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7300809 |
Optically pumped edge-emitting semiconductor laser
A multilayer semiconductor laser includes a substrate on which is formed a semiconductor multilayer heterostructure divided into a plurality of electrically pumped regions and an elongated...
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7300808 |
Optically pumped, surface-emitting semiconductor laser device and method for the manufacture thereof
The invention is directed to an optically pumped surface-emitting semiconductor laser device having at least one radiation-generating quantum well structure and at least one pump radiation source...
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7297564 |
Fabrication of vertical sidewalls on (110) silicon substrates for use in Si/SiGe photodetectors
A method of fabricating vertical sidewalls on silicon (110) substrates for use in Si/SiGe photodetectors includes preparing a silicon (110) layer wherein the silicon (110) plane is parallel to an...
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7297562 |
Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
A circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns provides a high-density mounting and interconnect structure for...
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7294517 |
Light emitting device and method of fabricating the same
It is characteristic of an organic material suited to an interlayer insulating film to transmit vapor therethrough and to be liable to absorb moisture, and the material has a disadvantage that it...
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7291865 |
Light-emitting semiconductor device
A flip-chip type of Group III nitride based compound semiconductor light-emitting device comprises a transparent conductive film 10 made of ITO on a p-type contact layer. On the transparent...
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7291529 |
Methods of processing semiconductor wafer backsides having light emitting devices (LEDs) thereon
Processing a semiconductor wafer can include forming a plurality of Light Emitting Devices (LED) on a semiconductor wafer having a first thickness. The plurality of LEDs on the wafer are brought...
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7288793 |
Semiconductor laser
A light emitting layer forming section ( 8 ) including an n-type conductivity type clad layer ( 2 ), an active layer ( 3 ) and p-type conductivity type clad layers ( 4 ) and ( 6 ) is laminated on a...
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7285432 |
Structure and method of fabricating organic devices
A method of fabricating an organic light emitting device is provided. A first organic layer is deposited over a first electrode. A second organic layer comprising a small molecule organic material...
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7285431 |
Method for manufacturing a GaN based LED of a black hole structure
This invention relates to a method for manufacturing a GaN based LED of a back hole structure, and the method comprises: epitaxially growing an N type GaN layer, a multi-quantum wells emitting...
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7285834 |
Process for producing microelectromechanical components and a housed microelectromechanical component
A process produces microelectromechanical components from a substrate that has a first side and a second side which is substantially opposite from the first side, and at least the first side has at...
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7282379 |
Nitride semiconductor, semiconductor device, and method of manufacturing the same
Provided is a nitride semiconductor having a larger low-defective region on a surface thereof, a semiconductor device using the nitride semiconductor, a method of manufacturing a nitride...
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7282422 |
Overlay key, method of manufacturing the same and method of measuring an overlay degree using the same
An overlay key includes a first overlay key having a first main overlay pattern and a first auxiliary pattern, and a second overlay key having a second main overlay pattern and a second auxiliary...
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7279344 |
Method of forming a nitride-based semiconductor
A nitride-based semiconductor element having excellent element characteristics is obtained by forming a nitride-based semiconductor layer having excellent crystallinity without performing a long...
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7276742 |
Compound semiconductor light emitting device and its manufacturing method
A compound semiconductor light emitting device for preparing a chip which improves the light extraction efficiency, enables mounting of easy positioning with only once wire bonding, and leads to a...
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7271024 |
Method for fabricating sensor semiconductor device
A sensor semiconductor device and a method for fabricating the same are proposed. A plurality of metal bumps and a sensor chip are mounted on a substrate. A dielectric layer and a circuit layer are...
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7271417 |
Light-emitting element with porous light-emitting layers
The invention relates to a light-emitting element with porous light-emitting layers. The light-emitting element comprises: a substrate, a first conductive cladding layer, a second conductive...
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7271020 |
Light emitting diode covered with a reflective layer and method for fabricating the same
A light emitting diode (LED) covered with a reflective layer by imprinting process is provided. The imprinting process includes coating a plastic layer on a mold to form an imprinting substrate;...
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7271019 |
Lateral heat spreading layers for epi-side up ridge waveguide semiconductor lasers
Disclosed are a semiconductor device and method of manufacturing the same comprising a substrate, a mesa region adjacent to the substrate, an electroplated metal layer, for reducing the thermal...
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7268368 |
Semiconductor package having optical receptacles and light transmissive/opaque portions and method of making same
A semiconductor package and method for forming the same is disclosed herein. The semiconductor package includes a package support member, a pair of optoelectronic devices spaced from each other and...
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7265389 |
Light emitting diode and fabricating method thereof
A method for fabricating a light emitting diode (LED) is provided. Successively forming a first type doped semiconductor layer, a light emitting layer and a second type doped semiconductor layer on...
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7264527 |
Quantum dot white and colored light-emitting devices
A light-emitting device comprising a population of quantum dots (QDs) embedded in a host matrix and a primary light source which causes the QDs to emit secondary light and a method of making such a...
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7262440 |
Light emitting diode package and fabrication method thereof
The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation...
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7258838 |
Solid state molecular probe device
A solid state nanopore device including two or more materials and a method for fabricating the same. The device includes a solid state insulating membrane having an exposed surface, a conductive...
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7259034 |
Self-alignment manufacturing method of the microlens and the aperture using in optical devices
The present invention discloses a self-alignment manufacturing method of a microlens and an aperture using in an optical device. The method manufactures the aperture and the circular opening in the...
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7259399 |
Vertical GaN-based LED and method of manufacturing the same
Provided are a vertical GaN-based LED and a method of manufacturing the same. The vertical GaN-based LED includes an n-electrode. An AlGaN layer is formed under the n-electrode. An undoped GaN...
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7256426 |
Rare earth element-doped silicon/silicon dioxide lattice structure
Provided are an electroluminescence (EL) device and corresponding method for forming a rare earth element-doped silicon (Si)/Si dioxide (SiO2) lattice structure. The method comprises: providing a...
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7256483 |
Package-integrated thin film LED
LED epitaxial layers (n-type, p-type, and active layers) are grown on a substrate. For each die, the n and p layers are electrically bonded to a package substrate that extends beyond the boundaries...
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7253444 |
Silicone-filled casing for use with light-emitting unit and method of manufacturing the light-emitting unit
A light-emitting unit containing a substrate and light emitting diodes (LEDs) is housed inside a casing constituted by a first member and a second member which are joined together. The second...
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7250326 |
Substrate with an electrode and method of producing the same
The present invention provides a method of forming a transparent conductive film at a low temperature that is suitable for use with a synthetic resin substrate. According to the production method...
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7247247 |
Selective etching method
A selective etching method with lateral protection function is provided. The steps includes: (a) providing a substrate; (b) forming a plurality of tunnels; (c) forming a lateral strengthening...
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7244626 |
Semiconductor devices shared element(s) apparatus and method
Two or more semiconductor devices ( 21 and 22 ) are formed on a substrate ( 20 ) and are each comprised of a plurality of printed components ( 23 and 24 ). At least one such printed component (...
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7244628 |
Method for fabricating semiconductor devices
A method for fabricating semiconductor devices forms a semiconductor layer containing a positive layer on a mother substrate and then forms a metal layer on the semiconductor layer. After forming...
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7235430 |
Substrates having increased thermal conductivity for semiconductor structures
Substrates having increased thermal conductivity are provided, comprising a body having opposed surfaces and a cavity that opens on at least one surface, the cavity containing at least one material...
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7235416 |
Method for fabricating polysilicon liquid crystal display device
A method for fabricating a polysilicon liquid crystal display device includes: forming a first amorphous silicon layer on a substrate; forming a photoresist pattern on the first amorphous silicon...
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7226804 |
Method for forming pattern of organic insulating film
A method for forming a pattern of an organic insulating film by forming an electrode on a substrate, coating an imprintable composition thereon to form an organic insulating film, pressurizing and...
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7226862 |
Method for producing a fluid device, fluid device and analysis apparatus
In the case of a method for producing a fluid device with a fluid structure having an active height, a basic wafer is provided, which comprises a supporting substrate, an insulating layer on the...
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7227195 |
Led lamp including a plurality of led chips
An LED lamp according to the present invention includes: a substrate 10 having a principal surface 10 a ; at least one LED 12 , which is supported on the principal surface 10 a of the...
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7227194 |
Semiconductor light emitting device
A semiconductor light emitting device includes a mold resin having a cup shape portion on an upper surface of the mold resin. One or more holes penetrate through the cup shape portion to outside of...
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7227191 |
Optoelectronic component having a plurality of current expansion layers and method for producing it
An optoelectronic component having a semiconductor chip containing a semiconductor layer sequence ( 6 ) with a radiation-emitting active zone ( 4 ), the semiconductor layer sequence ( 6 ) having...
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7228046 |
Environmentally stable electro-optic device and method for making same
A method is provided for stabilizing an electro-optic substrate employed in a waveguide device. The method comprises cleaning a surface of the substrate, and exposing the device to a reactive oxide...
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7220610 |
Manufacturing method of array substrate for liquid crystal display device
A manufacturing method of an array substrate for a liquid crystal display device includes forming a switching element in a pixel area on a substrate, wherein the pixel area includes a reflective...
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7208771 |
Separating of optical integrated modules and structures formed thereby
A structure having an optical element thereon has a portion of the structure extending beyond a region having the optical element in at least one direction. The structure may include an active...
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7208768 |
Electroluminescent device
A method is provided for forming an electroluminescent device. The method comprises: providing a type IV semiconductor material substrate; forming a p+/n+ junction in the substrate, typically a...
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7205168 |
Semiconductor light emitting device, its manufacturing method, integrated semiconductor light emitting apparatus, its manufacturing method, illuminating apparatus, and its manufacturing method
An n-type GaN layer is grown onto a sapphire substrate and a hexagonal etching mask is formed onto the n-type GaN layer as provided. The n-type GaN layer is etched to a predetermined depth by using...
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7205169 |
Driving circuit for AMOLED display and driving method thereof
A driving circuit and method for an active matrix organic light emitting diode (AMOLED) display are provided. The driving circuit comprises a power circuit, a linear thermistor, and a pixel...
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7202505 |
High power light-emitting diode package and methods for making same
In a light-emitting diode package made in accordance with the present invention, a light-emitting diode assembly is positioned above a spacer assembly. In the light-emitting diode assembly, a die...
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7199400 |
Semiconductor package
A semiconductor package comprising a base material, an FPC substrate bonded through the intervention of an adhesive or an adhesive sheet on the base material and a semiconductor chip mounted on the...
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7199398 |
Nitride semiconductor light emitting device having electrode electrically separated into at least two regions
A nitride semiconductor light emitting device includes at least a substrate, an active layer formed of a nitride semiconductor containing mainly In and Ga, a p-electrode and an n-electrode. At...
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7196338 |
Ultra-thin sample preparation for transmission electron microscopy
In accordance with the invention, there is a method of fabricating a material for transmission electron microscopy comprising removing a first portion from a material having a thickness of (d 1 )...
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