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7101764 |
High-voltage transistor and fabrication process
A high-voltage transistor and fabrication process in which the fabrication of the high-voltage transistor can be readily integrated into a conventional CMOS fabrication process. The high-voltage...
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7098111 |
Manufacturing method of semiconductor integrated circuit device
A manufacturing technology of a MOSFET having a shallow junction and a source and drain of a low resistance is provided. After having ion-implanted an As on the surface of a p type well forming a...
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7094642 |
Method of fabricating semiconductor device
An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region ( 3 ), and one...
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7094652 |
Semiconductor device and method of manufacturing the same
Disclosed is a semiconductor device comprising a first transistor and a second transistor formed on a semiconductor substrate, wherein a gate side wall of the second transistor has a thickness...
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7094654 |
Manufacture of electronic devices comprising thin-film transistors
A method of manufacturing an electronic device including a thin film transistor comprises forming a semiconductor film over an insulating substrate; depositing a first masking layer over the...
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7091098 |
Semiconductor device with spacer having batch and non-batch layers
A semiconductor device including a gate stack located over a substrate and a spacer located over the substrate and adjacent the gate stack. The spacer includes a plurality of layers, wherein at...
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7091097 |
End-of-range defect minimization in semiconductor device
A method of fabricating a semiconductor device comprises forming a gate electrode over a substrate and forming deep amorphous regions within the substrate. And implanting dopants to form deep...
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7084039 |
Method of fabricating MOS transistor
A method of fabricating a CMOS (complementary metal oxide semiconductor) transistor includes manufacturing steps, by which adverse transistor characteristics can be prevented from being degraded by...
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7081393 |
Reduced dielectric constant spacer materials integration for high speed logic gates
An FET transistor has a gate disposed between a source and a drain; a gate dielectric layer disposed underneath the gate; and a spacer on a side of the gate. The gate dielectric layer is...
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7078303 |
Method for manufacturing semiconductor device having thick insulating layer under gate side walls
A semiconductor device includes a semiconductor substrate, a silicon oxide layer formed on the semiconductor substrate, a gate electrode formed over the silicon oxide layer, and a side wall...
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7074684 |
Elevated source drain disposable spacer CMOS
In one embodiment of the invention, source and drain regions are formed as well as source and drain contact regions. Thereafter source and drain extension regions are formed. In another embodiment,...
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7074665 |
Method of fabricating semiconductor device
An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region ( 3 ), and one...
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7071068 |
Transistor and method for fabricating the same
A transistor and a method for fabricating the same that involves a forming a device isolation oxide film semiconductor substrate, forming an opening in the device isolation oxide to open the...
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7060580 |
Field effect transistor and method of fabricating the same
Provided are a field effect transistor and a method of fabricating the same, wherein the field effect transistor is formed which has a hyperfine channel length by employing a technique for forming...
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7056799 |
Method of forming wing gate transistor for integrated circuits
A system is provided for forming a semiconductor device. Layers of gate dielectric material, gate material, and cap material are formed on a semiconductor substrate. The cap material and a portion...
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7052965 |
Methods of fabricating MOS field effect transistors with pocket regions using implant blocking patterns
MOSFETs with pocket regions are fabricated. A gate electrode layer is formed on a semiconductor substrate; and lightly doped drain regions are formed in the semiconductor substrate adjacent the...
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7045433 |
Tip architecture with SPE for buffer and deep source/drain regions
A method of manufacturing a semiconductor device includes forming a gate, source/drain extensions, buffer regions, and source/drain regions. The gate is formed over a semiconductor layer, and the...
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7037796 |
Method of manufacturing spacers on sidewalls of titanium polycide gate
Disclosed is a method for manufacturing a semiconductor device, more particularly to a method of forming a spacer on side-walls of a titanium polycide gate. The method for manufacturing the...
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7038258 |
Semiconductor device having a localized halo implant therein and method of manufacture therefor
The present invention provides a semiconductor device 200 having a localized halo implant 250 located therein, a method of manufacture therefore and an integrated circuit including the...
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7033895 |
Method of fabricating a MOS transistor with elevated source/drain structure using a selective epitaxial growth process
In a metal-oxide semiconductor (MOS) transistor with an elevated source/drain structure and in a method of fabricating the MOS transistor with the elevated source/drain structure using a selective...
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7022565 |
Method of fabricating a trench capacitor of a mixed mode integrated circuit
A method of fabricating a trench capacitor of a mixed mode integrated circuit includes forming shallow trench isolation regions for isolating active/passive devices on a semiconductor substrate....
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7022577 |
Method of forming ultra shallow junctions
The present invention relates to a method of fabricating a semiconductor device. In specific embodiments, the method comprises providing a semiconductor substrate, and ion implanting dopant...
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7022596 |
Method for forming rectangular-shaped spacers for semiconductor devices
A semiconductor device and method of making the same forms a spacer by depositing a spacer layer over a substrate and a gate electrode and forms a protective layer on the spacer layer. The...
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7015095 |
Method for fabricating a semiconductor memory having charge trapping memory cells and semiconductor substrate
Electrically conductive material is introduced into interspaces between the word lines ( 2 ) and is partially removed using a mask ( 6 ) in such a way that residual portions ( 7 ) of the conductive...
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7015108 |
Implanting carbon to form P-type drain extensions
The use of a carbon implant, in addition to the conventional fluorine implant, may significantly reduce the transient enhanced diffusion in P-type source drain extension regions. As a result,...
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7015107 |
Method of manufacturing semiconductor device
When a dummy sidewall and source and drain regions are once formed and then the dummy sidewall is removed to extend the source and drain regions, the removal of the dummy sidewall is performed...
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7012008 |
Dual spacer process for non-volatile memory devices
In a two-step spacer fabrication process for a non-volatile memory device, a thin oxide layer is deposited on a wafer substrate leaving a gap in the core of the non-volatile memory device....
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7001818 |
MIS semiconductor device and manufacturing method thereof
By suppressing a short-channel effect of a MIS field-effect transistor and reducing a fringing capacitance of a gate, a signal delay in the transistor can be shortened. The MIS field-effect...
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7001817 |
Method for fabricating a semiconductor device
A method for fabricating a semiconductor device, including forming a gate insulating film and a gate electrode film on a semiconductor substrate, and patterning the gate electrode film to form a...
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6995052 |
Method and structure for double dose gate in a JFET
A method for fabricating a junction field effect transistor (JFET) with a double dose gate structure. A trench is etched in the surface of a semiconductor substrate, followed by a low dose implant...
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6987049 |
Semiconductor transistors and methods of fabricating the same
In an example method for fabricating a transistor in a semiconductor device, a buffer insulation layer and a first insulation layer are deposited and etched, and poly electrodes for an LDD are...
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6984566 |
Damascene gate process
The invention provides a damascene gate process. A semiconductor substrate having a pad layer and an etch stop layer formed thereon is provided, and an insulating layer is formed to cover the etch...
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6982229 |
Ion recoil implantation and enhanced carrier mobility in CMOS device
An integrated circuit (IC) includes a CMOS device formed above a semiconductor substrate having ions therein that are implanted in the semiconductor substrate by an ion recoil procedure. The IC...
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6969646 |
Method of activating polysilicon gate structure dopants after offset spacer deposition
A process sequence used to integrate an anneal cycle, used to activate ion implanted dopants in a polysilicon gate structure, and the definition of offset silicon oxide spacers on the sides of the...
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6962853 |
Semiconductor device and method for fabricating the same
A conductive film for gate electrode including a polysilicon film is deposited on a semiconductor substrate, and patterned to form gate electrodes. An oxide film is formed on each side face of at...
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6960512 |
Method for manufacturing a semiconductor device having an improved disposable spacer
The present invention provides methods for manufacturing semiconductor devices. In one embodiment, the method includes forming a gate oxide over a substrate and a gate electrode over the gate...
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6956276 |
Semiconductor device with an L-shaped/reversed L-shaped gate side-wall insulating film
Provided is a semiconductor device, comprising a gate electrode formed on a semiconductor substrate, source/drain diffusion layers formed on both sides of the gate electrode, a gate electrode...
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6955997 |
Laser thermal annealing method for forming semiconductor low-k dielectric layer
A method of manufacturing a semiconductor device, including depositing a first layer of dielectric material onto the device, laser thermal annealing a surface of the first layer, and depositing a...
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6953732 |
Method of manufacturing a semiconductor device including a mosfet with nitride sidewalls
A method of manufacturing a semiconductor device includes providing a semiconductor substrate, and then forming a gate insulating layer on the semiconductor substrate. A lower gate electrode layer...
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6946352 |
CMOS image sensor device and method
A photodiode device including a well located in a substrate, a floating node located in the well and shallow trench isolation (STI) regions located over and laterally opposing the floating node. A...
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6943082 |
Method for manufacturing a nonvolatile memory device
A method, for manufacturing a nonvolatile memory device, includes: forming a gate layer above which a stopper layer is disposed on a semiconductor layer; forming control gates on both side surfaces...
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6940137 |
Semiconductor device having an angled compensation implant and method of manufacture therefor
The present invention provides a semiconductor device 200 having an angled compensation implant, a method of manufacture therefore and a method of manufacturing an integrated circuit including...
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6924237 |
Method for manufacturing semiconductor integrated circuit device
A method is used to form a circuit to achieve a high-speed performance and a circuit to attain a high reliability on one and the same substrate, in a semiconductor integrated circuit device...
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6924200 |
Methods using disposable and permanent films for diffusion and implantation doping
Methods are provided that use disposable and permanent films to dope underlying layers through diffusion. Additionally, methods are provided that use disposable films during implantation doping and...
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6913980 |
Process method of source drain spacer engineering to improve transistor capacitance
A method of forming an associated transistor is presented whereby short channel effects and junction capacitances are mitigated and enhanced switching speeds are thereby facilitated. Compensation...
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6908822 |
Semiconductor device having an insulating layer and method for forming
An insulating layer ( 24, 66, 82 ) is formed over a stack ( 14 ) of materials and a semiconductor substrate ( 12 ) and an implant is performed through the insulating layer into the semiconductor...
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6908839 |
Method of producing an imaging device
The invention relates to a dual masked spacer etch for improved dark current performance in imagers. After deposition of spacer material such as oxide, N-channel regions are first opened for N + ...
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6908833 |
Shallow self isolated doped implanted silicon process
A process and structure for forming electrical devices. The process and structure provide for forming an insulating layer on a substrate. A conductive region is then formed in the insulating layer...
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6905922 |
Dual fully-silicided gate MOSFETs
A semiconductor device having a plurality of silicidation steps is provided. In the preferred embodiment in which the semiconductor device is a MOSFET, the source/drain regions are silicided. A...
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6905923 |
Offset spacer process for forming N-type transistors
A method of fabricating an SMOS integrated circuit with source and drain junctions utilizes an offset gate spacer for N-type transistors. Ions are implanted to form the source and drain regions in...
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