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7642152 |
Method of fabricating spacers and cleaning method of post-etching and semiconductor device
A method of fabricating spacers is provided. The method includes providing a substrate with a device structure formed thereon. The device structure comprises a gate structure and a pair of...
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7638400 |
Method for fabricating semiconductor device
A method for forming a uniform doped region in a substrate having a non-uniform material layer thereon is provided. The non-uniform material layer is removed form the substrate. Thereafter, a...
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7618868 |
Method of manufacturing field effect transistors using sacrificial blocking layers
Provided are a more stable semiconductor integrated circuit device and a method of manufacturing the same. The method includes providing a semiconductor substrate comprising a first transistor...
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7615458 |
Activation of CMOS source/drain extensions by ultra-high temperature anneals
A method of manufacturing a semiconductor device that includes forming a gate dielectric layer over a semiconductor substrate. A gate electrode is formed over the gate dielectric layer. A dopant is...
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7611952 |
Method of manufacturing semiconductor device having side wall spacers
Gate insulating films 12 A and 12 B of different thickness are formed in element openings 16 a and 16 b in the isolation film 16 of a wafer 10 . The gate insulating film 12 B is the...
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7605030 |
Hafnium tantalum oxynitride high-k dielectric and metal gates
Electronic apparatus and methods may include a hafnium tantalum oxynitride film on a substrate for use in a variety of electronic systems. The hafnium tantalum oxynitride film may be structured as...
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7605044 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device including at least one step of: forming a transistor on and/or over a semiconductor substrate; forming silicide on and/or overa gate electrode and a...
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7605407 |
Composite stressors with variable element atomic concentrations in MOS devices
A semiconductor device includes a semiconductor substrate, a gate stack on the semiconductor substrate, and a stressor adjacent the gate stack and having at least a portion in the semiconductor...
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7605043 |
Semiconductor device and manufacturing method for the same
A semiconductor device includes a first diffusion region including germanium atoms and first impurity atoms, provided on a surface layer of a semiconductor substrate, the first impurity atoms...
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7601598 |
Reverse metal process for creating a metal silicide transistor gate structure
The present invention teaches a method of forming a MOSFET transistor having a silicide gate which is not subject to problems produced by etching a metal containing layer when forming the gate...
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7602014 |
Superjunction power MOSFET
An embodiment of an MOS device includes a semiconductor substrate of a first conductivity type, a first region of the first conductivity type having a length L acc and a net active dopant...
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7595247 |
Halo-first ultra-thin SOI FET for superior short channel control
Superior control of short-channel effects for an ultra-thin semiconductor-on-insulator field effect transistor (UTSOI-FET) is obtained by performing a halo implantation immediately after a gate...
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7585738 |
Method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device
A method of forming a fully silicided semiconductor device with independent gate and source/drain doping and related device. At least some of the illustrative embodiments are methods comprising...
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7579246 |
Semiconductor device manufacturing method including oblique ion implantation process and reticle pattern forming method
An active region and an opposite conductivity active region are formed in a semiconductor substrate. The opposite conductivity active region is covered with a resist pattern. Impurities are...
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7579250 |
Method for reducing hot carrier effect of MOS transistor
A semiconductor device structure is described, including a MOS transistor, a silicon-rich silicon nitride layer having a refractive index of about 2.00-2.30, and a dielectric layer. The...
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7575997 |
Method for forming contact hole of semiconductor device
A method for forming a contact hole of a semiconductor is provided. Conductive patterns are formed over a substrate. An insulation layer is formed over the substrate to bury the conductive...
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7572720 |
Semiconductor device and method for fabricating the same
A semiconductor device includes a substrate, first, second, and third gate lines disposed over the substrate, the first and second gate lines defining a first trench with a first aspect ratio, the...
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7572697 |
Method of manufacturing flash memory device
A method of manufacturing flash memory devices wherein, after gate lines are formed, an HDP oxide film having at least the same height as that of a floating gate is formed between the gate lines....
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7572692 |
Complementary transistors having different source and drain extension spacing controlled by different spacer sizes
Disclosed is a method of forming an integrated circuit structure having first-type transistors, such as P-type field effect transistors (PFETs) and complementary second-type transistors, such as...
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7572706 |
Source/drain stressor and method therefor
A method for forming a semiconductor device is provided. The method includes forming a gate structure overlying a substrate. The method further includes forming a sidewall spacer adjacent to the...
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7569856 |
Semiconductor device and method for manufacturing the same
A TFT formed on an insulating substrate source, drain and channel regions, a gate insulating film formed on at least the channel region and a gate electrode formed on the gate insulating film....
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7569457 |
Method of fabricating semiconductor device
An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region ( 3 ), and one...
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7569464 |
Method for manufacturing a semiconductor device having improved across chip implant uniformity
The present invention provides a method for manufacturing a semiconductor device, which includes forming a gate structure over a substrate, and forming a stack of layers on the substrate and at...
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7566624 |
Method for the production of transistor structures with LDD
A method for producing a transistor structure with a lightly doped drain (LDD) includes structuring a gate electrode on a gate dielectric. The method also includes etching the semiconductor body or...
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7560326 |
Silicon/silcion germaninum/silicon body device with embedded carbon dopant
A semiconductor structure and method of manufacturing a semiconductor device, and more particularly, an NFET device. The devices includes a stress receiving layer provided over a stress inducing...
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7560353 |
Methods of fabricating memory devices with memory cell transistors having gate sidewall spacers with different dielectric properties
A memory device, such as a DRAM, SRAM or non-volatile memory device, includes a substrate, a gate electrode disposed on the substrate, and source and drain regions in the substrate adjacent...
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7553726 |
Method of fabricating nonvolatile memory device
A method of fabricating nonvolatile memory devices may involve forming separate floating gates on a semiconductor substrate, forming control gates on the semiconductor substrate, conformally...
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7550357 |
Semiconductor device and fabricating method thereof
A semiconductor device with a low drain current in the off-state of LDD type accommodating high voltages is provided. On the thermal oxide film, a polysilicon film and a CVD oxide film, and a...
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7544554 |
Methods of forming gatelines and transistor devices
The invention includes semiconductor constructions, methods of forming gatelines, and methods of forming transistor structures. The invention can include, for example, a damascene method of forming...
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7541216 |
Method of aligning deposited nanotubes onto an etched feature using a spacer
A method of forming an aligned connection between a nanotube layer and a raised feature is disclosed. A substrate having a raised feature has spacers formed next to the side of the raised feature....
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7537988 |
Differential offset spacer
A method of fabricating a CMOS integrated circuit includes the steps of providing a substrate having a semiconductor surface, forming a gate dielectric and a plurality of gate electrodes thereon in...
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7534706 |
Recessed poly extension T-gate
A method is provided for making a silicided gate in a semiconductor device. In accordance with the method, a gate ( 213 ) is provided which comprises a first portion ( 214 ) and a second portion (...
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7534689 |
Stress enhanced MOS transistor and methods for its fabrication
A stress enhanced MOS transistor and methods for its fabrication are provided. In one embodiment the method comprises forming a gate electrode overlying and defining a channel region in a...
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7531435 |
Semiconductor device and manufacturing method of the same
In consideration of an optimum combination of impurities used for the purpose of forming an extension region ( 13 ) and a pocket region ( 11 ) and further inhibiting impurity diffusion in the...
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7528067 |
MOSFET structure with multiple self-aligned silicide contacts
A metal oxide semiconductor field effect transistor (MOSFET) structure that includes multiple and distinct self-aligned silicide contacts and methods of fabricating the same are provided. The...
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7528047 |
Self-aligned split gate memory cell and method of forming
A method of forming a split gate memory device using a semiconductor layer includes patterning an insulating layer to leave a pillar thereof. A gate dielectric is formed over the semiconductor...
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7521314 |
Method for selective removal of a layer
A method for forming a semiconductor device includes forming a liner over a semiconductor material including a control electrode. The method further includes forming a first spacer adjacent to the...
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7521316 |
Methods of forming gate structures for semiconductor devices
Methods of forming a semiconductor device may include forming a tunnel oxide layer on a semiconductor substrate, forming a gate structure on the tunnel oxide layer, forming a leakage barrier oxide,...
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7521740 |
Semiconductor device comprising extensions produced from material with a low melting point
A semiconductor device comprises a gate electrode ( 1 ) and a gate insulating layer ( 2 ) both surrounded by a spacer ( 3 ) and produced on a surface (S) of a substrate ( 100 ) of a first...
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7517745 |
Semiconductor device having MOSFET with offset-spacer, and manufacturing method thereof
A semiconductor device includes a gate insulating film which is formed on the major surface of a semiconductor substrate, a gate electrode which is formed on the gate insulating film, a first...
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7517766 |
Method of removing a spacer, method of manufacturing a metal-oxide-semiconductor transistor device, and metal-oxide-semiconductor transistor device
A method of removing a spacer, a method of manufacturing a metal-oxide-semiconductor transistor device, and a metal-oxide-semiconductor transistor device, in which, before the spacer is removed, a...
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7517767 |
Forming conductive stud for semiconductive devices
Embodiments of the present invention provide a method of forming a conductive stud contacting a semiconductor device. The method includes forming a protective layer covering the semiconductor...
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7517779 |
Recessed drain extensions in transistor device
A method of forming an integrated circuit transistor ( 50 ). The method provides a first semiconductor region ( 52 ) and forms ( 110 ) a gate structure ( 54 x ) in a fixed position relative to the...
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7514331 |
Method of manufacturing gate sidewalls that avoids recessing
A method of manufacturing a semiconductor device comprising removing a first oxide layer deposited over a semiconductor substrate, thereby exposing source and drain regions of the substrate. The...
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7510955 |
Method of fabricating multi-fin field effect transistor
A multi-fin field effect transistor includes a substrate, an oxide layer, a conductive layer, a gate oxide layer, and a doped region is provided. The substrate is surrounded by a trench, and there...
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7510923 |
Slim spacer implementation to improve drive current
Slim spacers are implemented in transistor fabrication. More particularly, wide sidewall spacers are initially formed and used to guide dopants into source/drain regions in a semiconductor...
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7507626 |
Floating gate of flash memory device and method of forming the same
Disclosed is a floating gate of a flash memory device, wherein a tunneling oxide layer is formed on a semiconductor substrate, and a floating gate is formed in the shape of a lens having a convex...
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7504309 |
Pre-silicide spacer removal
A method forms a gate conductor over a substrate, and simultaneously forms spacers on sides of the gate conductor and a gate cap on the top of the gate conductor. Isolation regions are formed in...
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7501317 |
Method of manufacturing semiconductor device
A junction leak current of a transistor including a silicide layer provided on a source/drain region is to be suppressed. After forming a gate electrode over a chip-side surface of a silicon...
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7494886 |
Uniaxial strain relaxation of biaxial-strained thin films using ion implantation
A method for achieving uniaxial strain on originally biaxial-strained thin films after uniaxial strain relaxation induced by ion implantation is provided. The biaxial-strained thin film receives...
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