|
Match
|
Document |
Document Title |
|
|
7632732 |
Method of manufacturing MOS transistor
A method of manufacturing a transistor may include: forming a first well over a silicon substrate; forming a first mask pattern over the silicon substrate and using the formed first mask pattern to...
|
|
|
7622356 |
Method of fabricating metal oxide semiconductor field effect transistor
There are provided a method for fabricating a MOSFET. The method includes: substrate, forming a semiconductor substrate, a germanium layer by implanting germanium (Ge) ions into a semiconductor...
|
|
|
7595532 |
Semiconductor memory devices and methods of forming the same
A semiconductor memory device includes a semiconductor substrate including an insulating layer, a charge storage region of a first conductivity type on the insulating layer, and an insulating film...
|
|
|
7579226 |
Thin layer element and associated fabrication process
A method is provided for fabricating a thin layer element, in which a layer of a first material supports a pattern of a second material having a thickness of less than 15 nm, including a step of...
|
|
|
7569449 |
Processes providing high and low threshold p-type and n-type transistors
Methods of fabricating negative-channel metal-oxide semiconductor (NMOS) devices and positive-channel metal-oxide semiconductor (PMOS) devices having complementary threshold voltages are described....
|
|
|
7569445 |
Semiconductor device with constricted current passage
A semiconductor device including a gate located over a semiconductor substrate and a source/drain region located adjacent the gate. The source/drain region is bounded by an isolation structure that...
|
|
|
7563682 |
LDMOS transistor device, integrated circuit, and fabrication method thereof
An LDMOS transistor device in an integrated circuit comprises a semiconductor substrate ( 10 ), a gate region ( 1 ) including a gate semiconductor layer region ( 2; 2′; 151 ) on top of a gate...
|
|
|
7560312 |
Void formation for semiconductor junction capacitance reduction
Semiconductor structures having a decreased semiconductor junction capacitance of a semiconductor junction within an active semiconductor layer may be fabricated using an ion implantation and...
|
|
|
7550357 |
Semiconductor device and fabricating method thereof
A semiconductor device with a low drain current in the off-state of LDD type accommodating high voltages is provided. On the thermal oxide film, a polysilicon film and a CVD oxide film, and a...
|
|
|
7531404 |
Semiconductor device having a metal gate electrode formed on an annealed high-k gate dielectric layer
A method of forming a transistor gate stack having an annealed gate dielectric layer begins by providing a substrate that includes a first and second spacer separated by a trench. A conformal...
|
|
|
7528030 |
Semiconductor device comprising at least one MOS transistor having an etch stop layer, and corresponding fabrication process
A semiconductor device includes at least one MOS transistor, each transistor being provided with a source region and a drain region formed in a semiconductor substrate, along with a gate region and...
|
|
|
7504327 |
Method of manufacturing thin film semiconductor device
In the invention, a low concentration impurity region is formed between a channel formation region and a source region or a drain region in a semiconductor layer and covered with a gate electrode...
|
|
|
7488635 |
Semiconductor structure with reduced gate doping and methods for forming thereof
A semiconductor structure includes a substrate having a memory region and a logic region. A first p-type device is formed in the memory region and a second p-type device is formed in the logic...
|
|
|
7479418 |
Methods of applying substrate bias to SOI CMOS circuits
The present invention relates to methods for reducing the threshold voltage difference between an n-type field effect transistor (n-FET) and a p-type field effect transistor (p-FET) in a...
|
|
|
7473591 |
Transistor with strain-inducing structure in channel
Various methods for forming a layer of strained silicon in a channel region of a device and devices constructed according to the disclosed methods. In one embodiment, a strain-inducing layer is...
|
|
|
7449379 |
Semiconductor device and method for fabricating the same
On an insulation layer 12 formed on a silicon substrate 10 , there are formed in an NMOS transistor region 16 an NMOS transistor 14 comprising a silicon layer 34 , a lattice-relaxed silicon...
|
|
|
7446003 |
Manufacturing process for lateral power MOS transistors
A process manufactures power MOS lateral transistors together with CMOS devices on a semiconductor substrate. The process forms a lateral MOS transistor having a gate electrode on the semiconductor...
|
|
|
7442600 |
Methods of forming threshold voltage implant regions
The invention includes methods of forming channel region implants for two transistor devices simultaneously, in which a mask is utilized to block a larger percentage of a channel region location of...
|
|
|
7432141 |
Large-grain p-doped polysilicon films for use in thin film transistors
A method is disclosed to form a large-grain, lightly p-doped polysilicon film suitable for use as a channel region in thin film transistors. The film is preferably deposited lightly in situ doped...
|
|
|
7407850 |
N+ poly on high-k dielectric for semiconductor devices
The present invention facilitates semiconductor fabrication by providing methods of fabrication that employ high-k dielectric layers. An n-type well region ( 304 ) is formed within a semiconductor...
|
|
|
7402495 |
Method for manufacturing a semiconductor device
A method of manufacturing a semiconductor device includes forming a first semiconductor region of a first conductive type and a second semiconductor region of a second conductive type in a...
|
|
|
7390719 |
Method of manufacturing a semiconductor device having a dual gate structure
A semiconductor device having a dual gate is formed on a substrate having a dielectric layer. A first metallic conductive layer is formed on the dielectric layer to a first thickness, and annealed...
|
|
|
7368342 |
Semiconductor device and method of manufacturing the same
A method for manufacturing a semiconductor device includes forming a gate-insulating film on a semiconductor substrate; forming a gate electrode on the gate-insulating film to be electrically...
|
|
|
7364957 |
Method and apparatus for semiconductor device with improved source/drain junctions
A semiconductor device with improved source/drain junctions and methods for fabricating the device are disclosed. A preferred embodiment comprises a MOS transistor with a gate structure overlying a...
|
|
|
7361540 |
Method of reducing noise disturbing a signal in an electronic device
Certain aspects of a method for reducing noise disturbing at least one signal in an electronic device may comprise shielding a first layer doped with a first dopant from a signaling layer employing...
|
|
|
7354817 |
Semiconductor device, manufacturing method thereof, and CMOS integrated circuit device
A semiconductor device includes a semiconductor substrate. A gate electrode is formed on the semiconductor substrate via a gate insulating film. A source region and a drain region of a first...
|
|
|
7351627 |
Method of manufacturing semiconductor device using gate-through ion implantation
Disclosed herein is a method of manufacturing a semiconductor device via gate-through ion implantation, comprising forming a gate stack on a semiconductor substrate and performing ion implantation...
|
|
|
7329910 |
Semiconductor substrates and field effect transistor constructions
The invention includes methods of forming field effect transistor gates. In one implementation, a series of layers is formed proximate a semiconductive material channel region. The layers comprise...
|
|
|
7297584 |
Methods of fabricating semiconductor devices having a dual stress liner
In a semiconductor device having a dual stress liner for improving electron mobility, the dual stress liner includes a first liner portion formed on a PMOSFET and a second liner portion formed on...
|
|
|
7297583 |
Method of making strained channel CMOS transistors having lattice-mismatched epitaxial
A method is provided in which an n-type field effect transistor (NFET) and a p-type field effect transistor (PFET) each have a channel region disposed in a first single-crystal semiconductor region...
|
|
|
7291527 |
Work function control of metals
Forming metal gate transistors that have different work functions is disclosed. In one example, a first metal, which is a ‘mid gap’ metal, is manipulated in first and second regions by second...
|
|
|
7279430 |
Process for fabricating a strained channel MOSFET device
A process for fabricating a MOSFET device featuring a channel region comprised with a silicon-germanium component is provided. The process features employ an angled ion implantation procedure to...
|
|
|
7268033 |
Method and structure for providing tuned leakage current in CMOS integrated circuits
A field effect transistor (FET) comprising an isolation layer, a source region positioned over the isolation layer, a drain region positioned over the isolation layer, a bifurcated silicide gate...
|
|
|
7265011 |
Method of manufacturing a transistor
A method of manufacturing a transistor according to some embodiments includes sequentially forming a dummy gate oxide layer and a dummy gate electrode on an active region of a semiconductor...
|
|
|
7259072 |
Shallow low energy ion implantation into pad oxide for improving threshold voltage stability
A method is described to fabricate a MOSFET device with increased threshold voltage stability. After the pad oxide and pad nitride are deposited on the silicon substrate and shallow trenches are...
|
|
|
7244642 |
Method to obtain fully silicided gate electrodes
The present invention provides a method of fabricating a microelectronics device. In one aspect, the method comprises depositing a protective layer ( 510 ) over a spacer material ( 415 ) located...
|
|
|
7238563 |
Semiconductor device having isolation region and method of manufacturing the same
A trench isolation region is formed in a surface region of a semiconductor substrate to form a MOS type element region. A mask layer having an opening portion is formed on the semiconductor layer,...
|
|
|
7232733 |
Method of forming an integrated circuit incorporating higher voltage devices and low voltage devices therein
A method of forming an integrated circuit configured to accommodate higher voltage and low voltage devices. In one embodiment, the method of forming the integrated circuit includes forming a...
|
|
|
7223663 |
MOS transistors and methods of manufacturing the same
MOS transistors having a low junction capacitance between their halo regions and their source/drain extension regions and methods for manufacturing the same are disclosed. A disclosed MOS...
|
|
|
7220636 |
Process for controlling performance characteristics of a negative differential resistance (NDR) device
A variety of processes are disclosed for controlling NDR characteristics for an NDR element, such as peak-to-valley ratio (PVR), NDR onset voltage (V NDR ) and related parameters. The processes are...
|
|
|
7217624 |
Non-volatile memory device with conductive sidewall spacer and method for fabricating the same
The present invention relates to a non-volatile memory device having conductive sidewall spacers and a method for fabricating the same. The non-volatile memory device includes: a substrate; a gate...
|
|
|
7217622 |
Semiconductor device and method of manufacturing the semiconductor device
In a method of manufacturing a semiconductor device to improve structural stability of a semiconductor device in a silicidation process, a substrate is provided to have an active region defined by...
|
|
|
7217612 |
Manufacturing method for a semiconductor device with reduced local current
A semiconductor device including: a first gate insulating film which is pattern-formed on an N type well region within a P type semiconductor substrate; a second gate insulating film which is...
|
|
|
7214591 |
Method of fabricating high-voltage MOS device
A HV-MOS device is described, including a substrate, a gate dielectric layer and a gate, a channel region, two doped regions as a source and a drain, a field isolation layer between the gate and at...
|
|
|
7205185 |
Self-aligned planar double-gate process by self-aligned oxidation
A double-gate transistor has front (upper) and back gates aligned laterally by a process of forming symmetric sidewalls in proximity to the front gate and then oxidizing the back gate electrode at...
|
|
|
7195967 |
Nonvolatile semiconductor memory device and manufacturing method thereof
In a channel region between the source/drain diffusion layers, impurities of the same conductivity type as the well are doped in an area apart from the diffusion regions. By using as a mask the...
|
|
|
7195968 |
Method of fabricating semiconductor device
A method of fabricating a semiconductor device includes forming a resist pattern so that an opening between select gates of a select gate transistor is formed in a memory cell region, implanting...
|
|
|
7179702 |
Semiconductor device including metal insulator semiconductor field effect transistor and method of manufacturing the same
A semiconductor device comprises a semiconductor substrate, an N-channel MISFET and a P-channel MISFET provided on the semiconductor substrate, each of the N- and P-channel MISFETs being isolated...
|
|
|
7180107 |
Method of fabricating a tunneling nanotube field effect transistor
A method of fabricating a tunneling nanotube field effect transistor includes forming in a nanotube an n-doped region and a p-doped region which are separated by an undoped channel region of the...
|
|
|
7129533 |
High concentration indium fluorine retrograde wells
A method and apparatus to form a high-concentration, indium-fluorine retrograde well within a substrate. The indium-fluorine retrograde well includes an indium concentration greater than about...
|