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7611947 |
Method of manufacturing semiconductor device
A method of manufacturing a semiconductor device of the present invention consists of forming a trench in a trench-type cell transistor region; forming a gate insulating film and a gate material...
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7611943 |
Transistors, integrated circuits, systems, and processes of manufacture with improved work function modulation
A process ( 200 ) for making integrated circuits with a gate, uses a doped precursor ( 124, 126 N and/or 126 P) on barrier material ( 118 ) on gate dielectric ( 116 ). The process ( 200 ) involves...
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7595234 |
Fabricating method for a metal oxide semiconductor transistor
A method for forming a metal oxide semiconductor (MOS) transistor is provided. First, a gate structure is formed over a substrate. Then, offset spacers are formed on respective sidewalls of the...
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7592222 |
Method of fabricating flash memory device
The present invention relates to a method of fabricating a flash memory device. According to a method of fabricating a flash memory device in accordance with an aspect of the present invention, a...
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7582502 |
Method for manufacturing back side illumination image sensor
Provided are methods for manufacturing a back side illumination image sensor. In one method, an ion implantation layer is formed in an entire region of a front side of a first substrate. A device...
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7569457 |
Method of fabricating semiconductor device
An implantation step of a dopant ion for forming source and drain regions (S and D) is divided into one implantation of a dopant ion for forming a p/n junction with a well region ( 3 ), and one...
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7563663 |
Method of manufacturing semiconductor device with offset sidewall structure
A method of manufacturing a semiconductor device with NMOS and PMOS transistors is provided. The semiconductor device can lessen a short channel effect, can reduce gate-drain current leakage, and...
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7550357 |
Semiconductor device and fabricating method thereof
A semiconductor device with a low drain current in the off-state of LDD type accommodating high voltages is provided. On the thermal oxide film, a polysilicon film and a CVD oxide film, and a...
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7550351 |
Structure and method for creation of a transistor
The invention is directed to an improved transistor that reduces dopant cross-diffusion and improves chip density. A first embodiment of the invention comprises gate electrode material partially...
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7547592 |
PMOS depletable drain extension made from NMOS dual depletable drain extensions
In accordance with an embodiment of the invention, there is an integrated circuit device having a complementary integrated circuit structure comprising a first MOS device. The first MOS device...
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7544561 |
Electron mobility enhancement for MOS devices with nitrided polysilicon re-oxidation
A semiconductor structure includes a PMOS device and an NMOS device. The PMOS device includes a first gate dielectric on a semiconductor substrate, a first gate electrode on the first gate...
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7534677 |
Method of fabricating a dual gate oxide
A method of fabricating a dual gate oxide of a semiconductor device includes forming a first gate insulation layer over an entire surface of a substrate, removing a portion of the first gate...
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7504295 |
Methods for fabricating dynamic random access memory cells having laterally offset storage nodes
DRAM cells include a common drain region in an integrated circuit substrate and first and second source regions in the integrated circuit substrate, a respective one of which is laterally offset...
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7473595 |
Method for decreasing PN junction leakage current of dynamic random access memory
A method for decreasing a PN junction leakage current of a dynamic random access memory (DRAM), including the steps of: preparing an NMOS transistor formed on a P-type silicon substrate and...
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7465623 |
Methods for fabricating a semiconductor device on an SOI substrate
Methods are provided for fabricating an SOI component on a semiconductor layer/insulator/substrate structure including a diode region formed in the substrate. The method comprises, in accordance...
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7432144 |
Method for forming a transistor for reducing a channel length
A method of forming a transistor including: forming a gate oxide layer pattern and gate polysilicon layer pattern on a silicon substrate; forming a low energy ion implantation region aligned with...
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7419867 |
CMOS gate structure comprising predoped semiconductor gate material with improved uniformity of dopant distribution and method of forming the structure
By predoping of a layer of deposited semiconductor gate material by incorporating dopants during the deposition process, a high uniformity of the dopant distribution may be achieved in the gate...
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7419863 |
Fabrication of semiconductor structure in which complementary field-effect transistors each have hypoabrupt body dopant distribution below at least one source/drain zone
Complementary IGFETs ( 210 W and 220 W or 530 and 540 ) are fabricated so that the body dopant concentration in each IGFET decreases by at least 10 in moving from a subsurface location in the...
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7399670 |
Methods of forming different gate structures in NMOS and PMOS regions and gate structures so formed
A method of forming transistor gate structures in an integrated circuit device can include forming a high-k gate insulating layer on a substrate including a first region to include PMOS transistors...
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7396717 |
Method of forming a MOS transistor
A method of forming a MOS transistor, in which a co-implantation is performed to implant an implant into a source region and a drain region or a halo implanted region to effectively prevent dopants...
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7390719 |
Method of manufacturing a semiconductor device having a dual gate structure
A semiconductor device having a dual gate is formed on a substrate having a dielectric layer. A first metallic conductive layer is formed on the dielectric layer to a first thickness, and annealed...
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7358131 |
Methods of forming SRAM constructions
The invention includes SRAM constructions comprising at least one transistor device having an active region extending into a crystalline layer comprising Si/Ge. A majority of the active region...
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7332389 |
Selective polysilicon stud growth
A memory cell having a bit line contact is provided. The memory cell may be a 6F 2 memory cell. The bit line contact may have a contact hole bounded by insulating sidewalls, and the contact hole...
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7285449 |
Semiconductor device manufacture method including process of implanting impurity into gate electrode independently from source /drain and semiconductor device manufactured by the method
A gate electrode made of semiconductor is formed on the partial surface area of a semiconductor substrate. A mask member is formed on the surface of the semiconductor substrate in an area adjacent...
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7282403 |
Temperature stable metal nitride gate electrode
An integrated circuit is provided including an FET gate structure formed on a substrate. This structure includes a gate dielectric on the substrate, and a metal nitride layer overlying the gate...
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7276407 |
Method for fabricating semiconductor device
A method for fabricating a semiconductor device including on a single semiconductor substrate, a first MOS transistor having a first gate insulating film of a predetermined thickness, and second...
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7265011 |
Method of manufacturing a transistor
A method of manufacturing a transistor according to some embodiments includes sequentially forming a dummy gate oxide layer and a dummy gate electrode on an active region of a semiconductor...
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7259054 |
Method of manufacturing a semiconductor device that includes a process for forming a high breakdown voltage field effect transistor
With the objective of suppressing or preventing a kink effect in the operation of a semiconductor device having a high breakdown voltage field effect transistor, n + type semiconductor regions,...
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7253050 |
Transistor device and method of manufacture thereof
Methods of forming CMOS devices and structures thereof. A workpiece is provided having a first region and a second region. A high k gate dielectric material is formed over the workpiece. A first...
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7144767 |
NFETs using gate induced stress modulation
A method for manufacturing an integrated circuit comprising a plurality of semiconductor devices including an n-type field effect transistor and a p-type field effect transistor by covering the...
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7132340 |
Application of post-pattern resist trim for reducing pocket-shadowing in SRAMs
Methods ( 600, 700 ) are disclosed for minimizing the effect of pocket shadowing in the fabrication of an angled pocket implant ( 32 ) extending underlying a gate region ( 21 ) of a transistor ( 10...
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7112480 |
Method and structure for a low voltage CMOS integrated circuit incorporating higher-voltage devices
A CMOS integrated circuit ( 15 A-B-C) includes both relatively low-power ( 124, 126 ) and high-power ( 132, 134 ) CMOS transistors on the same chip. A 20V, relatively high-power PMOS device ( 134 )...
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7098146 |
Semiconductor device having patterned SOI structure and method for fabricating the same
A method for fabricating a semiconductor device, including forming a first insulation film, a first semiconductor layer, and a second insulation film in sequence in first to third regions of a...
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7098099 |
Semiconductor device having optimized shallow junction geometries and method for fabrication thereof
The present invention provides, in one embodiment, a method of fabricating a semiconductor device ( 100 ). In one embodiment, the method includes growing an oxide layer 120 from a substrate 104,...
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7078303 |
Method for manufacturing semiconductor device having thick insulating layer under gate side walls
A semiconductor device includes a semiconductor substrate, a silicon oxide layer formed on the semiconductor substrate, a gate electrode formed over the silicon oxide layer, and a side wall...
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7067370 |
Method of manufacturing a MOS transistor of a semiconductor device
A method of manufacturing a transistor of a semiconductor device is provided. The method includes forming an N type gate pattern and a P type gate pattern on a substrate, implanting N type...
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7064026 |
Semiconductor device having shared contact and fabrication method thereof
Semiconductor devices and methods of fabrication. A device includes a semiconductor substrate, a gate electrode insulated from the semiconductor substrate by a gate insulation layer, LDD-type...
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7063991 |
Methods of determining characteristics of doped regions on device wafers, and system for accomplishing same
Disclosed herein are various methods of determining characteristics of doped regions on device wafers, and a system for accomplishing same. In one illustrative embodiment, the method includes...
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7056798 |
Semiconductor device, method for manufacturing the same, and liquid jet apparatus
A semiconductor device in which electro-thermal conversion elements and switching devices for flowing currents through the elements are integrated on a first conductive type semiconductor...
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7045427 |
Polysilicon gate doping level variation for reduced leakage current
A method for fabricating a transistor on a semiconductor substrate includes varying a polysilicon doping level near a first and second edge of a diffusion region with a polysilicon doping level of...
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7045412 |
Field-effect type semiconductor device for power amplifier
In a semiconductor multi-layer structure in which a first SiGe layer having a first conductivity-type and high impurity concentration, a second SiGe layer having the first conductivity-type and a...
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7041549 |
Method for manufacturing semiconductor device
In a method for manufacturing a semiconductor device, a gate insulating film and a gate electrode are first formed on a substrate. Next, Ge ions, Si ions, or the like are implanted to make the...
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6953732 |
Method of manufacturing a semiconductor device including a mosfet with nitride sidewalls
A method of manufacturing a semiconductor device includes providing a semiconductor substrate, and then forming a gate insulating layer on the semiconductor substrate. A lower gate electrode layer...
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6933188 |
Use of a selective hard mask for the integration of double diffused drain MOS devices in deep sub-micron fabrication technologies
A process for integrating the fabrication of double diffused drain (DDD) MOSFET devices with the fabrication sub-micron CMOS devices, has been developed. The process features formation of an...
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6929995 |
Method of forming high voltage metal oxide semiconductor transistor
A polysilicon layer and a first patterned photoresist layer are formed on a substrate. An ultraviolet curing process is performed to cure the first patterned photoresist layer. Then, a gate...
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6924180 |
Method of forming a pocket implant region after formation of composite insulator spacers
A process for forming a MOSFET device featuring a pocket region placed adjacent to only a top portion of the sides of a heavily doped source/drain region, has been developed. The process features...
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6913979 |
Method of manufacturing a metal oxide semiconductor transistor
Disclosed is a method of manufacturing a MOS transistor having an enhanced reliability. A passivation layer is formed on a gate electrode and on a substrate to prevent a generation of a recess on...
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6908800 |
Tunable sidewall spacer process for CMOS integrated circuits
A mixed voltage CMOS process for high reliability and high performance core transistors and input-output transistors with reduced mask steps. A gate stack ( 30 ) is formed over the silicon...
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6894356 |
SRAM system having very lightly doped SRAM load transistors for improving SRAM cell stability and method for making the same
A static random access memory (SRAM) cell is given increased stability and latch-up immunity by fabricating the PMOS load transistors of the SRAM cell to have a very low drain/source dopant...
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6884672 |
Method for forming an electronic device
Under the present invention, a layer of amorphous silicon is formed over a layer of gate dielectric. Over the layer of amorphous silicon, a gate cap dielectric is formed. The layer of amorphous...
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