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7629207 Bottom gate thin film transistor and method of manufacturing the same  
A method of manufacturing a bottom gate thin film transistor (“TFT”) in which a polycrystalline channel region having a large grain size is formed relatively simply and easily. The method of...
7611931 Semiconductor structures with body contacts and fabrication methods thereof  
A semiconductor structure for a dynamic random access memory (DRAM) cell array that includes a plurality of vertical memory cells built on a semiconductor-on-insulator (SOI) wafer and a body...
7585711 Semiconductor-on-insulator (SOI) strained active area transistor  
A selectively strained MOS device such as selectively strained PMOS device making up an NMOS and PMOS device pair without affecting a strain in the NMOS device the method including providing a...
7579225 Method of forming semiconductor device having stacked transistors  
There is provided a method of forming a semiconductor device having stacked transistors. When forming a contact hole for connecting the stacked transistors to each other, ohmic layers on the bottom...
7572687 Semiconductor device and manufacturing method of the same  
Disclosed is a semiconductor device. The semiconductor device includes a first gate formed in a trench of a semiconductor substrate, a first gate oxide layer on the semiconductor substrate...
7572686 System for thin film deposition utilizing compensating forces  
A process for depositing a thin film material on a substrate is disclosed, comprising simultaneously directing a series of gas flows from the output face of a delivery head of a thin film...
7560313 SOI wafer and method for producing the same  
The present invention provides a SOI wafer produced by an ion implantation delamination method wherein a width of a SOI island region in a terrace portion generated in an edge portion of the SOI...
7553708 Fabricating method for a liquid crystal display of horizontal electric field applying type  
A liquid crystal display having an applied horizontal electric field comprising: a gate line; a common line substantially parallel to the gate line; a data line arranged to cross the gate line and...
7550332 Non-planar transistor having germanium channel region and method of manufacturing the same  
Provided is a non-planar transistor with a multi-gate structure that includes a germanium channel region, and a method of manufacturing the same. The non-planar transistor includes a silicon body...
7538351 Method for forming an SOI structure with improved carrier mobility and ESD protection  
A semiconductor device and method for forming the same including improved electrostatic discharge protection for advanced semiconductor devices, the semiconductor device including providing...
7531394 Manufacturing method for a TFT LCD array substrate  
The present invention discloses a method for manufacturing a TFT LCD array substrate by utilizing the gray tone mask technology and the photoresist lifting-off technology with only two masks in two...
7521300 Semiconductor device substrate including a single-crystalline layer and method of manufacturing semiconductor device substrate  
A method of manufacturing a semiconductor device substrate includes forming a mask layer pattern on a semiconductor layer insulated from a surface of a semiconductor substrate by an electrically...
7517765 Method for forming germanides and devices obtained thereof  
The present invention discloses a method for forming germanides on substrates with exposed germanium and exposed dielectric(s) topography, thereby allowing for variations in the germanide forming...
7488630 Method for preparing 2-dimensional semiconductor devices for integration in a third dimension  
A method which is intended to facilitate and/or simplify the process of fabricating interlayer vias by selective modification of the FEOL film stack on a transfer wafer is provided. Specifically,...
7479410 Hybrid-orientation technology buried n-well design  
A semiconductor structure is provided that includes a hybrid orientated substrate having at least two coplanar surfaces of different surface crystal orientations, wherein one of the coplanar...
7473590 Semiconductor device having body contact through gate and method of fabricating the same  
According to an embodiment of the invention, a lower transistor is formed on a semiconductor substrate, and an upper thin film transistor is formed on the lower transistor. A body contact plug is...
7470598 Semiconductor layer structure and method of making the same  
A method of forming a circuit includes providing a first substrate; positioning an interconnect region on a surface of the first substrate; providing a second substrate; positioning a device...
7462514 Semiconductor device and method for manufacturing the same, liquid crystal television, and EL television  
An object of the present invention is to provide a method for manufacturing a semiconductor device having a semiconductor element capable of reducing a cost and improving a throughput with a minute...
7459753 Electro-optical device, method for manufacturing electro-optical device, and electronic apparatus  
An electro-optical device includes a substrate having a display region; TFTs each including a first electrode in the display region, a first insulating layer on the first electrode, a second...
7452794 Manufacturing method of a thin film semiconductor device  
A substrate processing apparatus includes a plurality of evacuable treatment chambers connected to one another via an evacuable common chamber, and the common chamber is provided with means for...
7439135 Self-aligned body contact for a semiconductor-on-insulator trench device and method of fabricating same  
A structure and method of forming a body contact for an semiconductor-on-insulator trench device. The method including: forming set of mandrels on a top surface of a substrate, each mandrel of the...
7439112 Semiconductor device using partial SOI substrate and manufacturing method thereof  
A semiconductor device manufacturing method includes selectively removing portions of a buried oxide layer and first semiconductor layer in an SOI substrate having the first semiconductor layer...
7435633 Electroluminescence device, manufacturing method thereof, and electronic apparatus  
An organic electroluminescence device including: a substrate having conductivity on at least one side; a first insulation film, formed on one side of the substrate, while having an aperture which...
7402466 Strained silicon CMOS on hybrid crystal orientations  
Methods of forming a strained Si-containing hybrid substrate are provided as well as the strained Si-containing hybrid substrate formed by the methods. In the methods of the present invention, a...
7396710 Fin-type semiconductor device with low contact resistance and its manufacture method  
A semiconductor device comprises a fin-type semiconductor region (fin) on a support substrate, having a pair of generally vertical side walls and an upper surface coupling the side walls; an...
7384829 Patterned strained semiconductor substrate and device  
A method that includes forming a pattern of strained material and relaxed material on a substrate; forming a strained device in the strained material; and forming a non-strained device in the...
7382029 Method and apparatus for improving integrated circuit device performance using hybrid crystal orientations  
A method for implementing a desired offset in device characteristics of an integrated circuit includes forming a first device of a first conductivity type on a first portion of a substrate having a...
7368337 Semiconductor device and manufacturing method thereof  
A semiconductor device and method of manufacturing the same are disclosed. An example semiconductor device includes a semiconductor substrate having a first well, a first source electrode, a drain...
7368334 Silicon-on-insulator chip with multiple crystal orientations  
A silicon-on-insulator chip includes an insulator layer, typically formed over a substrate. A first silicon island with a surface of a first crystal orientation overlies the insulator layer and a...
7351620 Methods of forming semiconductor constructions  
The invention includes BIFETRAM devices. Such devices comprise a bipolar transistor in combination with a field effect transistor (FET) in a three-dimensional stacked configuration. The memory...
7326603 Semiconductor device, method of manufacturing semiconductor substrate, and method of manufacturing semiconductor device  
A semiconductor device includes a semiconductor substrate that has an oxide film selectively formed on a part thereof; a semiconductor layer that is formed on the oxide film by epitaxial growth; a...
7319378 Anti-theft system for a vehicle with real-time notification feature  
A comprehensive vehicle anti-theft and alarm system that immediately notifies a vehicle owner when a vehicle is being tampered with. Notification is accomplished via wireless signal to the owners'...
7253040 Fabrication method of semiconductor device  
An insulating substrate is bonded to a monocrystalline Si substrate that includes a monocrystalline Si thin film transistor and a hydrogen ion implanted portion. After depositing an amorphous Si...
7132689 Liquid crystal display of horizontal electric field applying type and fabricating method thereof  
A liquid crystal display having an applied horizontal electric field comprising: a gate line; a common line substantially parallel to the gate line; a data line arranged to cross the gate line and...
7118945 Method of forming insulating layer and method of fabricating thin film transistor using the same  
A method of forming an insulating layer including preparing a substrate and depositing an insulating layer on the substrate such that density of a top portion of the insulating layer is different...
7115904 Method of manufacturing organic electroluminescent device, organic electroluminescent device, substrate for organic electroluminescent device, and electronic apparatus  
To provide an organic electroluminescent device, a manufacturing method thereof, and an electronic apparatus, which can reduce wiring line resistance, lower power consumption, suppress heating and...
7115453 Semiconductor device and manufacturing method of the same  
Provided is a technique of effectively removing a metallic element that has catalytic action in terms of the crystallization of a semiconductor film and remains in a semiconductor film obtained...
7091073 Semiconductor component, active matrix substrate for a liquid crystal display, and methods of manufacturing such component and substrate  
In contrast to conventional semiconductor components formed on a silicon substrate, the present invention aims at providing a transistor component functioning as a semiconductor component by being...
7078766 Transistor and logic circuit on thin silicon-on-insulator wafers based on gate induced drain leakage currents  
A transistor structure fabricated on thin SOI is disclosed. The transistor on thin SOI has gated n+ and p+ junctions, which serve as switches turning on and off GIDL current on the surface of the...
7078275 Semiconductor device and manufacturing method for same  
An object is to provide a semiconductor device manufacturing method which makes possible a thin film transistor which is little affected by crystal grain boundaries, even when the channel width of...
7075155 Structure for protecting a semiconductor circuit from electrostatic discharge and a method for forming the structure  
A structure for protecting a semiconductor circuit from electrostatic discharge is provided. The structure comprises a semiconductor substrate of a first conductivity type having two wells of a...
7075002 Thin-film photoelectric conversion device and a method of manufacturing the same  
A method of manufacturing a thin-film solar cell, comprising the steps of: forming an amorphous silicon film on a substrate; placing a metal element that accelerates the crystallization of silicon...
7071039 Manufacturing method of partial SOI wafer, semiconductor device using the partial SOI wafer and manufacturing method thereof  
A semiconductor device includes a first semiconductor region having a buried oxide layer formed therein, a second semiconductor region in which the buried oxide layer does not exist, a trench...
7064018 Methods for fabricating three dimensional integrated circuits  
A method of forming a semiconductor device includes fabricating digital circuits comprising a programmable logic circuit on a substrate; selectively fabricating either a memory circuit or a...
7052941 Method for making a three-dimensional integrated circuit structure  
Vertically oriented semiconductor devices may be added to a separately fabricated substrate that includes electrical devices and/or interconnect. The plurality of vertically oriented semiconductor...
7045413 Method of manufacturing a semiconductor integrated circuit using a selective disposable spacer technique and semiconductor integrated circuit manufactured thereby  
Methods of manufacturing a semiconductor integrated circuit using selective disposable spacer technology and semiconductor integrated circuits manufactured thereby: The method includes forming a...
6977408 High-performance non-volatile memory device and fabrication process  
An EEPROM device exhibiting high saturation current and low signal propagation delay and a process for fabricating the device that includes the formation of refractory metal silicide regions in the...
6972220 Structures and methods of anti-fuse formation in SOI  
An anti-fuse structure that can be programmed at low voltage and current and which potentially consumes very little chip spaces and can be formed interstitially between elements spaced by a minimum...
6972218 Semiconductor device and fabricating method thereof  
The present invention relates to a method of fabricating a semiconductor device that allows assuredly ion implanting an impurity to a support substrate and a semiconductor device that can rapidly...
6943067 Three-dimensional integrated semiconductor devices  
The present invention describes a process for three-dimensional integration of semiconductor devices and a resulting device. The process combines low temperature wafer bonding methods with...
Matches 1 - 50 out of 238 1 2 3 4 5 >