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8421116 Light emitting device and method for manufacturing the same  
The light emitting device of the invention comprises a first electrode, a second electrode being light transmitting, and a carrier sandwiched between the first electrode and the second electrode...
8421097 Organic light emitting diode display device  
An organic light emitting diode display includes a substrate main body, a plurality of organic light emitting diodes formed on the substrate main body, and a differential capping layer covering the...
8421105 Semiconductor light-emitting device and method for fabricating the same  
A semiconductor light-emitting device is provided. The semiconductor light-emitting device may include a light-emitting structure, an electrode, an ohmic layer, an electrode layer, an adhesion...
8420502 Group III-V semiconductor device and method for producing the same  
A method for producing a Group III-V semiconductor device, includes forming, on a base, a plurality of semiconductor devices isolated from one another, forming, through ion implantation, a...
8420426 Method of manufacturing a light-emitting device  
To provide a light-emitting device using a nitride semiconductor which can attain high-power light emission by highly efficient light emission, a method of manufacturing the light-emitting device...
8420419 Group-III nitride semiconductor laser device, and method for fabricating group-III nitride semiconductor laser device  
A method of fabricating a III-nitride semiconductor laser device includes: preparing a substrate product, where the substrate product has a laser structure, the laser structure includes a...
8415180 Method for fabricating wafer product and method for fabricating gallium nitride based semiconductor optical device  
Provided is a method for fabricating a wafer product including an active layer grown on a gallium oxide substrate and allowing an improvement in emission intensity. In step S105, a buffer layer 13...
8415241 Method of manufacturing silicon carbide semiconductor device  
A silicon carbide substrate having a substrate surface is prepared. An insulating film is formed to cover a part of the substrate surface. A contact electrode is formed on the substrate surface, so...
8415181 Light emitting element with improved light extraction efficiency, light emitting device comprising the same, and fabricating method of the light emitting element and the light emitting device  
Provided is a light emitting element, a light emitting device including the same, and fabrication methods of the light emitting element and light emitting device. The light emitting device...
8415179 Method for manufacturing light emitting diode  
A light emitting diode and a light emitting diode (LED) manufacturing method are disclosed. The LED comprises a substrate; a first n-type GaN layer; a second n-type GaN layer; an active layer; and...
8415185 Process for making a slot-type optical waveguide on silicon  
In a process for fabrication of an optical slot waveguide on silicon, a thin single-crystal silicon film is deposited on a substrate covered with an insulating buried layer; a local thermal...
8409897 Production method of red light emitting semiconductor device  
Disclosed are: an environmentally friendly red light-emitting semiconductor element which operates at low voltage, while having sufficient luminous efficiency and sufficient luminous intensity; and...
8409886 Method of producing image display unit  
A method of producing the image display unit, wherein the image display unit includes an array of a plurality of light emitting devices for displaying an image, and wherein the method of producing...
8410487 Manufacturing method and structure of LED chip  
A manufacturing method and a structure of a light-emitting diode (LED) chip are disclosed. The method includes the steps of: providing a conductive block; providing an epitaxial block; bonding;...
8404505 Nitride light emitting device of using substrate decomposition prevention layer and manufacturing method of the same  
A light-emitting device is provided with a substrate decomposition prevention layer using as a matrix at least one selected from the group consisting of boron nitride (B—N), silicon carbide (...
8405084 Organic light emitting diode display and method for manufacturing the same  
An organic light emitting diode display includes a substrate main body, a polysilicon semiconductor layer on the substrate main body, a gate insulating layer covering the semiconductor layer, and a...
8404500 Method for manufacturing light-emitting element, light-emitting element, light-emitting device, lighting device, and electronic appliance  
One object is to provide a light-emitting element which overcomes the problems of electrical characteristics and a light reflectivity have been solved. The light-emitting element is manufactured by...
8399269 LED flip-chip package structure with dummy bumps  
A light-emitting device (LED) package component includes an LED chip having a first active bond pad and a second active bond pad. A carrier chip is bonded onto the LED chip through flip-chip...
8399946 Solid-state imaging device and manufacturing method thereof  
According to one embodiment, a solid-state imaging device includes a semiconductor substrate of a first conductive type having a diffusion layer region provided on a surface thereof, a diffusion...
8399267 Methods for packaging light emitting devices and related microelectronic devices  
A method for forming a light emitting device includes providing a light emitting diode (LED) configured to emit light of a first color and providing a plurality of semi-spherical lenses made of a...
8399268 Deposition of phosphor on die top using dry film photoresist  
A method for depositing a layer of phosphor-containing material on a plurality of LED dies includes disposing a template with a plurality of openings on an adhesive tape and disposing each of a...
8394652 Method for manufacturing substrate for semiconductor light emitting element and semiconductor light emitting element using the same  
A light emitting element having a recess-protrusion structure on a substrate is provided. A semiconductor light emitting element 100 has a light emitting structure of a semiconductor 20 on a first...
8395165 Laterally contacted blue LED with superlattice current spreading layer  
A laterally contacted blue LED device involves a PAN structure disposed over an insulating substrate. The substrate may be a sapphire substrate that has a template layer of GaN grown on it. The PAN...
8394653 Method for fabricating semiconductor lighting chip  
A method for fabricating a semiconductor lighting chip includes steps of: providing a substrate with a first block layer dividing an upper surface of the substrate into a plurality of epitaxial...
8394670 Vertical diodes for non-volatile memory device  
A steering device. The steering device includes an n-type impurity region comprising a zinc oxide material and a p-type impurity region comprising a silicon germanium material. A pn junction region...
8389303 Organic EL element and method of manufacturing the same  
A method of manufacturing an organic EL element having a corrugated structure, the organic EL element comprising a transparent supporting substrate, a transparent electrode, an organic layer, and a...
8390009 Light-emitting diode (LED) package systems  
A package system includes a substrate having at least one first thermally conductive structure through the substrate. At least one second thermally conductive structure is disposed over the at...
8389395 Method for manufacturing semiconductor optical device  
A method for manufacturing includes the steps of forming a BCB resin region on a semiconductor optical device; processing a surface of the BCB resin region with inductively coupled plasma produced...
8389304 Method for producing group III nitride semiconductor light-emitting device  
The present invention provides a method for producing a Group III nitride semiconductor light-emitting device, the device including a light-emitting layer which is formed so as to contour a...
8390015 Organic EL element, organic EL display apparatus, and manufacturing method of organic EL element  
An organic EL element includes a substrate and a light refractive layer, a first transparent electrode layer, an insulation layer, a hole transport layer, and a photosensitive resin layer stacked...
8389305 Techniques of forming ohmic contacts on GaN light emitting diodes  
A method of forming ohmic contacts on a light emitting diode that features a surface treatment of a substrate includes exposing a surface of a p-type gallium nitride layer to an acid-containing...
8390007 Semiconductor light emitting device and method of fabricating semiconductor light emitting device  
A semiconductor light emitting device has a light emitting element, and first and second electrodes. The light emitting element has a nitride-based III-V compound semiconductor on a substrate. The...
8390011 Single or multi-color high efficiency light emitting diode (LED) by growth over a patterned substrate  
An opto-electronic device, and a method of fabricating same, wherein the device has a patterned layer that includes a patterned, pierced or perforated mask, and an active layer formed over the...
8389368 Method for producing a conductive nanoparticle memory device  
A method for producing a memory device with nanoparticles, including steps of: a) forming, in a substrate based on at least one semi-conductor, source and drain regions, and at least one first...
8389302 Method for measuring optoelectronic memory device  
A method for measuring an optoelectronic memory device, includes: grounding a source electrode of the optoelectronic memory device; applying a drain electrode voltage to a drain electrode of the...
8389313 Deposition method of III group nitride compound semiconductor laminated structure  
The present invention provides a deposition method of a multilayered structure composed of a III group nitride compound semiconductor having good crystallinity on a substrate. The multilayered...
8384121 Electronic devices with yielding substrates  
In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the...
8383454 Charge injection and transport layers  
Compositions for use in hole transporting layers (HTLs) or hole injection layers (HILs) are provided, as well as methods of making the compositions and devices fabricated from the compositions....
8383431 Organic light-emitting diode and method of manufacturing the same  
An organic light emitting diode (OLED) including: a substrate; a reflection layer on the substrate and including metal; a first electrode on the reflection layer and including a light transparent...
8383435 Integrated photonic semiconductor devices and methods for making integrated photonic semiconductor devices  
A photonic semiconductor device and method are provided that ensure that the surface of the device upon completion of the SAG process is planar, or at least substantially planar, such that...
8384096 Semiconductor component with optically active regions which provides high optical output power, and method for producing same  
A semiconductor component comprising at least one optically active first region (112) for emitting electromagnetic radiation (130) in at least one emission direction and at least one optically...
8384109 Semiconductor light-emitting device  
A semiconductor light-emitting device including a substrate, an n-type semiconductor layer formed on the substrate, an active layer laminated on the n-type semiconductor layer and capable of...
8377802 III-V semiconductor structures and methods for forming the same  
Embodiments of the invention relate to methods of fabricating semiconductor structures, and to semiconductor structures fabricated by such methods. In some embodiments, the methods may be used to...
8378372 Semiconductor chip assembly with post/base heat spreader and horizontal signal routing  
A semiconductor chip assembly includes a semiconductor device, a heat spreader, a substrate and an adhesive. The semiconductor device is electrically connected to the substrate and thermally...
8377724 Method for producing semiconductor light-emitting element  
A semiconductor light-emitting element includes, a first semiconductor layer, a second semiconductor layer, a light-emitting layer provided between the first semiconductor layer and the second...
8373192 Semiconductor light emitting device  
According to one embodiment, a semiconductor light emitting device includes a plurality of semiconductor layers, a first electrode, a second electrode, an insulating layer, a first interconnection...
8373181 Method and device for a cathode structure for flexible organic light emitting diode (OLED) device  
A method for making a flexible OLED lighting device includes forming a plurality of OLED elements on a flexible planar substrate, wherein at least one of the OLED elements includes a continuous...
8372668 Light-emitting device and method for manufacturing the same  
In a manufacturing method of a light-emitting device, a separation layer is formed over a substrate; a semiconductor circuit element layer and first electrodes are formed over the separation layer;...
8367435 Methods and apparatus for control of hydrothermal nanowire synthesis  
In exemplary implementations of this invention, hydrothermal synthesis of zinc oxide nanowires is morphologically controlled. Metal complex ions are used to suppress growth in a face-selective...
8368108 Light emitting element housing package  
A light emitting element housing package comprises a ceramic substrate on which a light emitting element is mounted, and a wiring pattern that is formed on the ceramic substrate and to which a...