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8178888 |
Semiconductor light emitting devices with high color rendering
A packaged light emitting device (LED) includes a light emitting diode configured to emit primary light having a peak wavelength that is less than about 465 nm and having a shoulder emission...
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8174041 |
Lighting unit with temperature compensation
A lighting unit comprises a packaging substrate (10) formed from a semiconductor, a channel (12) formed in the substrate and a discrete light emitting diode arrangement (34) in the channel. A...
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8173456 |
Method of manufacturing a light emitting diode element
A method of manufacturing a light emitting diode element is provided. A first patterned semi-conductor layer, a patterned light emitting layer, and a second patterned semi-conductor layer are...
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8168998 |
LED with remote phosphor layer and reflective submount
A light emitting device comprises a flip-chip light emitting diode (LED) die mounted on a submount. The top surface of the submount has a reflective layer. Over the LED die is molded a...
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8162547 |
Optical subassembly manufacturing method
An optical subassembly manufacturing method includes forming connecting electrodes and a piece of high-melting-point glass on a wiring substrate; positioning on and connecting to the connecting...
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8154033 |
LED device and method of packaging the same
A light emitting diode (LED) device including a transparent substrate, a plurality of LED chips, a circuit, and a transparent encapsulant is provided. The LED chips are fixed on the transparent...
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8153457 |
Method for forming light emitting device
The invention provides a method for forming a light emitting device. A first substrate is provided. A plurality of patterned masks is formed on the first substrate, or on a semiconductor epitaxial...
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8148177 |
Light emitting device and display
A light emitting device containing a semiconductor light emitting component and a phosphor, the phosphor is capable of absorbing a part of light emitted by the light emitting component and emitting...
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8143640 |
GaN compound semiconductor light emitting element and method of manufacturing the same
The present invention relates to a gallium nitride (GaN) compound semiconductor light emitting element (LED) and a method of manufacturing the same. The present invention provides a vertical GaN...
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8143079 |
Silicon nanoparticle white light emitting device
Multiple films of red-green-blue (RGB) luminescent silicon nanoparticles are integrated in a cascade configuration as a top coating in an ultraviolet/blue light emitting diode (LED) to convert it...
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8138000 |
Methods for forming semiconductor light emitting devices and submounts
A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in...
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8138508 |
LED chip package structure with different LED spacings and a method for making the same
An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips...
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8134174 |
Light-emitting diode
A light-emitting diode and a method for manufacturing the same are described. The light-emitting diode includes a bonding substrate, a first conductivity type electrode, a bonding layer, an...
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8129206 |
Light emitting diode package and method of making the same
The light emitting diode package of the present invention uses photosensitive materials to form phosphor encapsulations or a phosphor layer, which can be fabricated by means of semiconductor...
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8129205 |
Solid state lighting devices and associated methods of manufacturing
Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state light device includes a light emitting diode with an N-type gallium...
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8129207 |
Light emitting diode having a thermal conductive substrate and method of fabricating the same
Disclosed are a light emitting diode having a thermal conductive substrate and a method of fabricating the same. The light emitting diode includes a thermal conductive insulating substrate. A...
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8114691 |
Semiconductor light emitting device having textured structure and method of manufacturing the same
A semiconductor light emitting diode having a textured structure and a method of manufacturing the same are provided. The semiconductor light emitting diode includes a first semiconductor layer...
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8115217 |
Systems and methods for packaging light-emitting diode devices
Embodiments disclosed herein provide packaged LED devices in which the majority of the emitted light comes out the top of each LED chip with very little side emissions. Because light only comes out...
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8110839 |
Lighting device, display, and method for manufacturing the same
A display, a lighting device and a method for manufacturing the lighting device are provided. The lighting device comprises a substrate, an electrode layer, a plurality of light source units and a...
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8110838 |
Spatial localization of light-generating portions in LEDs
Light-emitting devices (e.g., LEDs) and methods associated with such devices are provided. In some embodiments, the device includes a distribution of light-generating portions (including active...
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8110842 |
Light-emitting diode module and manufacturing method thereof
A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package...
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8110419 |
Process of manufacturing photovoltaic device
An inline process for manufacturing a photovoltaic device on a removable substrate is disclosed. The process discloses two semiconductor layers forming an active region; at least one of the...
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8110421 |
Light emitting device and method for manufacturing same
A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a...
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8105853 |
Surface-textured encapsulations for use with light emitting diodes
Surface-textured encapsulations for use with light emitting diodes. In an aspect, a light emitting diode apparatus is provided that includes a light emitting diode, and an encapsulation formed upon...
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8105854 |
LED package
A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality...
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8101457 |
Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display
Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably...
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8101441 |
Method of manufacturing light-emitting device
A method of manufacturing a light-emitting device includes, when sealing a light-emitting element on a mounting portion by a glass material softened by heating or when processing the glass material...
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8097894 |
LED with molded reflective sidewall coating
A submount wafer, having mounted on it an array of LEDs with a phosphor layer, is positioned with respect to a mold having an array of indentions. A mixture of silicone and 10%-50%, by weight,...
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8093616 |
Electronic component, manufacturing method of the electronic component, electronic component assembly body, and electronic device
An electronic component, includes a main body part inserted in an opening part formed in a board; and a pair of leads each of the leads having an end connected to the main body part and another end...
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8093804 |
Organic electroluminescent display device having a novel concept for luminous efficiency
An organic electroluminescent display device includes: a first substrate having an active area displaying images and a non-active area surrounding the active area; a switching thin film transistor...
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8093078 |
Photoelectric device, method of fabricating the same and packaging apparatus for the same
A method for fabricating a photoelectric device initially provides a ceramic substrate comprising a thermal dissipation layer on a bottom layer of the ceramic substrate, an electrode layer on the...
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8089089 |
Side-emitting LED package and manufacturing method of the same
A side-emitting LED includes a substrate formed with a plurality of electrodes, an LED chip bonded onto the substrate and electrically connected to the electrodes, a transparent member...
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8090229 |
Method and device for providing electronic circuitry on a backplate
A MEMS-based display device is described, wherein an array of interferometric modulators are configured to reflect light through a transparent substrate. The transparent substrate is sealed to a...
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8088635 |
Vertical geometry light emitting diode package aggregate and production method of light emitting device using the same
There are provided a vertical geometry light emitting diode package aggregate useful for the production of a light emitting device having a vertical geometry light emitting diode as the light...
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8088636 |
LED packaging using injection molding method
A light emitting diode (LED) packaging method includes the steps of preparing a circuit board (1), a transparent cap (3), and at least one LED material (2), placing the transparent cap (3) on the...
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8067254 |
Common optical element for an array of phosphor converted light emitting devices
A device is provided with an array of a plurality of phosphor converted light emitting devices (LEDs) that produce broad spectrum light. The phosphor converted LEDs may produce light with different...
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8062914 |
Method for fabricating flat panel display device
Provided is a flat panel display device and a method for fabricating the same. The flat panel display device comprises a first substrate, a light emitting unit, a second substrate, and insulating...
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8062913 |
Semiconductor structure and method of manufacturing a semiconductor structure
A semiconductor structure is formed of nitrides of group III metals having wurtzite crystal structure and grown in vapor phase on a (0001) oriented semiconductor substrate. The structure comprises...
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8058668 |
Semiconductor light-emitting apparatus
An object of the present invention is to provide a light-emitting apparatus reduced in the optical self-absorption of the light-emitting device and assured of excellent light extraction efficiency....
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8058667 |
Leadframe package for light emitting diode device
An LED leadframe package with surface tension function to enable the production of LED package with convex lens shape by using dispensing method is disclosed. The LED leadframe package of the...
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8048695 |
Method for fabricating a light source that includes phosphor-converted LED
A light source and method for fabricating the same are disclosed. The light source includes a die, a light conversion component, and a scattering ring. The die emits light of a first wavelength...
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8049238 |
Light emitting module having light guide plate
A light emitting module includes a light source, a light guide plate, and a reflecting mask. The light source includes a circuit board and a light emitting device fixed on the circuit board. The...
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8043874 |
Method for coating semiconductor device using droplet deposition
Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the...
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8043875 |
LED packaging method
An LED packaging method provides a package that includes a substrate, a LED chip, a carbon naonotube thin film and an adhesive layer. The LED chip includes an anode and a cathode. The carbon...
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8039866 |
Mount for a semiconductor light emitting device
A mount for a semiconductor device includes a carrier, at least two metal leads disposed on a bottom surface of the carrier, and a cavity extending through a thickness of the carrier to expose a...
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8039280 |
Light emitting diode and method of fabricating the same
The present invention provides a method of fabricating a light emitting diode, which comprises the steps of forming a compound semiconductor layer on a substrate, the compound semiconductor layer...
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8030104 |
Method for manufacturing liquid crystal display device
A method for manufacturing a liquid crystal display device is disclosed. The method includes forming a gate electrode, a gate pad, a gate line on a substrate by using a first mask; forming a gate...
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8030101 |
Process for producing an epitaxial layer of galium nitride
A method of manufacturing a low defect density GaN material comprising at least two steps of growing epitaxial layers of GaN with differences in growing conditions, (a.) a first step of growing an...
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8030103 |
Liquid crystal display panel and method of manufacturing the same
The present invention provides a liquid crystal display panel and a method of manufacturing the liquid crystal display panel capable of reducing or eliminating metal erosion in an area in which a...
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8030723 |
Image sensor with decreased optical interference between adjacent pixels
An image sensor with decreased optical interference between adjacent pixels is provided. An image sensor, which is divided into a pixel region and a peripheral region, the image sensor including a...
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