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8183605 |
Reducing transistor junction capacitance by recessing drain and source regions
By recessing portions of the drain and source areas on the basis of a spacer structure, the subsequent implantation process for forming the deep drain and source regions may result in a moderately...
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8178401 |
Method for fabricating dual-metal gate device
A method of fabricating a MOS transistor that comprises a dual-metal gate that is formed from heterotypical metals. A gate dielectric (34), such as HfO2, is deposited on a semiconductor substrate....
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8138055 |
Semiconductor devices having pFET with SiGe gate electrode and embedded SiGe source/drain regions and methods of making the same
In a method of making a semiconductor device, a first gate stack is formed on a substrate at a pFET region, which includes a first gate electrode material. The source/drain regions of the substrate...
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8138551 |
Semiconductor device with transistors and its manufacturing method
A semiconductor device includes a semiconductor substrate, a first transistor including a first gate electrode, a first diffusion region, and a second diffusion region respectively formed above the...
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8133787 |
SiC semiconductor device and method for manufacturing the same
A SiC semiconductor device having a MOS structure includes: a SiC substrate; a channel region providing a current path; first and second impurity regions on upstream and downstream sides of the...
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8124468 |
Process of forming an electronic device including a well region
An electronic device including an integrated circuit can include a buried conductive region and a semiconductor layer overlying the buried conductive region, and a vertical conductive structure...
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8114739 |
Semiconductor device with oxygen-diffusion barrier layer and method for fabricating same
Methods are provided for fabricating a transistor. An exemplary method involves depositing an oxide layer overlying a layer of semiconductor material, forming an oxygen-diffusion barrier layer...
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8105892 |
Thermal dual gate oxide device integration
A method is provided that includes providing a semiconductor substrate including at least a thin gate oxide pFET device region and a thick gate oxide pFET device region and forming a thin gate...
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8101485 |
Replacement gates to enhance transistor strain
Some embodiments of the present invention include apparatuses and methods relating to NMOS and PMOS transistor strain.
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8101486 |
Methods for forming isolated fin structures on bulk semiconductor material
Methods are provided for fabricating a semiconductor device. A method comprises forming a layer of a first semiconductor material overlying the bulk substrate and forming a layer of a second...
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8076190 |
Sea-of-fins structure on a semiconductor substrate and method of fabrication
A semiconductor device and a method of fabricating a semiconductor device is disclosed, the method comprises including: forming etching an oxide layer to form a pattern of parallel oxide bars on a...
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8067288 |
Configuration and method of manufacturing the one-time programmable (OTP) memory cells
This invention discloses a method for manufacturing a one-time programmable (OTP) memory includes a first and second MOS transistors connected in parallel and controlled by a common gate formed...
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8058119 |
Device scheme of HKMG gate-last process
The present disclosure provides a method for making metal gate stacks of a semiconductor device. The method includes forming a high k dielectric material layer on a semiconductor substrate; forming...
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8026142 |
Method of fabricating semiconductor transistor devices with asymmetric extension and/or halo implants
A method of fabricating semiconductor devices begins by providing or fabricating a device structure that includes a semiconductor material and a plurality of gate structures formed overlying the...
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8012836 |
Semiconductor devices and methods for fabricating the same
Semiconductor devices and methods for fabricating the same are provided. An exemplary embodiment of a semiconductor device comprises a substrate with a plurality of isolation structures formed...
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8003506 |
Single poly CMOS imager
More complete charge transfer is achieved in a CMOS or CCD imager by reducing the spacing in the gaps between gates in each pixel cell, and/or by providing a lightly doped region between adjacent...
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7998818 |
Method for making semiconductor element structure
A method for forming a semiconductor element structure is provided. First, a substrate including a first MOS and a second MOS is provided. The gate electrode of the first MOS is connected to the...
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7989852 |
Integrated circuits and interconnect structure for integrated circuits
An integrated circuit includes N plane-like metal layers. A first plane-like metal layer includes M contact portions that communicate with the N plane-like metal layers, respectively. The first...
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7972920 |
Semiconductor memory device and a method of manufacturing the same, a method of manufacturing a vertical MISFET and a vertical MISFET, and a method of manufacturing a semiconductor device and a semiconductor device
Vertical MISFETs are formed over drive MISFETs and transfer MISFETs. The vertical MISFETs comprise rectangular pillar laminated bodies each formed by laminating a lower semiconductor layer (drain),...
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7968447 |
Semiconductor device and methods of manufacturing the same
A semiconductor device may include plugs disposed in a zigzag pattern, interconnections electrically connected to the plugs and a protection pattern which is interposed between the plugs and the...
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7964467 |
Method, structure and design structure for customizing history effects of soi circuits
A design structure is embodied in a machine readable medium for designing, manufacturing, or testing a design. The design structure includes a high-leakage dielectric formed between a gate...
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7951678 |
Metal-gate high-k reference structure
Disclosed are embodiments of an integrated circuit structure that incorporates at least two field effect transistors (FETs) that have the same conductivity type and essentially identical...
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7932178 |
Integrated circuit having a plurality of MOSFET devices
A method is provided for manufacturing an integrated circuit having a plurality of MOSFET devices, comprising the steps of: providing a plurality of MOSFET devices each having a first and a second...
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7919377 |
Contactless flash memory array
A method for forming a contactless flash memory cell array is disclosed. According to an embodiment of the invention, a plurality of active regions is formed on a substrate. An insulating layer is...
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7915125 |
Semiconductor device and method of manufacturing the same
A method of manufacturing a semiconductor device is provided which comprises: forming a first gate insulating film and a second gate insulating film in an active region of a semiconductor...
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7910441 |
Multi-gate semiconductor device and method for forming the same
A semiconductor device includes a substrate (20), a source region (58) formed over the substrate, a drain region (62) formed over the substrate, a first gate electrode (36) over the substrate...
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7883974 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device includes forming a trench in an interlayer dielectric film on the semiconductor substrate, the trench reaching a semiconductor substrate and having...
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7863676 |
Semiconductor devices and methods of fabricating the same
A semiconductor device includes a device isolation layer in a semiconductor substrate, an active region defined by the device isolation layer, the active region including a main surface and a...
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7863139 |
Double gate FET and fabrication process
A method of fabricating a double gate FET on a silicon substrate includes the steps of sequentially epitaxially growing a lower gate layer of crystalline rare earth silicide material on the...
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7858480 |
Semiconductor device and method of fabricating the same
A semiconductor device according to one embodiment includes: a semiconductor substrate comprising an element isolation region; two gate electrodes formed in substantially parallel on the...
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7851872 |
Efficient transistor structure
An integrated circuit comprises a first source, a first drain, a second source, a first gate arranged between the first source and the first drain, and a second gate arranged between the first...
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7851312 |
Semiconductor component and method of manufacture
A semiconductor component that includes a field plate and a semiconductor device and a method of manufacturing the semiconductor component. A body region is formed in a semiconductor material that...
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7838407 |
Method for protecting the gate of a transistor and corresponding integrated circuit
A gate of a transistor in an integrated circuit is protected against the production of an interconnection terminal for a source/drain region. The transistor includes a substrate, at least one...
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7829419 |
Semiconductor device and method for manufacturing the same
A semiconductor device is provided with a semiconductor substrate, a plurality of active regions separated from each other by element isolation regions formed on the semiconductor substrate; gate...
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7824975 |
Method of fabricating semiconductor device having gate spacer layer with uniform thickness
A method of fabricating a semiconductor device having a gate spacer layer with a uniform thickness wherein a gate electrode layer pattern is formed on a substrate and ion implantation processes of...
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7821809 |
Nonvolatile memory device and method including resistor and transistor
A nonvolatile memory device including one resistor and one transistor. The resistor may correspond to a resistance layer electrically connected to a first impurity region and a second impurity...
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7804141 |
Semiconductor element structure and method for making the same
A semiconductor element structure includes a first MOS having a first high-K material and a first metal for use in a first gate, a second MOS having a second high-K material and a second metal for...
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7790541 |
Method and structure for forming multiple self-aligned gate stacks for logic devices
A method for forming multiple self-aligned gate stacks, the method comprising, forming a first group of gate stack layers on a first portion of a substrate, forming a second group of gate stack...
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7790544 |
Method of fabricating different gate oxides for different transistors in an integrated circuit
An integrated circuit and gate oxide forming process are disclosed which provide a gate structure that is simple to integrate with conventional fabrication processes while providing different gate...
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7785948 |
Semiconductor element and process for producing the same
The present invention provides a thin film transistor having excellent formability and processability, and particularly a thin film transistor using plastics as a substrate; an organic...
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7781291 |
Semiconductor device and method for fabricating the same
A semiconductor device includes a memory section formed at a semiconductor substrate and including a first transistor having an ONO film that can store charges between the semiconductor substrate...
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7767531 |
Method of forming transistor having channel region at sidewall of channel portion hole
According to some embodiments of the invention, a method of forming a transistor includes forming a device isolation layer in a semiconductor substrate. The device isolation layer is formed to...
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7754555 |
Transistor having a channel with biaxial strain induced by silicon/germanium in the gate electrode
By forming a stressed semiconductor material in a gate electrode, a biaxial tensile strain may be induced in the channel region, thereby significantly increasing the charge carrier mobility. This...
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7754556 |
Reducing transistor junction capacitance by recessing drain and source regions
By recessing portions of the drain and source areas on the basis of a spacer structure, the subsequent implantation process for forming the deep drain and source regions may result in a moderately...
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7749816 |
Systems and arrangements to interconnect components of a semiconductor device
Systems and arrangements to interconnect cells and structures within cells of an integrated circuit to enhance cell density are disclosed. Embodiments comprise an adjusted polysilicon gate pitch to...
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7732283 |
Fabricating method of semiconductor device
A method of fabricating a semiconductor device is provided. Spacers can be formed on adjacent gate structures and used as an ion implantation mask for forming source/drain regions. The spacers can...
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7718495 |
Methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors
The invention includes methods of forming integrated circuitry, methods of forming memory circuitry, and methods of forming field effect transistors. In one implementation, conductive metal...
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7718499 |
Method of fabricating a semiconductor device
In a method of fabricating a semiconductor device, an additive gas is mixed with an etching gas to reduce a fluorine ratio of the etching gas. The etching gas having a reduced fluorine rate is...
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7714395 |
Static random access memory and fabricating method thereof
A static random access memory at least includes: pluralities of transistors disposed on a substrate, each transistor at least includes a gate, a gate dielectric layer, a source doped region and a...
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7713825 |
LDMOS transistor double diffused region formation process
Exemplary embodiments provide manufacturing methods for forming a doped region in a semiconductor. Specifically, the doped region can be formed by multiple ion implantation processes using a...
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