Matches 1 - 50 out of 1139 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >


Match Document Document Title
8183062 Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences  
The invention can provide apparatus and methods of creating metal gate structures on wafers in real-time using Lithography-Etch-Lithography-Etch (LELE) processing sequence. Real-time data and/or...
8183879 Measuring arrangement, semiconductor arrangement and method for operating a semiconductor component as a reference source  
The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are...
8178364 Testing method of surface-emitting laser device and testing device thereof  
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane...
8178367 Process condition evaluation method for liquid crystal display module  
A process condition evaluation method for a liquid crystal display module (LCM) includes: a first step of obtaining a threshold power measuring pattern, an analysis sample for a cell bonding status...
8178365 Method of manufacturing semiconductor device  
A semiconductor wafer having IGBT elements and transistors formed on a surface thereof is prepared. Electron beams are emitted all over the surface of the semiconductor wafer. Recombination centers...
8173451 Etch stage measurement system  
Provided is a system for measuring an etch stage of an etch process involving one or more layers in a substrate, the etch stage measurement system configured to meet two or more etch stage...
8173450 Method of designing an etch stage measurement system  
Provided is a method for designing an etch stage measurement system involving an etch process for one or more layers on a substrate using an etch process tool. The etch process tool uses two or...
8168452 Method for manufacturing semiconductor device  
A method for manufacturing a semiconductor device, the semiconductor device including an integrated circuit having plural connection terminals arranged on a predetermined local region of the...
8168450 Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package  
A semiconductor package includes a semiconductor chip having a circuit section. A first chip selection electrode passes through a first position of the semiconductor chip, and the first chip...
8158065 In situ monitoring of metal contamination during microstructure processing  
By providing a tool internal sensor device in a process tool in a semiconductor facility, metal contamination may be monitored in situ, thereby avoiding or at least significantly reducing the...
8158449 Particle emission analysis for semiconductor fabrication steps  
A structure and a method for operating the same. The method includes providing a detecting structure which includes N detectors. N is a positive integer. A fabrication step is simultaneously...
8153452 Manufacturing method of semiconductor device  
The semiconductor device is formed by forming a first metal film over a first main surface of a semiconductor wafer having a first thickness, performing back grinding to a second main surface of...
8153451 System and method for performing semiconductor processing on target substrate  
A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a...
8143076 Manufacture of defect cards for semiconductor dies  
A method for producing a defect card for individual dies located on a wafer, comprising: producing first and second defect cards, where the defective individual dies whose adjoining individual dies...
8124429 Reprogrammable circuit board with alignment-insensitive support for multiple component contact types  
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
8119426 Method of manufacturing an ultrasonic transducer semiconductor device  
A manufacturing yield of a semiconductor device (capacitive micromachined ultrasonic transducer) is increased. A plurality of first chips 1 in which a plurality of cells each having functions of...
8114686 Phase change material based temperature sensor  
A block of phase change material located in a semiconductor chip is reset to an amorphous state. The block of phase change material may be connected to an internal resistance measurement circuit...
8114688 Method and semiconductor structure for monitoring etch characteristics during fabrication of vias of interconnect structures  
By forming a trench-like test opening above a respective test metal region during the etch process for forming via openings in a dielectric layer stack of sophisticated metallization structures of...
8114687 Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device  
A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the...
8111081 Method for evaluating silicon wafer  
The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon...
8110416 AC impedance spectroscopy testing of electrical parametric structures  
Defects in components in ICs which may cause circuit failures during operation of the IC are often difficult to detect during and immediately after fabrication of the IC by DC test methods. A...
8106461 Apparatus for NBTI prediction  
An apparatus comprises a circuit for measuring a gate leakage current of a plurality of transistors. A circuit is provided to apply heat to gates of the plurality of transistors. A circuit is...
8101435 Fabrication method for semiconductor device  
A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of...
8101436 Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film  
A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet...
8093626 Normally-off field effect transistor using III-nitride semiconductor and method for manufacturing such transistor  
Provided is a normally-off field effect transistor using a III-nitride semiconductor. The transistor is provided with a III-nitride semiconductor layer grown on a substrate by including an acceptor...
8093074 Analysis method for semiconductor device  
An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed...
8093103 Multiple chip module and package stacking method for storage devices  
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
8088634 Methods of adding pads and one or more interconnect layers to the passivated topside of a wafer including connections to at least a portion of the integrated circuit pads thereon  
A pattern of conductive ink is disposed on the topside of the unsingulated integrated circuits of a wafer, and, typically after wafer probing, the pattern of conductive ink is removed. The...
8084298 Method for exchanging semiconductor chip of flip-chip module and flip-chip module suitable therefor  
A process for replacing a semiconductor chip of such a flip-chip module and a suitable flip-chip module and an apparatus for implementing the method are disclosed. The flip-chip module comprises at...
8084279 Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns  
According to one embodiment of the present invention, a method of manufacturing a semiconductor device includes below steps. A step of preparing a phase shift mask and a normal photomask. A step of...
8076216 Methods and apparatus for thinning, testing and singulating a semiconductor wafer  
A wafer translator is provided with a patterned layer of wafer bonding thermoset plastic and is removably attached with a wafer so as to form a wafer/wafer translator pair. The wafer translator...
8071399 Method of manufacturing a semiconductor integrated circuit device  
An object is to prevent a breakage of a membrane probe and a wafer to be tested in a probe testing using a membrane probe with styluses formed by a manufacturing technology for a semiconductor...
8073241 Defect source analysis method, defect source analysis apparatus, and method of manufacturing semiconductor device  
An inspecting method increases the accuracy of a DSA (Defect Source Analysis) for thereby increasing the yield of semiconductor devices which are manufactured. For performing a DSA using data of a...
8066430 Semiconductor substrate temperature determination  
The invention provides a method and a device for determining the temperature of a semiconductor substrate. A resonance circuit (110) is provided on the semiconductor substrate and is formed by a...
8067769 Wafer level package structure, and sensor device obtained from the same package structure  
A wafer level package structure with a plurality of compact sensors such as acceleration sensors and gyro sensors is provided. This package structure is composed of a semiconductor wafer with...
8062911 Method of manufacturing a semiconductor integrated circuit device and a method of manufacturing a thin film probe sheet for using the same  
A probe having a sufficient height is manufactured by selectively depositing, over the main surface of a wafer, a copper film in a region in which a metal film is to be formed and a region which...
8063656 Method of enabling a circuit board analysis  
A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit...
8063401 Testing for correct undercutting of an electrode during an etching step  
A probe electrode structure on a substrate is described, comprising a first probe electrode and a neighboring second probe electrode on a layer sequence that generally includes, in a direction from...
8053257 Method for prediction of premature dielectric breakdown in a semiconductor  
The invention predicts premature dielectric breakdown in a semiconductor. At least one dielectric breakdown mode is calculated for a layer within chips comprising a semiconductor wafer lot. If only...
8048794 3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport  
A method of fabricating a thin wafer die includes creating circuits and front-end-of-line wiring on a silicon wafer, drilling holes in a topside of the wafer, depositing an insulator on the drilled...
8048690 Pressure-sensitive adhesive sheet and process for producing semiconductor device having same  
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the...
8044396 Semiconductor device and method of designing the same  
A semiconductor device includes a first wiring layer, a second wiring layer and an insulating layer provided between the first wiring layer and the second wiring layer. A capacitor has a first...
8039276 Manufacturing method of semiconductor device  
The semiconductor device si formed by forming a first metal film over a first main surface of a semiconductor wafer having a first thinkness, performing back grinding to a second main surface of...
8039277 Providing current control over wafer borne semiconductor devices using overlayer patterns  
Disclosed are methods for providing wafer parasitic current control to a semiconductor wafer (1240) having a substrate (1240), at least one active layer (1240) and at least one surface layer...
8034641 Method for inspection of defects on a substrate  
A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by...
8034637 Techniques for coupling in semiconductor devices  
Techniques for exchange coupling of magnetic layers in semiconductor devices are provided. In one aspect, a semiconductor device is provided. The device comprises at least two magnetic layers, and...
8033190 Process condition sensing wafer and data analysis system  
A measuring device incorporating a substrate with sensors that measure the processing conditions that a wafer may undergo during manufacturing. The substrate can be inserted into a processing...
8030100 Chemical sensor  
The application relates to a chemical sensor device comprising a substrate (1), a sensor medium (3) formed on the substrate, the sensor medium comprising one-dimensional nanoparticles, wherein the...
8030099 Method for determining time to failure of submicron metal interconnects  
The present disclosure is related to a method for determining time to failure characteristics of a microelectronics device. A test structure, being a parallel connection of a plurality of such...
8017411 Dynamic adaptive sampling rate for model prediction  
A method and an apparatus for dynamically adjusting a sampling rate relating to wafer examination. A process step is performed upon a plurality of workpieces associated with a lot. A sample rate...
Matches 1 - 50 out of 1139 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >