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7618902 |
Plasma treatment of a semiconductor surface for enhanced nucleation of a metal-containing layer
A method for forming a dielectric layer is provided. The method may include providing a semiconductor surface and etching a thin layer of the semiconductor substrate to expose a surface of the...
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7608498 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device includes forming a trench in an interlayer dielectric film on the semiconductor substrate, the trench reaching a semiconductor substrate and having...
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7605087 |
Methods of forming semiconductor devices using di-block polymer layers
A method of forming a semiconductor device is provided. An interlayer dielectric is formed on a substrate. A di-block polymer layer that includes a plurality of first polymer blocks and a plurality...
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7601648 |
Method for fabricating an integrated gate dielectric layer for field effect transistors
Methods for forming a integrated gate dielectric layer on a substrate are provided. In one embodiment, the method includes forming a silicon oxide layer on a substrate, plasma treating the silicon...
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7601578 |
Defect control in gate dielectrics
A method for improving high-κ gate dielectric film ( 104 ) properties. The high-κ film ( 104 ) is subjected to a two step anneal sequence. The first anneal is performed in a reducing ambient (...
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7595203 |
Ferroelectric memory device with a conductive polymer layer and a method of formation
A ferroelectric memory device and a method of formation are disclosed. In one particular embodiment, a ferroelectric memory device comprises a first electrode layer formed on a substrate, a...
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7592666 |
Semiconductor memory
A semiconductor memory having an electrically writable/erasable memory cell includes a first gate insulating layer made from a compound containing silicon and oxygen; a first charge-storage layer...
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7588989 |
Dielectric multilayer structures of microelectronic devices and methods for fabricating the same
A dielectric multilayer structure of a microelectronic device, in which a leakage current characteristic and a dielectric constant are improved, is provided in an embodiment. The dielectric...
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7588988 |
Method of forming apparatus having oxide films formed using atomic layer deposition
A dielectric layer containing an atomic layer deposited insulating metal oxide film having multiple metal components and a method of fabricating such a dielectric layer produce a reliable...
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7585736 |
Method of manufacturing semiconductor device with regard to film thickness of gate oxide film
A method of manufacturing a semiconductor device includes steps (a) to (d). The step (a) is a step of forming a first insulating film and a nitride film on a semiconductor substrate in this order....
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7582534 |
Chemical doping of nano-components
A method is provided for doping nano-components, including nanotubes, nanocrystals and nanowires, by exposing the nano-components to an organic amine-containing dopant. A method is also provided...
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7579247 |
Multi-state non-volatile integrated circuit memory systems that employ dielectric storage elements
Non-volatile memory cells store a level of charge corresponding to the data being stored in a dielectric material storage element that is sandwiched between a control gate and the semiconductor...
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7572699 |
Process of forming an electronic device including fins and discontinuous storage elements
An electronic device can include a substrate including a fin lying between a first trench and a second trench, wherein the fin is no more than approximately 90 nm wide. The electronic device can...
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7566608 |
Methods of forming thin layers including zirconium hafnium oxide and methods of forming gate structures, capacitors, and flash memory devices using the same
Methods of forming a zirconium hafnium oxide thin layer on a semiconductor substrate by supplying tetrakis(ethylmethylamino)zirconium ([Zr{N(C 2 H 5 )(CH 3 )} 4 ], TEMAZ) and...
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7564114 |
Semiconductor devices and methods of manufacture thereof
Semiconductor devices and methods of manufacture thereof are disclosed. A preferred embodiment comprises a method of forming an insulating material layer. The method includes forming an interface...
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7563729 |
Method of forming a dielectric film
A method of forming a dielectric film on a substrate surface includes the steps of forming the dielectric film on the substrate surface in plural steps, and reforming, in each of the plural steps...
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7560772 |
Semiconductor integrated circuit device and manufacturing method thereof
After silicon oxide film ( 9 ) is formed on the surface of a semiconductor substrate ( 1 ), the silicon oxide film ( 9 ) in a region in which a gate insulation film having a small effective...
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7560396 |
Material for electronic device and process for producing the same
An electronic device material comprising at least an electronic device substrate and a silicon oxynitride film disposed on the substrate is provided. The silicon oxynitride film is characterized by...
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7560361 |
Method of forming gate stack for semiconductor electronic device
A method of forming a gate stack for semiconductor electronic devices utilizing wafer bonding of at least one structure containing a high-k dielectric material is provided. The method of the...
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7560349 |
Semiconductor device and gate structure having a composite dielectric layer and methods of manufacturing the same
A semiconductor device and/or gate structure having a composite dielectric layer and methods of manufacturing the same is provided. In the semiconductor device, gate structure, and methods...
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7553729 |
Method of manufacturing non-volatile memory device
A method of manufacturing a non-volatile memory device includes the steps of forming gates respectively having a structure in which a gate insulating layer, a first conductive layer, a dielectric...
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7550823 |
Nonvolatile memory cell, array thereof, fabrication methods thereof and device comprising the same
A nonvolatile memory cell is capable of reducing an excessive current leakage due to a rough surface of a polysilicon and of performing even at a low temperature process by forming the first oxide...
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7550353 |
Method of forming semiconductor device
One embodiment of a method for forming a semiconductor device can include forming a gate pattern on a semiconductor substrate and performing a selective re-oxidation process on the gate pattern in...
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7550346 |
Method for forming a gate dielectric of a semiconductor device
Disclosed is a method for forming a gate dielectric in a semiconductor device. The present method includes forming a first dielectric layer on a semiconductor substrate; removing a portion of the...
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7550345 |
Methods of forming hafnium-containing materials
The invention includes methods of forming hafnium-containing materials, such as, for example, hafnium oxide. In one aspect, a semiconductor substrate is provided, and first reaction conditions are...
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7544595 |
Forming a semiconductor device having a metal electrode and structure thereof
A method for forming a semiconductor device includes forming a gate dielectric over a substrate, forming a metal electrode over the gate dielectric, forming a first sacrificial layer which includes...
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7544569 |
Bidirectional split gate NAND flash memory structure and array, method of programming, erasing and reading thereof, and method of manufacturing
A split gate NAND flash memory structure is formed on a semiconductor substrate of a first conductivity type. The NAND structure comprises a first region of a second conductivity type and a second...
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7541626 |
High K-gate oxide TFTs built on transparent glass or transparent flexible polymer substrate
A transparent thin film transistor device includes a transparent substrate, and a high dielectric constant insulator layer disposed over the transparent substrate at a defined temperature. A...
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7541246 |
Method of manufacturing semiconductor device
A gate insulating film and a gate electrode are formed on a silicon substrate. The gate insulating film contains at least hafnium, oxygen, fluorine, and nitrogen. The fluorine concentration is high...
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7541243 |
Methods of forming integrated circuit devices having gate electrodes formed on non-uniformly thick gate insulating layers
Methods of forming an integrated circuit device include forming first and second device isolation regions at side-by-side locations within a semiconductor substrate to thereby define a...
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7541242 |
NROM memory cell, memory array, related devices and methods
An array of memory cells configured to store at least one bit per one F 2 includes substantially vertical structures providing an electronic memory function spaced apart a distance equal to one...
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7538001 |
Transistor gate forming methods and integrated circuits
A transistor gate forming method includes forming a first and a second transistor gate. Each of the two gates includes a lower metal layer and an upper metal layer. The lower metal layer of the...
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7538000 |
Method of forming double gate transistors having varying gate dielectric thicknesses
Double gate transistors ( 12, 13 ) having different bottom gate dielectric thicknesses are formed on a first wafer ( 101 ) by forming a first gate dielectric layer ( 107 ); removing part of the...
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7534684 |
Methods of forming non-volatile memory devices having a multi-layered charge storage layer
A non-volatile memory device includes a substrate having a first region and a second region. A first gate electrode is disposed on the first region. A multi-layered charge storage layer is...
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7531405 |
Method of manufacturing a dielectric layer and corresponding semiconductor device
A polycrystalline dielectric layer is formed wherein the dielectric layer comprises a first dielectric material containing an oxide or nitride and a second material contributing to less than 1% in...
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7531404 |
Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
A method of forming a transistor gate stack having an annealed gate dielectric layer begins by providing a substrate that includes a first and second spacer separated by a trench. A conformal...
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7528434 |
Production process for a semiconductor component with a praseodymium oxide dielectric
The invention concerns a semiconductor component and an associated production process having a silicon-bearing layer, a praseodymium oxide layer and a mixed oxide layer arranged between the...
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7528044 |
CMOSFET with hybrid-strained channels
Disclosed is a method of manufacturing microelectronic devices including forming a silicon substrate with first and second wells of different dopant characteristics, forming a first strained...
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7528043 |
Scalable gate and storage dielectric
Gate and storage dielectric systems and methods of their fabrication are presented. A passivated overlayer deposited between a layer of dielectric material and a gate or first storage plate...
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7528037 |
Flash memory having a high-permittivity tunnel dielectric
A high permittivity tunneling dielectric is used in a flash memory cell to provide greater tunneling current into the floating gate with smaller gate voltages. The flash memory cell has a substrate...
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7524727 |
Gate electrode having a capping layer
A method of manufacturing a semiconductor device and a novel semiconductor device are disclosed herein. An exemplary method includes sputtering a capping layer in-situ on a gate dielectric layer,...
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7521325 |
Semiconductor device and method for fabricating the same
A permeation preventing film of a silicon nitride film 16 is inserted between a silicon substrate 10 and a High-k gate insulation film 18 to thereby prevent the High-k gate insulation film ...
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7521324 |
Semiconductor device and method for manufacturing the same
In order to provide a semiconductor device having good quality by keeping the relative permittivity of a High-K insulation film in a high state, or to provide a method for manufacturing a...
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7517751 |
Substrate treating method
A substrate processing method includes the step of forming an oxide film by oxidizing a silicon substrate surface and the step of nitriding the oxide film to form an oxynitride film, wherein there...
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7514376 |
Manufacture of semiconductor device having nitridized insulating film
A method for manufacturing a semiconductor device is disclosed which enables to suppress decrease in the mobility in a channel region by suppressing piercing of boron through a gate insulation film...
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7510975 |
Method for manufacturing a semiconductor device having trenches defined in the substrate surface
In the method for manufacturing a semiconductor device according to the invention including the step of forming trenches having the depth thereof in perpendicular to the major surface of a...
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7510942 |
Molecular modifications of metal/dielectric interfaces
A method of increasing the work function of micro-electrodes includes providing a metal or silica surface functionalized with reactive groups and contacting the functionalized surface with a...
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7510931 |
Method of fabricating a nonvolatile memory device
A method of fabricating a nonvolatile memory device includes forming a charge tunneling layer on a semiconductor substrate, forming a charge trapping layer on the charge tunneling layer, forming a...
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7507652 |
Methods of forming a composite dielectric structure and methods of manufacturing a semiconductor device including a composite dielectric structure
Some methods that are provided form a composite dielectric structure on a substrate. A first dielectric layer that includes metal and oxygen is formed on a substrate. A preliminary dielectric layer...
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7507644 |
Method of forming dielectric layer of flash memory device
A method of manufacturing a flash memory device, wherein according to one embodiment, when a high dielectric material is formed by a remote plasma atomic layer deposition method, first and second...
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