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9036897 Storage medium storing computer program for determining at least one of exposure condition and mask pattern  
A computer readable storage medium is provided, storing a computer-executable program for causing a computer to determine at least one of mask pattern and exposure condition of an exposure...
9023665 Method and apparatus for manufacturing LED device  
An apparatus and method of manufacturing a light emitting diode (LED) device, and more particularly, an apparatus and method of manufacturing an LED device by dispensing a fluorescent solution...
9023668 Method for producing substrate having concavity and convexity structure and method for producing organic EL element using the same  
A method for producing a substrate having an irregular concave and convex surface for scattering light includes: manufacturing a substrate having the irregular concave and convex surface;...
9018081 Light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures  
A method is provided for fabricating a light emitting diode (LED) using three-dimensional gallium nitride (GaN) pillar structures with planar surfaces. The method forms a plurality of GaN pillar...
9018023 Detection of surface defects by optical inline metrology during Cu-CMP process  
An efficient method of detecting defects in metal patterns on the surface of wafers. Embodiments include forming a metal pattern on each of a plurality of wafers, polishing each wafer, and...
9005999 Temperature control of chemical mechanical polishing  
Methods for chemical mechanical polishing (CMP) of semiconductor substrates, and more particularly to temperature control during such chemical mechanical polishing are provided. In one aspect, the...
9006003 Method of detecting bitmap failure associated with physical coordinate  
A method of detecting bitmap failure associated with physical coordinates is provided. In the method, data of wafer mapping inspection are obtained first, and the data include images of defects in...
8992721 Plasma processing apparatus  
A plasma processing apparatus including: a monitor device which monitors a process quantity generated at plasma processing; a monitor value estimation unit which has monitor quantity variation...
8993353 LED package manufacturing system and resin coating method for use in LED package manufacturing system  
In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit...
8987009 Method and apparatus for tracking interposer dies in a silicon stacked interconnect technology (SSIT) product  
A method for tracking an interposer die of a stacked silicon interconnect technology (SSIT) product includes forming a plurality of dummy components on the interposer die, and modifying one or...
8987010 Microprocessor image correction and method for the detection of potential defects  
Systems and methods are provided for developing usable chip images in order to detect and screen defects or anomalies in a manufacturing environment. More specifically, a method is provided for...
8980653 Combinatorial optimization of interlayer parameters  
The embodiments describe methods and apparatuses for combinatorial optimization of interlayer parameters for capacitor stacks. The capacitor stacks may include a substrate, an insulating layer...
8980651 Overlay measurement for a double patterning  
A multi-patterning method of manufacturing a patterned wafer provides test structures designed to enhance overlay error measurement sensitivity for monitoring and process control. One or more...
8978494 Method for determining COP generation factors for single-crystal silicon wafer  
A whole determination area of a targeted wafer is concentrically divided in a radial direction, COP density is obtained in each divided determination segment, a maximum value of the COP density is...
8969103 Method for manufacturing silicon carbide substrate and method for manufacturing semiconductor device  
A silicon carbide substrate is made of silicon carbide. In the silicon carbide substrate, a normal line of one main surface of the silicon carbide substrate and a normal line of a {03-38} plane...
8962383 Multi-nozzle organic vapor jet printing  
Systems and methods are provided for depositing thin patterned films of materials in which individual elements of the patterned film are deposited by two or more nozzles having different...
8965550 Experiments method for predicting wafer fabrication outcome  
A wafer fabrication outcome, such as wafer yield or wafer lifetime, is predicted by excluding uncontrollable but measurable internal/external noises of a DOE system, and by rendering relations...
8956886 Embedded test structure for trimming process control  
In some embodiments, a method of controlling a photoresist trimming process in a semiconductor manufacturing process may include forming a photoresist layer atop a first surface of a substrate,...
8958061 Heated wafer carrier profiling  
A method for characterizing a surface comprises rotating a carrier about an axis of rotation where the carrier has a top surface adapted to hold at least one semiconductor wafer with a major...
8956888 Photovoltaic device and method and system for making photovoltaic device  
A photovoltaic device is made using a method and a system disclosed herein. The method may comprise: providing a web of photovoltaic material; providing a web of interconnect material; cutting the...
8956897 Method for producing an optoelectronic component and optoelectronic component  
In a method for producing an optoelectronic component, a growth substrate having a first coefficient of thermal expansion is provided. A multilayered buffer layer sequence is applied thereto. A...
8951813 Method of polishing a substrate having a film on a surface of the substrate for semiconductor manufacturing  
A method of polishing a substrate having a film is provided. The method includes: performing polishing of the substrate in a polishing section; transporting the polished substrate to a wet-type...
8953868 Defect inspection method and defect inspection apparatus  
A defect inspection method comprising: picking up an image of a subject under inspection to thereby acquire an inspection image; extracting multiple templates corresponding to multiple regions,...
8945954 Inspection method, inspection apparatus, exposure control method, exposure system, and semiconductor device  
There is provided an inspection method for inspecting a substrate supporting portion configured to support a substrate during an exposure performed by an exposure apparatus, the method including:...
8945955 Method of changing reflectance or resistance of a region in an optoelectronic memory device  
A method for changing reflectance or resistance of a region in an optoelectronic memory device. Changing the reflectance of the region includes sending an electric current through the region to...
8945939 Control over hydrogen fluoride levels in oxide etchant  
The invention is directed towards methods and compositions for identifying the amount of hydrofluoric acid in a buffered oxide etching composition. In buffered oxide etching compositions it is...
8940554 Method of creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness  
A method for creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness includes: measuring a thickness of a semiconductor-on-insulator (SOI) layer at a...
8941742 Luminance measurement method, luminance measurement device, and image quality adjustment technique using the method and device  
Provided is a luminance measurement method for accurately measuring luminance of each pixel even if pixel images of a display panel overlap each other on an imaging surface of a camera. A central...
8940551 Method for monitoring contact hole etching process of TFT substrate  
The present invention provides a method for monitoring a contact hole etching process of a TFT substrate, which includes: (1) providing a substrate having a first metal layer and a monitoring...
8932874 Control over ammonium fluoride levels in oxide etchant  
The invention is directed towards methods and compositions for identifying the amount of ammonium acid in a buffered oxide etching composition. In buffered oxide etching compositions it is very...
8932883 Method of measuring surface properties of polishing pad  
The present invention relates to a method of measuring surface properties of a polishing pad which measures surface properties such as surface topography or surface condition of a polishing pad...
8930011 Method of measuring an overlay of an object  
A method of measuring an overlay of an object is provided. In the method, first information of a first structure may be obtained. A preliminary structure may be formed on the first structure....
8916407 MEMS device and method of manufacturing same  
A method of manufacturing a micromachined resonator having a moveable member comprising forming the moveable member from a material having a first concentration of dopants of a first impurity...
8906709 Combinatorially variable etching of stacks including two dissimilar materials for etch pit density inspection  
Provided are methods of high productivity combinatorial (HPC) inspection of semiconductor substrates. A substrate includes two layers of dissimilar materials interfacing each other, such as a...
8908161 Removing aluminum nitride sections  
Approaches for substantially removing bulk aluminum nitride (AlN) from one or more layers epitaxially grown on the bulk AlN are discussed. The bulk AlN is exposed to an etchant during an etching...
8906708 Method for checking ion implantation condition and method for manufacturing semiconductor wafer  
A method for checking an ion implantation condition when ions are implanted over an entirety of one surface of a semiconductor wafer having an insulator film on the one surface, the method...
8906784 Graphene epitaxied on SiC, with an open band gap and mobility comparable to standard graphene with zero band gap  
A method of manufacturing a modified structure comprising a semiconducting modified graphene layer on a substrate, comprising the subsequent following steps: supply of an initial structure...
8906777 Methods for evaluating and manufacturing semiconductor wafer  
A method for evaluating a shape change of a semiconductor wafer is provided. The method comprises acquiring unconstrained shape data of shape data of the semiconductor wafer being placed on a...
8900889 Rapid thermal processing chamber with micro-positioning system  
Methods and apparatus for rapid thermal processing of a planar substrate including axially aligning the substrate with a substrate support or with an empirically determined position are described....
8900888 Optoelectronic semiconductor chip and method for producing an optoelectronic semiconductor chip  
An optoelectronic semiconductor chip includes a semiconductor layer sequence. The semiconductor layer sequence contains at least one active layer for generating primary radiation. In addition, the...
8900887 Method for etching polysilicon gate  
A method for etching a polysilicon gate is disclosed, wherein the polysilicon gate includes an undoped polysilicon portion and a doped polysilicon portion that is situated on the undoped...
8893650 Substrate treatment apparatus, substrate treatment method, and non-transitory storage medium  
A substrate treatment apparatus configured such that substrates in a same lot are distributed by a delivery mechanism into a plurality of unit blocks, each unit block including a solution...
8893377 Apparatus and method for mounting semiconductor light-emitting element  
When bump electrodes 26 of a semiconductor light-emitting element 2 and electrode portions 21 of a mounting board 3 are joined to each other, power is supplied to the electrode portions 21 of the...
8892568 Building a library of spectra for optical monitoring  
A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during...
8891240 Apparatus and method for cooling a semiconductor device  
An apparatus and method for cooling a semiconductor device. The apparatus comprises a chamber configured for receiving a cooling fluid; and a plurality of contact elements comprising respective...
8889434 Scanner overlay correction system and method  
A method includes performing a semiconductor fabrication process on a plurality of substrates. The plurality of substrates are divided into a first subset and a second subset. A rework process is...
8884406 Etch depth determination structure  
A semiconductor device wafer includes a test structure. The test structure includes a layer of material having an angle-shaped test portion disposed on at least a portion of a surface of the...
8883522 System for semiconductor device characterization using reflectivity measurement  
A system includes a computer-readable medium that stores a plurality of instructions for execution by at least one computer processor. The instructions include receiving a reflectivity measurement...
8877525 Low cost secure chip identification  
Mechanisms are provided for chip (e.g., semiconductor chip) identification (e.g., low cost secure identification). In one example, a method of manufacturing for implementing integrated chip...
8877524 Emission tuning methods and devices fabricated utilizing methods  
A method for fabricating light emitting diode (LED) chips comprising providing a plurality of LEDs, typically on a wafer, and coating the LEDs with a conversion material so that at least some...