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8183062 |
Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences
The invention can provide apparatus and methods of creating metal gate structures on wafers in real-time using Lithography-Etch-Lithography-Etch (LELE) processing sequence. Real-time data and/or...
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8183879 |
Measuring arrangement, semiconductor arrangement and method for operating a semiconductor component as a reference source
The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are...
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8178364 |
Testing method of surface-emitting laser device and testing device thereof
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane...
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8178367 |
Process condition evaluation method for liquid crystal display module
A process condition evaluation method for a liquid crystal display module (LCM) includes: a first step of obtaining a threshold power measuring pattern, an analysis sample for a cell bonding status...
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8173451 |
Etch stage measurement system
Provided is a system for measuring an etch stage of an etch process involving one or more layers in a substrate, the etch stage measurement system configured to meet two or more etch stage...
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8173450 |
Method of designing an etch stage measurement system
Provided is a method for designing an etch stage measurement system involving an etch process for one or more layers on a substrate using an etch process tool. The etch process tool uses two or...
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8168451 |
Optical inspection methods
Inspection methods. A method includes adhering an optical blocking layer directly onto and in direct mechanical contact with a semiconductor process wafer, the blocking layer being substantially...
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8163574 |
System and method for sensing voltage in medium-to-high voltage applications
A system and method for measuring voltage of a medium to high voltage line conductor is disclosed. The system includes an electrical insulator having a surface and an edge, the surface having an...
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8158065 |
In situ monitoring of metal contamination during microstructure processing
By providing a tool internal sensor device in a process tool in a semiconductor facility, metal contamination may be monitored in situ, thereby avoiding or at least significantly reducing the...
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8158017 |
Detection of arcing events in wafer plasma processing through monitoring of trace gas concentrations
A method of detecting substrate arcing in a semiconductor plasma processing apparatus is provided. A substrate is placed on a substrate support in a reaction chamber of a plasma processing...
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8143077 |
Microchip and method of manufacturing microchip
A microchip formed by joining a first substrate having at least one recess on its surface and a second substrate, wherein small projections of 0.5 to 30 μm in height are formed on at least a part ...
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8143078 |
Methods for monitoring the amount of contamination imparted into semiconductor wafers during wafer processing
Methods are disclosed for monitoring the amount of metal contamination imparted during wafer processing operations such as polishing and cleaning. The methods include subjecting a...
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8143075 |
Semiconductor manufacture method
A semiconductor device manufacture method has the steps of: (a) forming a semiconductor device structure in a chip and alignment marks, respectively in a semiconductor wafer; (b) forming a...
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8144328 |
Methods and apparatus for normalizing optical emission spectra
An arrangement for in-situ optical interrogation of plasma emission to quantitatively measure normalized optical emission spectra in a plasma chamber is provided. The arrangement includes a flash...
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8129203 |
Auto feedback apparatus for laser marking
A method of manufacturing integrated circuits includes measuring a reflectivity value of a wafer. An optimum energy level for laser marking the wafer is determined using the reflectivity value. A...
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8129829 |
Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof
A packaging substrate with an embedded photosensitive semiconductor chip and a method for fabricating the same are provided. The method includes the steps of: disposing the semiconductor chip in an...
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8126258 |
Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same
In a method of detecting defects in patterns and an apparatus for performing the method, a first image of a detection region on a semiconductor substrate may be acquired. A second image may be...
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8116893 |
Dicing method
According to an aspect of the present invention, there is provided a dicing apparatus in which: in a case where a control device detects, during an image pickup of a workpiece set onto a second...
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8111081 |
Method for evaluating silicon wafer
The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon...
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8093079 |
Methods of fabricating a light-emitting device
Methods of fabricating of a light-emitting device are provided, the methods include forming a plurality of light-emitting units on a substrate, measuring light characteristics of the plurality of...
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8093103 |
Multiple chip module and package stacking method for storage devices
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
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8088633 |
Optical alignment methods for forming LEDs having a rough surface
A method of aligning a wafer when lithographically fabricating a light-emitting diode (LED). The method includes forming on the wafer at least one roughened alignment mark having a root-mean-square...
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8088632 |
Elemental analysis method and semiconductor device manufacturing method
Protons are entered into a substrate to be analyzed at a proton incident angle larger than 0° and smaller 90°. Excited by the entered protons and emitted from the substrate to be analyzed, the c...
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8082536 |
Semiconductor integrated circuit manufacturing process evaluation method
A method for evaluating a process of manufacturing a semiconductor integrated circuit including a deposition step and a polishing step after the deposition step, the method includes: dividing the...
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8080434 |
Nondestructive testing method for oxide semiconductor layer and method for making oxide semiconductor layer
A nondestructive testing method for an oxide semiconductor layer includes the steps of applying excitation light to an amorphous or polycrystalline target oxide semiconductor layer to be tested and...
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8072601 |
Pattern monitor mark and monitoring method suitable for micropattern
A method of forming a monitor mark includes forming an insulating film on a semiconductor substrate, and forming a first repetitive line pattern group and a second repetitive line pattern group by...
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8071399 |
Method of manufacturing a semiconductor integrated circuit device
An object is to prevent a breakage of a membrane probe and a wafer to be tested in a probe testing using a membrane probe with styluses formed by a manufacturing technology for a semiconductor...
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8071398 |
Method and structure of monolithically integrated IC-MEMS oscillator using IC foundry-compatible processes
The present invention relates to integrating an inertial mechanical device on top of an IC substrate monolithically using IC-foundry compatible processes. The IC substrate is completed first using...
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8073241 |
Defect source analysis method, defect source analysis apparatus, and method of manufacturing semiconductor device
An inspecting method increases the accuracy of a DSA (Defect Source Analysis) for thereby increasing the yield of semiconductor devices which are manufactured. For performing a DSA using data of a...
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8067252 |
Method for determining low-noise power spectral density for characterizing line edge roughness in semiconductor wafer processing
According to one exemplary embodiment, a method for determining a power spectral density of an edge of at least one patterned feature situated over a semiconductor wafer includes measuring the edge...
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8069020 |
Generating simulated diffraction signal using a dispersion function relating process parameter to dispersion
A first wafer is fabricated using a first value for a process parameter specifying a process condition in fabricating the structure. A first value of a dispersion is measured from the first wafer....
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8063656 |
Method of enabling a circuit board analysis
A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit...
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8058081 |
Method of testing an integrity of a material layer in a semiconductor structure
A method comprises providing a semiconductor structure. The semiconductor structure comprises a feature comprising a first material and a layer of a second material formed over the feature. The...
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8043871 |
Method for forming oxide film on silicon wafer
The present invention provides a method for forming an oxide film on a silicon wafer, comprising: measuring surface roughness of the silicon wafer and/or crystallinity in a surface layer portion of...
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8045788 |
Product setup sharing for multiple inspection systems
An inspection tool includes a camera for obtaining images of a wafer and a controller configured for performing light source flat field correction, optical image warping correction, and optical...
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8036446 |
Semiconductor mask inspection using die-to-die and die-to-database comparisons
A mask forming method includes preparing design data of mask including pattern regions having identical repetition patterns respectively, generating mask pattern data of mask based on the design...
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8034641 |
Method for inspection of defects on a substrate
A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by...
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8025023 |
Coating and developing system, coating and developing method and storage medium
Wafers A1 to A10 of a first lot A and wafers B1 to B10 of a second lot B are processed by a second heating unit at different temperatures, respectively. A wafer W is carried in a processing block...
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8022372 |
Apparatus and method for batch non-contact material characterization
An apparatus for performing non-contact material characterization includes a wafer carrier adapted to hold a plurality of substrates and a material characterization device, such as a device for...
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8024676 |
Multi-pitch scatterometry targets
The invention can provide a method of processing a substrate using multi-pitch scatterometry targets (M-PSTs) for de-convolving lithographic process parameters during Single-Patterning (S-P),...
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8021563 |
Etch depth determination for SGT technology
A method for determining the depth etch, a method of forming a shielded gate trench (SGT) structure and a semiconductor device wafer are disclosed. A material layer is formed over part of a...
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8017514 |
Optically transparent wires for secure circuits and methods of making same
A structure and a method. The method includes: forming a dielectric layer on a substrate; forming electrically conductive first and second wires in the dielectric layer, top surfaces of the first...
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7999401 |
Semiconductor device and method of manufacturing same
Semiconductor device has a semiconductor chip embedded in an insulating layer. A semiconductor device comprises a semiconductor chip formed to have external connection pads and a positioning mark...
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8000515 |
Automatic detection of coating flaws
A method and a device for inspecting surface coatings on workpieces, in particular of lacquer coatings, using an image capture and/or image processing system. The image capture and/or image...
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8000518 |
Methods, objects and apparatus employing machine readable data
The present invention relates generally to steganography and data hiding. One claim recites an object including: electronic processing circuitry having an operating or performance metric associated...
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8000519 |
Method of metal pattern inspection verification
A method of evaluating an inline inspection recipe compares the capture rate of metal pattern defects in bounding boxes arising from failed electrical test vectors to the capture rate after the...
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7993937 |
DC and RF hybrid processing system
The invention can provide apparatus and methods for processing substrates and/or wafers in real-time using at least one Direct Current (DC)/Radio Frequency (RF) Hybrid (DC/RFH) processing system...
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7989231 |
Method of manufacturing silicon carbide semiconductor device
In a method of manufacturing a silicon carbide semiconductor device, a trench and a thickness measurement section are formed in a surface of a semiconductor substrate made of silicon carbide. The...
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7988311 |
Light emitting device having a phosphor layer
A light emitting device and method of producing the same is disclosed. The light emitting device includes a light emitting semiconductor, an encapsulation layer, wherein the light emitting...
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7981704 |
Method for manufacturing semiconductor optical device
After a metal cap layer is laminated on a semiconductor laminated structure, a waveguide ridge is formed, the waveguide ridge is coated with an SiO2 film, and a resist is applied; then, a resist...
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