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8178371 |
Solid-state lasers
A method for assembling an optically pumped solid-state laser having an extended cavity. The method includes the steps of providing a casing, mounting a TEC and a base plate in the casing, and...
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8178895 |
Semiconductor light-emiting device and method
A semiconductor light-emitting device can include a submount on which a semiconductor light-emitting element is mounted. The device can have a high light utilization efficiency with high...
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8178390 |
Semiconductor component and production method
A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially...
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8173454 |
Light emitting diode package and method of manufacturing the same
Disclosed is a light emitting diode package, including a metal body including a cavity for receiving a light emitting diode therein, a lens mount for mounting thereon a lens through which light is...
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8173453 |
Laser patterning of encapsulated organic light emitting diodes
Patterning an organic light emitting diode (OLED) after it has been encapsulated by permanently changing the light emissivity of the diodes. The OLED includes an intervening layer between a source...
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8174043 |
Light emitting apparatus
In a light-emitting apparatus using a silicone resin as a sealant of its light-emitting element, it is intended to prevent discoloration of its lead frame. A light-emitting element fixed to a lead...
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8174044 |
Light emitting diode package and method for forming the same
A light emitting diode package is provided, which includes a semiconductor substrate having a first surface and a second surface; at least a through-hole passing through the semiconductor...
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8173455 |
Phosphor coating method for fabricating light emitting semiconductor device and applications thereof
A phosphor coating method for fabricating a light-emitting semiconductor is provided. The phosphor coating method comprises the steps as follows: First a light emitting semiconductor wafer having a...
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8168984 |
Light emitting diodes with smooth surface for reflective electrode
A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are disposed on one side of the epitaxial layer structure....
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8169043 |
Optical seneor package structure and manufactueing method thereof
An optical sensor package structure includes a substrate, a metal plate, an optical sensing chip, a plurality of bonding wires and a lens module. The substrate includes a top surface, a bottom...
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8169560 |
Liquid crystal display and method of manufacturing the same
A liquid crystal display with good reliability is provided. A pixel substrate 11 and a facing substrate 12 facing each other, a liquid crystal layer 14 sandwiched between the above-described...
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8168998 |
LED with remote phosphor layer and reflective submount
A light emitting device comprises a flip-chip light emitting diode (LED) die mounted on a submount. The top surface of the submount has a reflective layer. Over the LED die is molded a...
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8169132 |
Organic light emitting diode display device and method of manufacturing the same
An organic light emitting diode (OLED) display device and a method of manufacturing the same is disclosed. In one embodiment, the OLED device includes a substrate; a display unit formed on a...
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8168453 |
Light emitting diode package and fabrication method thereof
An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and...
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8163603 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a substrate using grinding
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post through an opening in the adhesive, mounting a...
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8163578 |
Light emitting diodes with smooth surface for reflective electrode
A light emitting diode comprising an epitaxial layer structure, a first electrode, and a second electrode. The first and second electrodes are separately disposed on the epitaxial layer structure,...
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8153477 |
Method of making a semiconductor chip assembly with a post/dielectric/post heat spreader
A method of making a semiconductor chip assembly includes providing first and second posts, first and second adhesives, first and second conductive layers and a dielectric base, wherein the first...
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8154044 |
Light emitting diode package structure and method for fabricating the same
A light emitting diode and method for fabricating the same are provided. The light emitting diode comprises a lead frame. A first material body is formed on the lead frame, wherein the first...
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8148207 |
Method of making a semiconductor chip assembly with a post/base/cap heat spreader
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a...
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8148745 |
Semiconductor light emitting module and method for manufacturing the same
A light emitting module includes a semiconductor light source, a first lead with a bonding pad to which the light source is attached, and a second lead spaced from the first lead in a first...
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8148183 |
Method for manufacturing semiconductor light emitting device
According to one embodiment, a method for manufacturing a semiconductor light emitting device includes forming a separation groove on a major surface of a substrate. A semiconductor layer including...
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8138000 |
Methods for forming semiconductor light emitting devices and submounts
A submount for a semiconductor light emitting device includes a semiconductor substrate having a cavity therein configured to receive the light emitting device. A first bond pad is positioned in...
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8138508 |
LED chip package structure with different LED spacings and a method for making the same
An LED chip package structure with different LED spacing includes a substrate unit, a light-emitting unit, and a package colloid unit. The light-emitting unit has a plurality of LED chips...
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8134160 |
Chip-type LED having an insulating substrate in which a first concave hole and a second concave hole are formed
An embodiment of the present invention has an insulating substrate in which a first concave hole for mounting an LED chip and a second concave hole for connecting a metallic small-gauge wire are...
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8129739 |
Semiconductor light emitting device and semiconductor light emitting device mounted board
In a semiconductor light emitting device having a matrix of a plurality of bumps composed of one n-bump formed on an n-electrode layer and of a large number of p-bumps formed on p-electrode layers,...
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8129205 |
Solid state lighting devices and associated methods of manufacturing
Solid state lighting devices and associated methods of manufacturing are disclosed herein. In one embodiment, a solid state light device includes a light emitting diode with an N-type gallium...
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8129742 |
Semiconductor chip assembly with post/base heat spreader and plated through-hole
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a conductive trace and an adhesive. The heat spreader includes a post and a base. The conductive trace includes a...
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8129207 |
Light emitting diode having a thermal conductive substrate and method of fabricating the same
Disclosed are a light emitting diode having a thermal conductive substrate and a method of fabricating the same. The light emitting diode includes a thermal conductive insulating substrate. A...
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8120151 |
Optical semiconductor device and method for manufacturing the same
An optical semiconductor device can have a first lead for an optical semiconductor chip to be mounted on and a second lead for joining to a wire extending from the optical semiconductor chip. The...
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8119427 |
Light emitting diode die-bonding with magnetic field
In one aspect of the present invention, a method of LED die-bonding includes coating the back side of an LED chip with a magnetic material, placing the LED chip in a packaging cup such that the...
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8119502 |
Method for packaging components
The invention relates to a method for the manufacture of packaged components. The invention is based here on the problem of facilitating the application of covers with lateral dimensions that are...
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8114689 |
Method for manufacturing light emitting diode chip and light emitting diode light source module
The present invention relates to a method for manufacturing a light emitting diode (LED) chip for a chip on board and a method for manufacturing an LED light source module in a chip on board...
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8115305 |
Integrated circuit package system with thin profile
An integrated circuit package system is provided including attaching an external interconnect on a tape; attaching a backside element on the tape adjacent to the external interconnect; attaching an...
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8110437 |
Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
A radiation-emitting or -receiving semiconductor chip 9 is soft-soldered for mounting on a leadframe 2 over which a prefabricated plastic encapsulant 5, a so-called premolded package, is...
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8110446 |
Method of making a semiconductor chip assembly with a post/base heat spreader and a conductive trace
A method of making a semiconductor chip assembly includes providing a post and a base, mounting an adhesive on the base including inserting the post into an opening in the adhesive, mounting a...
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8110420 |
Light emitting element array
A method of fabricating a light emitting diode array, comprising: providing a temporary substrate; forming a first light emitting stack and a second light emitting stack on the temporary substrate;...
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8110842 |
Light-emitting diode module and manufacturing method thereof
A method for manufacturing a light-emitting diode (LED) module is provided. Plural LED package structures are formed on a substrate first. A space is located between two adjacent LED package...
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8110419 |
Process of manufacturing photovoltaic device
An inline process for manufacturing a photovoltaic device on a removable substrate is disclosed. The process discloses two semiconductor layers forming an active region; at least one of the...
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8110421 |
Light emitting device and method for manufacturing same
A method for manufacturing a light emitting device includes: forming a multilayer body including a light emitting layer so that a first surface thereof is adjacent to a first surface side of a...
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8106516 |
Wafer-level chip scale package
A chip scale package implements solder bars to form a connection between a chip and a trace, formed in a substrate, such as another chip or PCB. Solder bars are formed by depositing one or more...
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8106502 |
Integrated circuit packaging system with plated pad and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming an external interconnect; forming a first planar terminal adjacent to the external interconnect and non-planar to...
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8105854 |
LED package
A Chip on Board (COB) package which can reduce the manufacturing costs by using a general PCB as a substrate, increase a heat radiation effect from a light source, thereby realizing a high quality...
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8105871 |
Semiconductor device and manufacturing method of the same
A semiconductor device includes a semiconductor element provided over a wiring board; sealing resin configured to seal the semiconductor element; and reinforcing resin provided at least at a part...
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8101955 |
PLCC package with a reflector cup surrounded by an encapsulant
In an embodiment, the invention provides a PLCC package comprising first and second lead frames, a plastic structural body, a light source, an encapsulant, and an optical lens. The first lead frame...
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8101434 |
Method for LED-module assembly
A method for LED-module assembly comprising the steps of providing a base portion with a base inner surface and a cover with a cover inner surface which together define a module interior, the cover...
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8101962 |
Carrying structure of semiconductor
A carrying structure of semiconductor includes a carrier made of a plastic material with a heat conduction region, each surface of the carrier has an interface layer formed on, and an electrically...
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8101457 |
Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display
Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably...
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8101460 |
Semiconductor device and method of shielding semiconductor die from inter-device interference
A plurality of stacked semiconductor wafers each contain a plurality of semiconductor die. The semiconductor die each have a conductive via formed through the die. A gap is created between the...
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8097476 |
Light emitting diode and wafer level package method, wafer level bonding method thereof, and circuit structure for wafer level package
This invention discloses a light emitting diode, a wafer level package method, a wafer level bonding method, and a circuit structure for a wafer level package. The light emitting diode includes a...
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RE43112 |
Stackable ball grid array package
A stackable FBGA package is configured such that conductive elements are placed along the outside perimeter of an integrated circuit (IC) device mounted to the FBGA. The conductive elements also...
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