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8183592 Light emitting device having a pluralilty of light emitting cells and package mounting the same  
A light emitting device includes a plurality of light emitting cells which are formed on a substrate and each of which has an N-type semiconductor layer and a P-type semiconductor layer located on...
8178372 Method for production of a plurality of semiconductor chips, and a semiconductor component  
A method for production of a plurality of semiconductor chips (6) in a wafer composite. A semiconductor layer sequence (2) is grown on a growth substrate (1), metallization (3) is applied to the...
8173469 Fabrication method of light emitting device  
Provided is a method for fabricating a light emitting device. The method for fabricating the light emitting device includes forming a buffer layer including a compound semiconductor in which a...
8174043 Light emitting apparatus  
In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead...
8169043 Optical seneor package structure and manufactueing method thereof  
An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom...
8158447 Dual panel type organic electroluminescent display device and method fabricating the same  
An organic electroluminescent device includes: a switching element and a driving element connected to each other on a substrate including a pixel region; a planarization layer on the switching...
8158462 Light emitting device and manufacture method thereof  
A manufacture method of a light emitting device is provided. Firstly, at least one circuit board is provided. A plurality of light emitting packages, a first undetermined power input end and a...
8154033 LED device and method of packaging the same  
A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent...
8148713 Method for fabrication of semipolar (Al, In, Ga, B)N based light emitting diodes  
A yellow Light Emitting Diode (LED) with a peak emission wavelength in the range 560-580 nm is disclosed. The LED is grown on one or more III-nitride-based semipolar planes and an active layer of...
8143080 Method for manufacturing LED package and substrate thereof  
A method for manufacturing a number of LED packages includes following steps: providing an electrode plate and at least one insulating plate; thermally pressing the electrode plate and the at least...
8143641 Integrated-type LED and manufacturing method thereof  
The present invention provides an integrated-type LED and method for manufacturing the same. This integrated-type LED comprises a base board which having a preplaced circuit and at least one LED...
8138000 Methods for forming semiconductor light emitting devices and submounts  
A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in...
8138508 LED chip package structure with different LED spacings and a method for making the same  
An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips...
8134174 Light-emitting diode  
A light-emitting diode and a method for manufacturing the same are described. The light-emitting diode includes a bonding substrate, a first conductivity type electrode, a bonding layer, an...
8133748 EL display device and method of manufacturing the same  
To provide a high throughput film deposition means for film depositing an organic EL material made of polymer accurately and without any positional shift. A pixel portion is divided into a...
8124454 Die separation  
Techniques for fabricating metal devices, such as vertical light-emitting diode (VLED) devices, power devices, laser diodes, and vertical cavity surface emitting laser devices, are provided....
8115217 Systems and methods for packaging light-emitting diode devices  
Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out...
8106420 Light emitting device including semiconductor nanocrystals  
A light emitting device can have a layered structure and include a plurality of semiconductor nanocrystals. The layers of the device can be covalently bonded to each other. The device can include...
8106429 Image sensor and manufacturing method thereof  
Disclosed is an image sensor. The image sensor includes a semiconductor substrate including a lower interconnection, a plurality of upper interconnection sections protruding upward from the...
8105852 Method of forming a composite substrate and growing a III-V light emitting device over the composite substrate  
A method according to embodiments of the invention includes providing a substrate comprising a host and a seed layer bonded to the host. The seed layer comprises a plurality of regions. A...
8101457 Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display  
Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably...
8101441 Method of manufacturing light-emitting device  
A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material...
8097502 Semiconductor light emitting device and method of manufacturing the same  
Provided is a semiconductor light emitting device and a method of manufacturing the semiconductor light emitting device. The semiconductor light emitting device includes a substrate, at least two...
8097476 Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package  
This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a...
8097477 Method for forming a light-emitting case and related light-emitting module  
A method for manufacturing a light-emitting case includes forming a PLED (Polymer Light Emitting Diode) device, disposing the PLED device into a mold, and utilizing the mold to sheathe the PLED...
8097894 LED with molded reflective sidewall coating  
A submount wafer, having mounted on it an array of LEDs with a phosphor layer, is positioned with respect to a mold having an array of indentions. A mixture of silicone and 10%-50%, by weight,...
8093616 Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device  
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end...
8093804 Organic electroluminescent display device having a novel concept for luminous efficiency  
An organic electroluminescent display device includes: a first substrate having an active area displaying images and a non-active area surrounding the active area; a switching thin film transistor...
8090229 Method and device for providing electronic circuitry on a backplate  
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a...
8088635 Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same  
There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light...
8088636 LED packaging using injection molding method  
A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the...
8084775 Light sources with serially connected LED segments including current blocking diodes  
A light source and method for making the same are disclosed. The light source includes a substrate and a light emitting structure that is deposited on the substrate. A barrier divides the light...
8071401 Method of forming vertical structure light emitting diode with heat exhaustion structure  
The present invention is to provide a method of forming a vertical structure light emitting diode with a heat exhaustion structure. The method includes steps of: a) providing a sapphire substrate;...
8067777 Light emitting diode package assembly  
An electrical device containing multiple light emitting diode (LED) dies each having respective first and second connectors suitable to receive current through the LED die. A common base layer of a...
8053770 Emissive layer patterning for OLED  
An organic light emitting device is provided. The device includes an anode, a cathode, and an organic emissive stack disposed between the anode and the cathode. The device may be a “pixel” in a dis...
8053260 Large-area lighting systems and methods of making the same  
Large-Area lighting systems and methods of making the same. More specifically, groups of organic light emitting modules, such as organic light emitting diode modules, coupled in series with respect...
8054397 Display device and manufacturing method thereof  
It is an object of the present invention to provide a display device that has a structure of an electrode where a residue of a transparent conductive film is not generated when a weak acid solution...
8048695 Method for fabricating a light source that includes phosphor-converted LED  
A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength...
8048699 Dual panel type organic electroluminescent display device and method of fabricating the same  
An organic electroluminescent device includes: a switching element and a driving element connected to each other on a substrate including a pixel region; a planarization layer on the switching...
8048696 Light emitting diode devices and manufacturing method thereof  
A light emitting diode (LED) device includes a stacked epitaxial structure, a heat-conductive plate and a seed layer. The stacked epitaxial structure sequentially includes a first semiconductor...
8049238 Light emitting module having light guide plate  
A light emitting module includes a light source, a light guide plate, and a reflecting mask. The light source includes a circuit board and a light emitting device fixed on the circuit board. The...
8043876 Light emitting diode package and manufacturing method thereof  
Disclosed are a light emitting diode package and a manufacturing method thereof. According to an embodiment of the present invention, the method includes: manufacturing a package main body having a...
8043872 Epitaxial material used for GaN based LED with low polarization effect and manufacturing method thereof  
A method of manufacturing epitaxial material used for GaN based LED with low polarization effect, which includes steps of growing n-type InGaAlN layer composed of GaN buffer layer (2) and n-type...
8043874 Method for coating semiconductor device using droplet deposition  
Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the...
8044415 Lighting structure comprising at least one light-emitting diode, method for making same and uses thereof  
A luminous structure based on light-emitting diodes, which includes: a first dielectric element with a substantially plane main face associated with a first electrode; a second dielectric element...
8043875 LED packaging method  
An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon...
8039281 Light emitting diode having vertical topology and method of making the same  
An LED having vertical topology and a method of making the same is capable of improving a luminous efficiency and reliability, and is also capable of achieving mass productivity. The method...
8039279 Method for making a light emitting diode by electroless plating  
One embodiment of the invention relates to a method of manufacturing a light emitting diode. The method includes forming an insulating layer on an area, not covered by a seed layer, of at least one...
8035116 Semiconductor device, light emitting diode head, and image forming apparatus  
A semiconductor device includes a substrate; a first conductive type semiconductor layer disposed on a main surface of the substrate; a second conductive type semiconductor layer disposed on the...
8030103 Liquid crystal display panel and method of manufacturing the same  
The present invention provides a liquid crystal display panel and a method of manufacturing the liquid crystal display panel capable of reducing or eliminating metal erosion in an area in which a...
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