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6417524 |
Light emitting semiconductor device
Light emitting diodes each comprising a body of semiconductor material having a first side surface, a second side surface, and a top surface; and a stripe of conductive material over the top...
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6417034 |
Manufacturing method for organic EL device
A method for manufacturing an organic EL display device is provided, capable of improving an opening ratio and providing narrower pitches for narrowing non-lighting portion between pixels, and, at...
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6410904 |
Multi-beam emitting device
A semiconductor laser device includes a metal case. The metal case includes a brass stem and a cap that covers an upper portion of the stem and has a laser emitting hole therein. The stem is...
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6403387 |
Method and apparatus for transfer molding encapsulation of a semiconductor die with attached heat sink
A semiconductor device includes a heat sink adjacent to a die. A dam is positioned at the peripheral edges of the heat sink. During a transfer molding process, the dam serves two purposes. First,...
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6379991 |
Encapsulation methods for semiconductive die packages
The invention includes a semiconductor processing method of forming a die package. An insulative substrate is provided. Circuitry is over a topside of the substrate, and a slit extends through the...
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6376268 |
Optoelectronic assembly and method of making the same
An optoelectronic assembly having an insulating substrate with a planar surface and a metal layer bonded to the planar surface such that selected regions of the substrate are exposed and a step is...
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6355505 |
Heat sink and method of manufacturing heat sink
Heat sinks for semiconductor laser devices are manufactured by processing a surface of a panel into a mirror surface, forming a plurality of substantially parallel photomasks spaced at...
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6351027 |
Chip-mounted enclosure
A chip mounted enclosure (“CME”) comprises a base formed by an integrated circuit chip, a transducer element disposed on the integrated circuit chip, a side piece surrounding the transducer...
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6348358 |
Emitter array with individually addressable laser diodes
A linear array of diode laser emitters is manufactured with sufficient thermal and electronic isolation among the emitters to permit separate addressability. The emitter bar has first and second...
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6338973 |
Semiconductor device and method of fabrication
A mass production process for semiconductor circuits and modules using a combination of thin film platinum metallization dielectric masking, and three-dimensional laser ablation, in conjunction...
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6337265 |
Method for integration of integrated circuit devices
A method for integration of integrated circuit devices includes providing an array of first devices including dummy devices on a first chip; providing an array of contacts on a second chip;...
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6335212 |
Method of fabricating a semiconductor light-emitting element
A device and a method for fabricating said device provides a semiconductor light-emitting element having an electrode and a protective film layer that is sealed with an insulating resin, which is...
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6331447 |
High density flip chip BGA
A new method is provided for mounting high-density flip chip BGA devices. A dielectric layer is first deposited over the first surface of a metal panel. One or more thin film interconnect layers...
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6331673 |
Solar cell module having a surface side covering material with a specific nonwoven glass fiber member
A solar cell module comprising a solar cell element and at least a surface side covering material positioned on the light receiving face side of said solar cell element, said surface side covering...
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6319740 |
Multilayer protective coating for integrated circuits and multichip modules and method of applying same
Disclosed is a method of forming a multilayer opaque coating on an integrated circuit or multichip module. First, an opaque coating composition is heated to a molten state and the molten opaque...
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6319743 |
Method of making thin film piezoresistive sensor
Semiconductor piezoresistive sensors are formed by a process using selective laser activation of a doped semiconductor surface. The substrate is a flexible membrane such as a diaphragm or bellows....
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6309902 |
Method for coating semiconductor element with resin, coating resin, and liquid crystal display device
It is an object of this invention to provide a method for simply and quickly covering a semiconductor device with a coating resin. In the method for covering a semiconductor device 2 used for a...
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6287881 |
Semiconductor device with low parasitic capacitance
A method of fabricating a semiconductor device having active components grown on a substrate, involves providing a semiconductor substrate on which the active components are grown, and doping the...
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6271049 |
Method for producing an optoelectronic component
In a method for producing an optoelectronic component, a laser chip is secured to a semiconductor wafer that is provided with metal structures. Thereafter, for each laser chip, one lens-coupling...
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6258699 |
Light emitting diode with a permanent subtrate of transparent glass or quartz and the method for manufacturing the same
A method of manufacturing a light emitting diode (LED) includes growing a light emitting region on a temporary substrate, bonding a transparent substrate of glass or quartz to the light emitting...
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6255129 |
Light-emitting diode device and method of manufacturing the same
A light-emitting diode device, such as a blue, green, blue-green light-emitting diode, with a one-wire-bonding characteristic and the method of manufacturing the same have been disclosed. The...
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6251698 |
Method for making a machined silicon micro-sensor
A process for the production of microsensors machined in silicon, and in particular accelerometers for applications of assisting with navigation in aircraft, and pressure sensors. In order to...
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6245589 |
Fabrication of cooling device of a planar light source
A cooling device of a laser diode array includes a stacking of a plurality of metal plate members formed with a branched groove pattern or apertures acting as a cooling water path, by a chemical...
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6245595 |
Techniques for wafer level molding of underfill encapsulant
A method and apparatus for forming a layer of underfill encapsulant on an integrated circuit located on a wafer are described. As a flip chip, the integrated circuit has electrically conductive...
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6228672 |
Stable surface passivation process for compound semiconductors
A passivation process for a previously sulfided, selenided or tellurated III-V compound semiconductor surface. The concentration of undesired mid-gap surface states on a compound semiconductor...
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6225139 |
Manufacturing method of an led of a type of round concave cup with a flat bottom
A manufacturing method of an LED of a type of round concave cup with a flat bottom comprises two manufacturing steps. At first stage of concave cup printer circuit board, a printed circuit board is...
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6218202 |
Semiconductor device testing and burn-in methodology
A packaged semiconductor device and a method for burn-in and testing are disclosed. The package comprises a carrier having a pattern of contact pads for electrical connection, and also a pattern of...
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6218205 |
Post-process depositing shielding for microelectromechanical systems
Post-process deposition of selected material onto MEMS devices is facilitated by photolithographically incorporating deposition shields during the device fabrication process. Subsequently, simple...
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6214644 |
Flip-chip micromachine package fabrication method
To fabricate a flip-chip micromachine package, a micromachine chip is mounted as a flip chip to a substrate. The micromachine chip is attached such that a micromachine area on a first surface of...
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6194238 |
Method of manufacturing photosensitive semiconductor device
In order to prevent deterioration of adhesion between a molding resin and a lead frame and a light transmission characteristic due to the attachment of a translucent resin to an upper surface of...
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6192509 |
Method and apparatus for automatically removing acid traps from a hatched fill in a printed circuit board design
The present invention beneficially provides a method and apparatus for automatically removing acid traps from a hatched fill in a printed circuit board design. The printed circuit board design...
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6169295 |
Infrared transceiver module and method for making same
An IR transceiver module includes a lead frame, a sensor, an emitter, and a body encapsulating the sensor and emitter, where the body has an integrally formed lens aligned with both the sensor and...
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6168963 |
System for adhering parts
A system for adhering a plurality of parts to a support film is provided. The parts are positioned between a support base with a heater and a cover membrane. The cover membrane is located beneath a...
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6150187 |
Encapsulation method of a polymer or organic light emitting device
The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with...
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6144350 |
Electron generating apparatus, image forming apparatus, and method of manufacturing and adjusting the same
It is an object of this invention to provide an electron generating apparatus which is hardly influenced by variations in driving voltage, an image forming apparatus using the electron generating...
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6136622 |
Organic EL device and method of manufacturing the same
An EL device is provided by a method by forming a plurality of stripes of a first transparent electrode on a transparent substrate extending in one direction of the substrate, forming a plurality...
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6130110 |
Film carrier tape, tape carrier semiconductor device assembly, semiconductor device, and method of making the same, mounted board, and electronic device
A film carrier tape provides reduced occurrence of lead bending during the making process, and allows a chip-size package to be made with high reliability, while increasing the yield. The...
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6121067 |
Method for additive de-marking of packaged integrated circuits and resulting packages
A method for additively de-marking a packaged integrated circuit die bearing engraved marking indicia on an exterior surface thereof. The marked surface is covered with an overlayer of material to...
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6110755 |
Method for manufacturing semiconductor device
A method for producing semiconductor devices by mounting semiconductor chips 12 on a substrate 20 and resin-encapsulated the same is provided, wherein a plurality of semiconductor devices having a...
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6107606 |
Method and apparatus for measuring temperatures during electronic package assembly
A novel technique for measuring the temperature of an electronic circuit undergoing assembly packaging processes includes a non-contact infrared detector which is used to measure the temperature of...
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6103541 |
Encapsulation method of an organic electroluminescent device
An encapsulation method of organic electroluminscence device is provided. An organic electroluminescent device is formed on an indium-tin-oxide glass substrate. A metal electrode is formed on the...
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6100103 |
Highly integrated multicolor light emitting device and a method for manufacturing the same
The present invention has been made in view of the above mentioned problem, and the present invention provides a highly integrated multicolor light emitting device which emits multiple colors in a...
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6091084 |
Semiconductor light emitting device
A semiconductor light emitting device has a light emitting chip and a conductive member. A light emitting chip is formed by an insulating substrate. A semiconductor layered portion has...
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6087195 |
Method and system for manufacturing lamp tiles
A method and system for fabricating lamp tiles which include a molded body and a plurality of electrically conductive leads protruding therefrom. The lamp tiles are made by overlaying an anode lead...
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6075800 |
Bonding ridge structure laser diodes to substrates
A way of bonding a ridge-structure laser diode chip ridge face down on to a substrate with solder is disclosed in which the substrate surface includes a region facing the ridge of the laser that is...
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6063643 |
Surface-emission type light-emitting diode and fabrication process thereof
An n-type GaAs layer as a buffer layer, an n-type (Al 0 .7 Ga 0 .3) 0 .5 In 0 .5 P layer, an active layer, a p-type (Al 0 .7 Ga 0 .3) 0 .5 In 0 .5 P layer, a thin layer of Al x Ga 1 -x As layer...
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6037188 |
Method of manufacturing photosensitive semiconductor device
The present invention provides a photosensitive semiconductor device comprising a sealing body composed of a resin material for sealing photosensitive semiconductor elemental devices, a inside of...
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6031856 |
Method, article of manufacture, and optical package for eliminating tilt angle between a header and an optical emitter mounted thereon
The present invention provides a method, article of manufacture, and optical package (24) for eliminating tilt angle (40) between an optical emitter (26) mounted on a carrier (28). The method,...
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6027952 |
Method of manufacturing a string of electrically connected light emitting diodes
In a method of manufacturing a string of electrically connected light emitting diodes, there is provided a number of base members, each being made of an insulator material and including a base...
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5985684 |
Process for manufacturing a laser diode having a heat sink
A process for manufacturing a laser diode package including a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and...
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