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7622353 |
Method for forming recessed gate structure with stepped profile
Disclosed herein are a recess-gate structure in which junctions have a thickness significantly smaller than the thickness of a device isolation layer to thereby prevent shorting of the junctions...
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7618869 |
Manufacturing method for increasing product yield of memory devices suffering from source/drain junction leakage
A DRAM device includes contact pads having a bottom in contact with a corresponding source/drain region 21 and a top in contact with a bottom of an overlying contact plug. The source/drain region...
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7611951 |
Method of fabricating MOS transistor having epitaxial region
Example embodiments relate to a method of manufacturing a semiconductor device. Other example embodiments relate to a method of manufacturing a metal-oxide-semiconductor (MOS) transistor having an...
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7608512 |
Integrated circuit structure with improved LDMOS design
A semiconductor integrated circuit including an LDMOS device structure comprises a semiconductor layer with a pair of spaced-apart field effect gate structures over an upper surface of the...
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7605045 |
Field effect transistors and methods for fabricating the same
Field effect transistors and methods for fabricating field effect transistors are provided. A method, in accordance with an exemplary embodiment of the invention, comprises forming a...
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7605038 |
Semiconductor device and manufacturing method thereof
A high voltage semiconductor deice and a manufacturing method thereof are provided. The high voltage semiconductor device comprises: second conductive type drift regions disposed spaced from each...
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7602014 |
Superjunction power MOSFET
An embodiment of an MOS device includes a semiconductor substrate of a first conductivity type, a first region of the first conductivity type having a length L acc and a net active dopant...
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7601635 |
Method of manufacturing a semiconductor device
For improving the reliability of a semiconductor device having a stacked structure of a polycrystalline silicon film and a tungsten silicide film, the device is manufactured by forming a...
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7601599 |
Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device includes the steps of (a) forming a first insulating film pattern, which has a first portion and a second portion separated from the first portion...
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7601598 |
Reverse metal process for creating a metal silicide transistor gate structure
The present invention teaches a method of forming a MOSFET transistor having a silicide gate which is not subject to problems produced by etching a metal containing layer when forming the gate...
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7598147 |
Method of forming CMOS with Si:C source/drain by laser melting and recrystallization
A method of forming crystalline Si:C in source and drain regions is provided. After formation of shallow trench isolation and gate electrodes of field effect transistors, gate spacers are formed on...
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7598146 |
Self-aligned gate and method
A semiconductor structure comprises a silicon substrate of a first conductivity type including wells of a second conductivity type formed on a surface thereof. The wells may be laterally isolated...
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7585720 |
Dual stress liner device and method
A dual stress liner manufacturing method and device is described. Overlapping stress liner layers of opposite effect (e.g., tensile versus compression) may be deposited over portions of the device,...
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7582520 |
Method of fabricating complementary metal-oxide-semiconductor transistor and metal-oxide-semiconductor transistor
A method of fabricating a metal-oxide-semiconductor transistor is provided. A first gate structure and a second gate structure are formed on a substrate. The first gate structure has a dimension...
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7579246 |
Semiconductor device manufacturing method including oblique ion implantation process and reticle pattern forming method
An active region and an opposite conductivity active region are formed in a semiconductor substrate. The opposite conductivity active region is covered with a resist pattern. Impurities are...
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7572706 |
Source/drain stressor and method therefor
A method for forming a semiconductor device is provided. The method includes forming a gate structure overlying a substrate. The method further includes forming a sidewall spacer adjacent to the...
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7572697 |
Method of manufacturing flash memory device
A method of manufacturing flash memory devices wherein, after gate lines are formed, an HDP oxide film having at least the same height as that of a floating gate is formed between the gate lines....
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7569444 |
Transistor and method for manufacturing thereof
A transistor includes a gate insulating layer over a semiconductor substrate; a first insulating layer on both sides of the gate insulating layer; first spacers over the first insulating layer and...
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7557022 |
Implantation of carbon and/or fluorine in NMOS fabrication
Formation of an NMOS transistor is disclosed, where at least one of carbon, atomic fluorine and molecular fluorine (F 2 ) are combined with implantations of at least one of arsenic, phosphorous and...
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7544556 |
Process for forming CMOS devices using removable spacers
A process for forming CMOS devices is disclosed in which disposable spacers are used to obtain a structure having improved gap-fill characteristics. First, gate film stacks are formed on the...
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7544553 |
Integration scheme for fully silicided gate
To form a semiconductor device, a silicon (e.g., polysilicon) gate layer is formed over a gate dielectric and a sacrificial layer (preferably titanium nitride) is formed over the silicon gate...
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7541210 |
Method for fabricating CMOS image sensor
A CMOS image sensor and a method for fabricating the same are disclosed, in which transfer characteristics are improved. The method includes forming a photodiode region and a second conductive type...
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7534707 |
MOS Transistors having inverted T-shaped gate electrodes and fabrication methods thereof
MOS transistors have an active region defined in a portion of a semiconductor substrate, a gate electrode on the active region, and drain and source regions in the substrate. First and second...
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7524715 |
Memory cell transistor having different source/drain junction profiles connected to DC node and BC node and manufacturing method thereof
A memory cell transistor of a DRAM device is provided. A gate stack pattern is formed on a semiconductor substrate. A DC node and a BC node are formed substantially under lateral sides of the gate...
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7524682 |
Method for monitoring temperature in thermal process
A method for monitoring a temperature in a thermal process is described. A monitor substrate is provided and subject to ion implantation, and a characteristic parameter of the monitor substrate...
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7514332 |
Semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor device includes the steps of (a) forming a first region by selectively ion-implanting a second conductive type impurity into a first conductive type...
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7510955 |
Method of fabricating multi-fin field effect transistor
A multi-fin field effect transistor includes a substrate, an oxide layer, a conductive layer, a gate oxide layer, and a doped region is provided. The substrate is surrounded by a trench, and there...
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7504309 |
Pre-silicide spacer removal
A method forms a gate conductor over a substrate, and simultaneously forms spacers on sides of the gate conductor and a gate cap on the top of the gate conductor. Isolation regions are formed in...
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7504293 |
Fabrication method for semiconductor device
A fabrication method for a semiconductor device includes a step of forming a gate insulating film on a semiconductor layer, and a step of forming a first gate electrode layer on the gate insulating...
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7501322 |
Methods of forming non-volatile memory devices having trenches
A semiconductor memory device includes a semiconductor substrate having a trench therein. First and second gate patterns are formed on a surface of the substrate adjacent the trench, a respective...
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7494885 |
Disposable spacer process for field effect transistor fabrication
According to one exemplary embodiment, a method for forming a field effect transistor on a substrate comprises a step of forming disposable spacers adjacent to a gate stack situated on the...
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7491616 |
Method of manufacturing a semiconductor device including dopant introduction
The invention relates to a method of manufacturing a semiconductor device ( 10 ) in which a semiconductor body ( 1 ) of silicon is provided, at a surface thereof, with a semiconductor region ( 4 )...
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7485905 |
Electrostatic discharge protection device
An electrostatic discharge protection device comprising a multi-finger gate, a first lightly doped region of a second conductivity, a first heavily doped region of the second conductivity, and a...
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7485536 |
Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers
A method including forming a channel region between source and drain regions in a substrate, the channel region including a first dopant profile; and forming a barrier layer between the channel...
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7482212 |
Semiconductor device and manufacturing method thereof
A method of manufacturing a semiconductor device including forming a trench on a first surface of a silicon substrate, forming a thermal oxide layer and a deposited oxide layer on the trench and...
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7473608 |
N-channel MOSFETs comprising dual stressors, and methods for forming the same
The present invention relates to a semiconductor device comprising at least one n-channel field effect transistor (n-FET). Specifically, the n-FET comprises first and second patterned stressor...
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7473607 |
Method of manufacturing a multi-workfunction gates for a CMOS circuit
A method of manufacturing a device includes doping a low voltage threshold area and a high voltage threshold area. Gate structures are formed over the low voltage threshold and high voltage...
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7468305 |
Forming pocket and LDD regions using separate masks
A method of decoupling the formation of LDD and pocket regions is provided. The method includes providing a semiconductor chip including active regions, forming gate structures in the active...
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7468303 |
Semiconductor device and manufacturing method thereof
Junction leakage in a medium voltage MOS transistor having a silicide structure is prevented. A titanium layer is formed by sputtering titanium over the entire surface of a semiconductor substrate....
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7462539 |
Direct tunneling memory with separated transistor and tunnel areas
A semiconductor device has: an isolation region formed on a semiconductor substrate and defining a continuous active region including a select transistor region and a direct tunnel element region;...
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7456062 |
Method of forming a semiconductor device
A sidewall spacer structure is formed adjacent to a gate structure whereby a material forming an outer surface of the sidewall spacer structure contains nitrogen. Subsequent to its formation the...
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7452780 |
Method of forming a stable transistor by dual source/drain implantation
A method of forming a transistor includes: forming a gate oxide layer and a gate polysilicon layer on a silicon substrate; forming low-energy ion implantation regions in the silicon substrate and...
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7449386 |
Manufacturing method for semiconductor device to mitigate short channel effects
A method of manufacturing a plurality of MOS transistors includes forming gate structures in first and second regions on a substrate and forming mask portions only between adjacent drain sides of...
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7446004 |
Method for reducing overlap capacitance in field effect transistors
A field effect transistor (FET) device includes a gate conductor formed over a semiconductor substrate, a source region having a source extension that overlaps and extends under the gate conductor,...
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7442602 |
Methods of fabricating phase change memory cells having a cell diode and a bottom electrode self-aligned with each other
Integrated circuit devices are provided having a vertical diode therein. The devices include an integrated circuit substrate and an insulating layer on the integrated circuit substrate. A contact...
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7439123 |
Low resistance contact semiconductor device structure
A method for making a semiconductor device structure includes producing a substrate having formed thereon a gate with spacers, respective source and drain regions adjacent to the gate and an;...
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7432168 |
Method for fabricating semiconductor device with thin gate spacer
A method for fabricating a transistor. A substrate having a gate electrode thereon and insulated therefrom is provided. A first gate spacer with a first dielectric material is formed on the...
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7432146 |
Semiconductor device and manufacturing method thereof
To make it possible to obtain a sharp impurity profile without presenting a disadvantage such as an increase in parasitic resistance or the like using a laser annealing method to thereby meet...
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7411245 |
Spacer barrier structure to prevent spacer voids and method for forming the same
A semiconductor device includes a spacer adjacent a gate structure. A protection layer covers oxide portions of the spacer surface such that subsequent manufacturing operations such as wet oxide...
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7410876 |
Methodology to reduce SOI floating-body effect
A method for making a semiconductor device, comprising (a) providing a structure comprising a gate electrode ( 207 ) disposed on a substrate ( 203 ); (b) creating first ( 213 ) and second ( 214 )...
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