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8183062 |
Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences
The invention can provide apparatus and methods of creating metal gate structures on wafers in real-time using Lithography-Etch-Lithography-Etch (LELE) processing sequence. Real-time data and/or...
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8183565 |
Programmable resistance memory array with dedicated test cell
A rewritable nonvolatile memory includes a test cell that is dedicated to testing the storage characteristics of other, similar, storage cells formed within the same integrated circuit memory. The...
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8178876 |
Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test...
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8178368 |
Test chiplets for devices
A method of forming a device is disclosed. The method includes providing a substrate on which the device is formed. It also includes forming a test cell on the substrate. The test cell includes a...
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8168450 |
Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package
A semiconductor package includes a semiconductor chip having a circuit section. A first chip selection electrode passes through a first position of the semiconductor chip, and the first chip...
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8159254 |
Crack sensors for semiconductor devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are disclosed. In one embodiment, a...
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8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
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8124428 |
Structure and method for testing MEMS devices
A method for determining the presence of a sacrificial layer under a structure. The method includes providing at least one structure arranged above a substrate having a major surface lying in a...
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8126154 |
Circuit arrangement for the bidirectional operation of sound transducers disposed at the ends of a measuring section
A sensor circuit for a flow sensor comprises terminating impedances connected in parallel to the sound transducers and has a signal generator, which is configured as a power source. The circuit...
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8120026 |
Testing wiring structure and method for forming the same
The invention provides a testing wiring structure of a thin film transistor (TFT) motherboard for applying signals to a plurality of signal lines in a pixel region on the motherboard and a method...
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8114686 |
Phase change material based temperature sensor
A block of phase change material located in a semiconductor chip is reset to an amorphous state. The block of phase change material may be connected to an internal resistance measurement circuit...
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8114688 |
Method and semiconductor structure for monitoring etch characteristics during fabrication of vias of interconnect structures
By forming a trench-like test opening above a respective test metal region during the etch process for forming via openings in a dielectric layer stack of sophisticated metallization structures of...
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8111081 |
Method for evaluating silicon wafer
The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon...
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8106395 |
Semiconductor device and method of manufacturing the same
A technique of manufacturing a semiconductor device capable of performing a probe test by a common test apparatus as normal LSI chips even for large-area chips is provided. A chip comprising a...
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8101436 |
Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet...
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8097475 |
Method of production of a contact structure
A probe card having a plurality of silicon finger contactors contacting pads provided on a tested semiconductor wafer and a probe board mounting the plurality of silicon finger contactors on its...
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8093103 |
Multiple chip module and package stacking method for storage devices
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
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8088634 |
Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon
A pattern of conductive ink is disposed on the topside of the unsingulated integrated circuits of a wafer, and, typically after wafer probing, the pattern of conductive ink is removed. The...
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8071399 |
Method of manufacturing a semiconductor integrated circuit device
An object is to prevent a breakage of a membrane probe and a wafer to be tested in a probe testing using a membrane probe with styluses formed by a manufacturing technology for a semiconductor...
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8067819 |
Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line
The present invention discloses a semiconductor wafer having a scribe line dividing the semiconductor wafer into a matrix of plural semiconductor chips. The semiconductor wafer includes a...
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8062911 |
Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same
A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which...
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8063656 |
Method of enabling a circuit board analysis
A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit...
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8063402 |
Integrated circuit having a filler standard cell
An integrated circuit includes a functional block having a plurality of standard cells. The plurality of standard cells includes a plurality of functional standard cells and a filler standard cell....
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8062910 |
Measurement of a sample using multiple models
A sample that is processed to remove a top layer, e.g., using chemical mechanical polishing or etching, is accurately measured using multiple models of the sample. The multiple models may be...
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8053293 |
Method of manufacturing a display substrate
A display substrate includes a pixel, a signal transmission line, a first insulating layer and a test signal input part. The pixel is on an insulating substrate. The signal transmission line is on...
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8053878 |
Substrate, semiconductor device using the same, method for inspecting semiconductor device, and method for manufacturing semiconductor device
A substrate including therein a plurality of conductor layers laminated via insulating layers, the substrate mounting at least one semiconductor integrated circuit, wherein the substrate includes a...
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8048794 |
3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport
A method of fabricating a thin wafer die includes creating circuits and front-end-of-line wiring on a silicon wafer, drilling holes in a topside of the wafer, depositing an insulator on the drilled...
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8039277 |
Providing current control over wafer borne semiconductor devices using overlayer patterns
Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer (1240) having a substrate (1240), at least one active layer (1240) and at least one surface layer...
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8034641 |
Method for inspection of defects on a substrate
A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by...
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8034640 |
Apparatus and method to inspect defect of semiconductor device
An apparatus and method to inspect a defect of a semiconductor device. The amount of secondary electrons generated due to a scanning electron microscope (SEM) may depend on the topology of a...
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8030100 |
Chemical sensor
The application relates to a chemical sensor device comprising a substrate (1), a sensor medium (3) formed on the substrate, the sensor medium comprising one-dimensional nanoparticles, wherein the...
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8030099 |
Method for determining time to failure of submicron metal interconnects
The present disclosure is related to a method for determining time to failure characteristics of a microelectronics device. A test structure, being a parallel connection of a plurality of such...
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8021712 |
Wafer and manufacturing method of electronic component
The present invention relates to a wafer formed with an evaluation element and capable of improving productivity and a manufacturing method of an electronic component using the same. In a wafer...
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8022402 |
Active device array substrate
An active device array substrate including a substrate, a pixel array, and peripheral circuit is provided. The substrate has a display region and a peripheral region. The pixel array is disposed on...
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8022403 |
Semiconductor apparatus including photodiode unit and method of inspection of the same
A semiconductor apparatus has a light-receiving element. The light-receiving element has a photodiode unit having a shield film for removing noise, at least two test pads, and a shield film pseudo...
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8021899 |
Method of manufacturing a semiconductor device including optical test pattern above a light shielding film
The semiconductor device of the present invention includes a first insulating film on a substrate having a first region and a second region, a light shielding film formed in the first region and an...
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8012867 |
Wafer level chip scale package system
A wafer level chip scale package system is provided including placing a first integrated circuit over a semiconductor wafer having a second integrated circuit; connecting a second electrical...
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8008691 |
Ion sensitive field effect transistor and production method thereof
The present invention discloses an ion sensitive field effect transistor, comprising: a GaN/sapphire layer, used as a substrate; an a-InN:Mg epilayer, deposited on the GaN/sapphire layer, used to...
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8003984 |
Reticle for wafer test structure areas
Techniques are provided for forming die on wafers with large area test structures between primary die. A reticle is used to pattern each die. The pattern on the reticle forms a primary die and test...
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7993937 |
DC and RF hybrid processing system
The invention can provide apparatus and methods for processing substrates and/or wafers in real-time using at least one Direct Current (DC)/Radio Frequency (RF) Hybrid (DC/RFH) processing system...
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7993942 |
Method of detecting heavy metal in semiconductor substrate
A method of detecting heavy metal in a semiconductor substrate, includes: a gate oxide film forming step of forming an organic oxide film by spin coating or a sol-gel process, and forming a...
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7989803 |
Manufacturing method for semiconductor chips and semiconductor wafer
In a semiconductor wafer that has semiconductor devices arranged in a plurality of device-formation-regions and a TEG placed in dividing regions that define the device-formation-regions, a...
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7989229 |
Tactile surface inspection during device fabrication or assembly
Processes for inspecting a surface during device fabrication include contacting the surface with a tactile sensor. The tactile sensor is an electroluminescent tactile sensor array or a current...
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7989232 |
Method of using electrical test structure for semiconductor trench depth monitor
Embodiments provide a method and device for electrically monitoring trench depths in semiconductor devices. To electrically measure a trench depth, a pinch resistor can be formed in a deep well...
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7981700 |
Semiconductor oxidation apparatus and method of producing semiconductor element
A semiconductor oxidation apparatus is provided with a sealable oxidation chamber defined by walls, a base provided within the oxidation chamber and configured to support a semiconductor sample, a...
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7981698 |
Removal of integrated circuits from packages
Packaging is substantially entirely removed from an integrated circuit die. The method allows the batch processing of several integrated circuit dies, such that packaging is removed from each die...
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7973544 |
Thermal monitoring and management of integrated circuits
The invention, in one aspect, provides a semiconductor device (100), including transistors (105), dielectric layers (115, 120) located over the transistors (105), interconnects (122) formed within...
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7960208 |
Wafer level hermetic bond using metal alloy with raised feature
Systems and methods for forming an encapsulated device include a hermetic seal which seals an insulating environment between two substrates, one of which supports the device. The hermetic seal is...
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7943401 |
Detection and reduction of dielectric breakdown in semiconductor devices
Methods for detecting the breakdown potential of a semiconductor device having a thin dielectric layer are disclosed. The method includes measuring a spectroscopy of the thin dielectric layer and...
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7939348 |
E-beam inspection structure for leakage analysis
A testing structure, and method of using the testing structure, where the testing structure comprised of at least one of eight test structures that exhibits a discernable defect characteristic upon...
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