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8183613 |
Bipolar transistor for a memory array
A memory device includes an insulation layer, an active pattern, a gate insulation layer and a gate electrode. The insulation layer is formed on a substrate. The active pattern is formed on the...
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8183111 |
Method of fabricating conductive electrodes on the front and backside of a thin film structure
A method of fabricating a thin film device having conductive front and backside electrodes or contacts. Top-side cavities are first formed on a first dielectric layer, followed by the deposition of...
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8178406 |
Split gate device and method for forming
A method of making a semiconductor device on a semiconductor layer includes forming a select gate, a recess, a charge storage layer, and a control gate. The select gate is formed have a first...
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8178405 |
Resistor random access memory cell device
A memory cell device has a bottom electrode and a top electrode, a plug of memory material in contact with the bottom electrode, and a cup-shaped conductive member having a rim that contacts the...
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8178407 |
Systems and methods for a high density, compact memory array
A memory array comprising vertical memory cells does not require any isolation layers between cells. Thus, a very compact, high density memory array can be achieved. Each memory cell in the memory...
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8178408 |
Methods of manufacturing charge trap-type non-volatile memory devices
Some methods are directed to manufacturing charge trap-type non-volatile memory devices. An isolation layer pattern can be formed that extends in a first direction in a substrate. A recess unit is...
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8173508 |
Semiconductor device having vertical type MOSFET and manufacturing method thereof
A method (and resultant structure) includes forming a semiconductor layer having plural stripe-like trenches, forming a gate electrode buried partially in each of the plural trenches, and...
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8173509 |
Semiconductor device and method for manufacturing the same
A type semiconductor device includes: a first semiconductor layer of a first conductivity type; a second semiconductor layer of a second conductivity type; a third semiconductor layer of the first...
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8173505 |
Method of making a split gate memory cell
A method includes forming a first layer of gate material over a semiconductor substrate; forming a hard mask layer over the first layer; forming an opening; forming a charge storage layer over the...
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8173506 |
Method of forming buried gate electrode utilizing formation of conformal gate oxide and gate electrode layers
A method of forming a buried gate electrode prevents voids from being formed in a silicide layer of the gate electrode. The method begins by forming a trench in a semiconductor substrate, forming a...
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8168999 |
Semiconductor device having IGBT and diode
A semiconductor device includes: a substrate; an active element cell area including IGBT cell region and a diode cell region; a first semiconductor region on a first side of the substrate in the...
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8168494 |
Trench MOS transistor and method of manufacturing the same
Trench portions (10) are formed in a well (5) in order to provide unevenness in the well (5). A gate electrode (2) is formed via an insulating film (7) on the upper surface and inside of the trench...
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8163617 |
Vertical channel type non-volatile memory device and method for fabricating the same
A method for fabricating a vertical channel type non-volatile memory device including forming a source region, alternately forming a plurality of interlayer dielectric layers and a plurality of...
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8163614 |
Method for forming NAND typed memory device
A method for fabricating a NAND type flash memory device includes defining a select transistor region and a memory cell region in a semiconductor substrate, forming a tunnel insulating layer, a...
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8159025 |
Gate electrode in a trench for power MOS transistors
A trench-typed power MOS transistor comprises a trench-typed gate area, which includes a gate conductor and an isolation layer. A thin sidewall region of the isolation layer is formed between the...
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8153489 |
Method for fabricating semiconductor device with buried gates
A method for fabricating a semiconductor device, including forming a trench by etching a semiconductor substrate, forming a gate insulation layer over a surface of the trench, forming a gate...
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8148767 |
Semiconductor memory devices including recess-type control gate electrodes and methods of fabricating the semiconductor memory devices
A semiconductor memory device includes a semiconductor substrate, a control gate electrode recessed in the semiconductor substrate, a storage node layer interposed between a sidewall of the control...
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8148758 |
High voltage semiconductor device with JFET regions containing dielectrically isolated junctions and method of fabricating the same
A high-voltage field-effect device contains an extended drain or “drift” region including an embedded stack of JFET regions separated by intervening layers of the drift region. Each of the JFET reg...
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8143125 |
Structure and method for forming a salicide on the gate electrode of a trench-gate FET
A method for forming a trench-gate FET includes the following steps. A plurality of trenches is formed extending into a semiconductor region. A gate dielectric is formed extending along opposing...
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8143123 |
Methods of forming inter-poly dielectric (IPD) layers in power semiconductor devices
A method for forming power semiconductor devices having an inter-electrode dielectric (IPD) layer inside a trench includes providing a semiconductor substrate with a trench, lining the sidewalls...
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8138077 |
Flash memory device and method of fabricating the same
A flash memory device includes an isolation layer formed on an isolation region of a semiconductor substrate, a tunnel insulating layer formed on an active region of the semiconductor substrate, a...
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8134199 |
Nonvolatile semiconductor memory
A nonvolatile semiconductor memory fabrication method including forming a first insulating film and a floating gate electrode material on a semiconductor substrate; forming a gate insulating film...
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8129238 |
Semiconductor devices having dual trench, methods of fabricating the same, and electronic system having the same
A semiconductor device having a dual trench and methods of fabricating the same, a semiconductor module, an electronic circuit board, and an electronic system are provided. The semiconductor device...
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8129241 |
Method for forming a shielded gate trench FET
A method for forming a shielded gate field effect transistor (FET) includes forming a plurality of trenches in a semiconductor region and forming a shield electrode in a bottom portion of each...
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8120085 |
Semiconductor device and method for manufacturing the same
A semiconductor device includes: a channel region extending substantially perpendicular to a main surface of a semiconductor substrate; a first diffusion layer provided on a bottom of the channel...
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8120100 |
Overlapping trench gate semiconductor device
An overlapping trench gate semiconductor device includes a semiconductor substrate, a plurality of shallow trenches disposed on the semiconductor substrate, a first conductive layer disposed in the...
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8120075 |
Semiconductor device with improved trenches
A semiconductor device exhibiting enhanced carrier mobility within a channel region of the semiconductor device is disclosed. The semiconductor device includes a gate stack having first and second...
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8119482 |
MOSFET using gate work function engineering for switching applications
This invention discloses a new MOSFET device. The MOSFET device has an improved operation characteristic achieved by manufacturing a MOSFET with a higher gate work function by implementing a...
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8120101 |
Semiconductor constructions and transistors, and methods of forming semiconductor constructions and transistors
The invention includes a transistor device having a semiconductor substrate with an upper surface. A pair of source/drain regions are formed within the semiconductor substrate and a channel region...
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8120083 |
Polymer-based ferroelectric memory
Apparatus and systems may comprise electrode structures that include two or more dissimilar and abutting metal layers on a surface, some of the electrode structures separated by a gap; and a...
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8097509 |
Method for manufacturing semiconductor device with a recessed channel
A semiconductor device having a recessed channel and a method for manufacturing the same. The semiconductor device comprises a semiconductor substrate formed with an isolation layer defining an...
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8093125 |
Manufacturing method of capacitor in semiconductor device
Example embodiment is provided to a method for manufacturing a semiconductor device, including forming a hard mask layer on a buried bit line and forming a storage node contact hole by using the...
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8089123 |
Semiconductor device comprising transistor structures and methods for forming same
A method for forming an opening within a semiconductor material comprises forming a neck portion, a rounded portion below the neck portion and, in some embodiments, a protruding portion below the...
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8088660 |
Method for producing a plug in a semiconductor body
A method for producing an electrode in a semiconductor layer includes providing a substrate with a first surface and a second surface, forming a first trench having sidewalls and extending into the...
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8084326 |
Method for manufacturing semiconductor device
The present invention relates to a method for manufacturing a semiconductor device, and provides to reduce a contact resistance of a landing plug by forming the landing plug in such a manner that a...
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8084325 |
Semiconductor device and method for fabricating the same
A semiconductor device can prevent exposure of an inner wall of a recess pattern caused by misalignment between masks. A gate electrode is formed inside the recess pattern so that only a gate hard...
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8084320 |
Non-volatile memory and method for fabricating the same
A non-volatile memory is described, which includes gate structures, doped regions, second spacers and contact plugs. The gate structures are disposed on the substrate, each of which includes a...
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8080459 |
Self aligned contact in a semiconductor device and method of fabricating the same
A method of fabricating a self-aligned contact in a semiconductor device, in accordance with one embodiment of the present invention, includes etching a trench in a core area and partially...
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8080457 |
Fabrication method of power semiconductor structure with low gate charge
A fabrication method of a trenched power semiconductor structure with low gate charge is provided. Firstly, a substrate is provided. Then, a gate trench is formed in the substrate. Afterward, a...
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8076203 |
Semiconductor device and method of manufacturing the same
A polysilicon film is formed all over a surface of a semiconductor substrate, then is subject to a CMP process through a mask pattern as a stopper. Then, a metal film is formed all over the...
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8071445 |
Method for manufacturing semiconductor device, and semiconductor device
In a transistor region, a source interconnect layer and a gate electrode are buried in trenches. A source extending region is provided adjacent to the transistor region or in the transistor region,...
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8072024 |
Nonvolatile semiconductor memory device and method for manufacturing same
A nonvolatile semiconductor memory device with a substrate. A plurality of dielectric films and electrode films are alternately stacked on the substrate and have a through hole penetrating in the...
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8071412 |
Method of fabricating micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8072036 |
Micro-electromechanical system microphone structure
A method of fabricating a micro-electromechanical system microphone structure is disclosed. First, a substrate defining a MEMS region and a logic region is provided, and a surface of the substrate...
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8058140 |
Thickened sidewall dielectric for memory cell
Methods and devices are disclosed, such as those involving memory cell devices with improved charge retention characteristics. In one or more embodiments, a memory cell is provided having an active...
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8058119 |
Device scheme of HKMG gate-last process
The present disclosure provides a method for making metal gate stacks of a semiconductor device. The method includes forming a high k dielectric material layer on a semiconductor substrate; forming...
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8053313 |
Semiconductor device and method of fabricating the same
In a method of fabricating a semiconductor device on a substrate having a pillar pattern, a gate electrode is formed on the pillar pattern without etching the latter. A conductive pattern is filled...
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8053286 |
Method of forming semiconductor device including trench gate structure
A method of forming a semiconductor device is provided, which may include, but is not limited to, the following processes. Grooves may be formed in an insulating region and in a semiconductor...
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8048739 |
Method of manufacturing flash memory device
According to yet another embodiment, a method for forming a non-volatile memory device includes etching a substrate to form first and second trenches. The first and second trenches are filled with...
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8043913 |
Method of forming trench-gate field effect transistors
A method of forming a field effect transistor includes: forming a trench in a semiconductor region; forming a shield electrode in the trench; performing an angled sidewall implant of impurities of...
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