method includes providing a silicon-on-insulator substrate including a buried oxide layer situated over a bulk silicon substrate and a silicon layer situated...
|
|
|
7341920 |
Method for forming a bipolar transistor device with self-aligned raised extrinsic base
Disclosed are embodiments of a method of fabricating a bipolar transistor with a self-aligned raised extrinsic base. In the method a dielectric pad is formed on a substrate with a minimum dimension...
|
|
|
7329620 |
System and method for providing an integrated circuit having increased radiation hardness and reliability
A system and method is disclosed for providing an integrated circuit that has increased radiation hardness and reliability. A device active area of an integrated circuit is provided and a layer of...
|
|
|
7323390 |
Semiconductor device and method for production thereof
The semiconductor device according to the invention includes a substrate, a field insulating region which delimits an active region of the semiconductor substrate, a collector, at least one...
|
|
|
7319251 |
Bipolar transistor
A bipolar transistor formed in a substrate includes a collector, a base layer above the collector, where the base layer includes a base that is monocrystalline, and an emitter layer that is...
|
|
|
7314791 |
Bipolar transistor for an integrated circuit having variable value emitter ballast resistors
An integrated circuit including a bipolar transistor with improved forward second breakdown is disclosed. In one embodiment, the bipolar transistor includes a base, a collector, a plurality of...
|
|
|
7303968 |
Semiconductor device and method having multiple subcollectors formed on a common wafer
A semiconductor device and a method of fabricating a semiconductor device having multiple subcollectors which are formed in a common wafer, in order to provide multiple structures having different...
|
|
|
7301203 |
Superjunction semiconductor device
In accordance with an embodiment of the invention, a superjunction semiconductor device includes an active region and a termination region surrounding the active region. A central vertical axis of...
|
|
|
7297993 |
Bipolar transistor and fabrication method of the same
A bipolar transistor having a base electrode of an air bridge structure is simplified in structure and enhanced in the degree of freedom of a contact position of a base wiring line with the base...
|