|
Match
|
Document |
Document Title |
|
|
7632707 |
Electronic device package and method of manufacturing the same
The present invention discloses an electronic device package and a method of the package. In particular, an electronic device package and a method of the package suitable for a bumpless electronic...
|
|
|
7629185 |
Semiconductor laser device manufacturing method and semiconductor laser device
A semiconductor laser device manufacturing method includes, sequentially, a first aging step S 1, a first inspection step S 2, a mounting step S 3, a second aging step S 4 and a second...
|
|
|
7625778 |
Method of manufacturing a substrate-free flip chip light emitting diode
A substrate-free LED device is provided. The LED device comprises a substrate, an epitaxial layer disposed on the substrate, a first electrode disposed on a portion of the epitaxial layer, a second...
|
|
|
7625780 |
Fluidic heterogeneous microsystems assembly and packaging
Self-assembly of components carried in a fluid is provided. A first component and a second component are obtained and self-assembled together. A third component is obtained and assembled with the...
|
|
|
7622314 |
Carbon nanotube structures and methods of manufacture and use
A method of making a carbon nanotube structure includes forming a plurality of carbon nanotubes and contacting the carbon nanotubes with a polymer. A solid composition is formed from the carbon...
|
|
|
7622311 |
Inspection of underfill in integrated circuit package
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package...
|
|
|
7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
|
|
|
7615398 |
Pyramidal photonic crystal light emitting device
A light-emitting device (LED) is described which exhibits high extraction efficiency and an emission profile which is substantially more directional than from a Lambertian source. The device...
|
|
|
7612383 |
Reflector packages and semiconductor light emitting devices including the same
Reflectors for a semiconductor light emitting device include a lower sidewall portion defining a reflective cavity. A substantially horizontal shoulder portion extends outwardly from the sloped...
|
|
|
7598101 |
LED of side view type and the method for manufacturing the same
A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal,...
|
|
|
7595515 |
Method of making light emitting device having a molded encapsulant
Disclosed herein is a method of making a light emitting device comprising an LED and a molded silicon-containing encapsulant. The method includes contacting the LED with a photopolymerizable...
|
|
|
7592631 |
LED package frame and LED package having the same
An LED package frame includes an LED chip and a heat conductive member made of high heat conductivity material. The heat conductive member has a receiving part at a lateral portion, and is mounted...
|
|
|
7588952 |
Method of fabricating vertical structure LEDs
A method of fabricating semiconductor devices, such as GaN LEDs, on insulating substrates, such as sapphire. Semiconductor layers are produced on the insulating substrate using normal semiconductor...
|
|
|
7588951 |
Method of packaging a semiconductor device and a prefabricated connector
A method of packaging a first device having a first major surface and a second major surface includes forming a first layer over a second major surface of the first device and around sides of the...
|
|
|
7583862 |
Packaged microelectronic imagers and methods of packaging microelectronic imagers
A microelectronic imager having an imaging unit and an optics unit attached to the imaging unit, and methods for packaging microelectronic imagers. In one embodiment, the imaging unit can include a...
|
|
|
7582496 |
LED package using Si substrate and fabricating method thereof
There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed...
|
|
|
7583871 |
Substrates for optical die structures
Package substrates for optical die structures are generally described. In one example, an apparatus includes a package substrate having one or more plated through hole (PTH) structures, an optical...
|
|
|
7579628 |
Backlight device for liquid crystal display including a plurality of light emitting diodes within their own concaves aligned in a straight line within a larger concave
A semiconductor light emitting device of the present invention includes a plurality of light emitting elements, a package body for storing the light emitting elements, wiring patterns being...
|
|
|
7579198 |
Method for making backlight module
An exemplary method for making a backlight module, the method includes steps in following order: providing a transparent base sheet and at least one light emitting diode; punching the base sheet to...
|
|
|
7572654 |
Method for making light emitting diode
An exemplary light emitting diode ( 30 ) includes a light output unit ( 31 ), an optical lens ( 33 ) and a reflective film ( 35 ). The optical lens includes a light input surface ( 331 ) facing the...
|
|
|
7569420 |
Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer
A packaging structure and method for a light emitting diode is provided. The present invention uses flip-chip and eutectic bonding technology to attach a LED to a thermal and electrical conducting...
|
|
|
7569406 |
Method for coating semiconductor device using droplet deposition
Methods and systems for coating of semiconductor devices using droplets of wavelength conversion or phosphor particles in a liquid medium. A plurality of nozzles delivers a controlled amount of the...
|
|
|
7563644 |
Optical device and method for fabricating the same
An optical device includes a base, an optical element chip attached to the base, an integrated circuit chip attached onto the back surface of the optical element chip, and a translucent member...
|
|
|
7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
|
|
|
7560303 |
Method and apparatus for linear die transfer
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing...
|
|
|
7560803 |
Method for fabricating semiconductor device and apparatus for fabricating the same
In a semiconductor-device fabrication method, a plurality of recessed portions are first formed in the principal surface of a substrate. Then, a through hole, passing through the substrate in the...
|
|
|
7556975 |
Method for manufacturing backside-illuminated optical sensor
A CCD portion 3 is formed on a front surface side of a semiconductor substrate 1 . A region of a back surface side of semiconductor substrate 1 that corresponds to CCD portion 3 is thinned...
|
|
|
7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method. According to the method of...
|
|
|
7547566 |
Organic electroluminescent device and method of manufacturing the same
The invention provides an organic electroluminescent device and a method of manufacturing the same which conveniently reduce or suppress the transfer of ionic impurities into a light-emitting...
|
|
|
7536236 |
Component mounting apparatus, service providing device and servicing method
A service receiving method for receiving a component library including component size necessary for mount production, by inputting, via a service receiver, to a service provider, mounted component...
|
|
|
7534635 |
Getter precursors for hermetically sealed packaging
Hermetically sealed packages include a getter precursor disposed within an interior region of the package. The getter precursor includes a cation portion and a non-oxidizing anion portion, which is...
|
|
|
7528416 |
Vertical structure LED and fabricating method thereof
A vertical structure light emitting diode (LED) and a fabricating method thereof is disclosed, wherein a metal support layer is formed on an upper surface of a light emitting structure by way of...
|
|
|
7528000 |
Method of fabricating optical device caps
A wafer having a plurality of through holes is provided, and a glass wafer is disposed on the wafer. A plate having a plurality of concave cavities is disposed on the glass wafer, wherein the...
|
|
|
7521272 |
Display device producing method and display device producing device
Provided are a manufacturing method which can efficiently manufacture a display device with higher image quality, and a manufacturing apparatus which can be applied to the manufacturing method....
|
|
|
7521790 |
Semiconductor device module and manufacturing method of semiconductor device module
In a module for an optical device as a semiconductor device module of the present invention, a bonding wire that electrically connects a substrate on which a conductor wiring is formed and an image...
|
|
|
7521271 |
Method of manufacturing a transponder
A method of manufacturing a transponder ( 1 ) where a transponder IC ( 2 ) comprising two IC contacts ( 7, 8 ) is brought into communication-capable connection, via each time one of the IC contacts...
|
|
|
7521273 |
Light emitting device methods
Light-emitting device methods are disclosed.
|
|
|
7518159 |
Packaging technique for the fabrication of polarized light emitting diodes
A polarized light emitting diode (LED) includes a marker indicating a polarization direction. A package for the LED also includes a marker indicating the polarization direction. The markers on the...
|
|
|
7510889 |
Light emitting chip package and manufacturing method thereof
A method for manufacturing a light emitting chip package includes bonding a patterned metal plate having at least a thermal enhanced plate and many contacts around the same to a substrate and...
|
|
|
7510888 |
LED arrangement
The invention concerns an LED arrangement with at least one LED chip comprising a radiation decoupling surface through which the bulk of the electromagnetic radiation generated in the LED chip is...
|
|
|
7507592 |
Bonding pad structure for a display device and fabrication method thereof
A bonding pad structure of a display device. A first conductive layer is formed overlying a substrate, a protection layer is formed overlying the substrate and the first conductive layer, and a...
|
|
|
7504271 |
Integrated circuit package substrate having a thin film capacitor structure
This invention relates to the manufacture of a substrate, such as a package substrate or an interposer substrate, of an integrated circuit package. A base structure is formed from a green material...
|
|
|
7498185 |
Light emitting diode and method making the same
A light emitting diode and the method of the same are provided. The light emitting diode includes a light emitting structure and a metal reflective layer. The light emitting structure includes two...
|
|
|
7498678 |
Electronic assemblies and systems with filled no-flow underfill
High yield, high reliability, flip-chip integrated circuit (IC) packages are achieved utilizing a combination of heat and pressure to bond flip-chip die and to cure no-flow underfill material. The...
|
|
|
7485489 |
Electronics circuit manufacture
A circuit with embedding components ( 13 ) is produced by placing the components ( 13 ) on a substrate ( 14 ) and applying sheets ( 15 ) of prepreg. The prepreg sheets ( 15 ) have apertures to...
|
|
|
7485480 |
Method of manufacturing high power light-emitting device package and structure thereof
A method of manufacturing high power light-emitting device packages and structure thereof, wherein the method thereof includes the steps of: (a) forming a plurality of lead frames, each of the lead...
|
|
|
7485478 |
Light emitting device and method of manufacturing the same
A high-quality light emitting device is provided which has a long-lasting light emitting element free from the problems of conventional ones because of a structure that allows less degradation, and...
|
|
|
7479397 |
Optoelectronics processing module and method for manufacturing thereof
An optoelectronics processing module includes a transparent substrate and at least one optoelectronics component. One surface of the transparent substrate is formed with a plurality of first pads...
|
|
|
7479662 |
Coated LED with improved efficiency
An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted...
|
|
|
7471146 |
Optimized circuits for three dimensional packaging and methods of manufacture therefore
An embodiment of the present invention provides an apparatus, comprising an integrated circuit, wherein a first portion of the integrated circuit is placed on a top tier substrate and a second...
|