Match Document Document Title
9123584 In-line metrology system  
A metrology system for gauging and spatially mapping a semiconductor material on a substrate can be used in controlling deposition and thermal activation processes.
9040316 Semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping  
A semiconductor device and method of adaptive patterning for panelized packaging with dynamic via clipping is described. A panel comprising an encapsulating material disposed around a plurality of...
9040350 Packaging and function tests for package-on-package and system-in-package structures  
A method includes placing a plurality of bottom units onto a jig, wherein the plurality of bottom units is not sawed apart and forms an integrated component. Each of the plurality of bottom units...
9041219 Multi chip package, manufacturing method thereof, and memory system having the multi chip package  
A multi-chip package is provided. The multi-chip package includes a plurality of chips including at least one bad chip and at least one good chip that are stacked and a plurality of through...
9012245 Methods of making integrated circuit products  
In the disclosed methods, integrated circuit (IC) dice are manufactured from a common specification, and the IC dice are tested for defective circuitry. Respective defect sets are generated to...
9006739 Semiconductor test and monitoring structure to detect boundaries of safe effective modulus  
A method of testing an integrated circuit (IC) chip and a related test structure are disclosed. A test structure includes a monitor chain proximate to at least one solder bump pad, the monitor...
9006004 Probing chips during package formation  
A method includes bonding a first package component on a first surface of a second package component, and probing the first package component and the second package component from a second surface...
9000702 Power management multi-chip module with separate high-side driver integrated circuit die  
A packaged device includes a first die, a second die, and specially spaced and positioned sets of package terminals. The first die includes a pulse-width modulator (PWM), a processor, a timer,...
8997822 Substrate inverting device, substrate inverting method, and peeling system  
According to an embodiment of the present disclosure, a substrate inverting device for inverting front and rear surfaces of a substrate is provided. The substrate includes a first holding unit...
8993450 Device package and methods for the fabrication and testing thereof  
Provided are methods of forming sealed via structures. One method involves: (a) providing a semiconductor substrate having a first surface and a second surface opposite the first surface; (b)...
8993353 LED package manufacturing system and resin coating method for use in LED package manufacturing system  
In resin coating, carrying a light-passing member test-coated with a resin on a light-passing member carrying unit; making a light source placed above the light-passing member carrying unit emit...
8975095 Integrated nanowire/nanosheet nanogap and nanopore for DNA and RNA sequencing  
A technique is provided for base recognition in an integrated device is provided. A target molecule is driven into a nanopore of the integrated device. The integrated device includes a nanowire...
8956789 Methods for fabricating integrated circuits including multi-patterning of masks for extreme ultraviolet lithography  
Methods for fabricating integrated circuits are provided. In one example, a method for fabricating an integrated circuit includes patterning a first photoresist layer overlying a mask blank that...
8956921 Method of molding semiconductor package  
A method of molding a semiconductor package includes coating liquid molding resin or disposing solid molding resin on a top surface of a semiconductor chip arranged on a substrate. The solid...
8956887 Method for manufacturing semiconductor light-emitting element  
The invention is directed to the provision of a method for manufacturing a semiconductor light-emitting element that eliminates the need for preparing a plurality of different fluorescent sheets....
8956914 Integrated circuit package system with overhang die  
An integrated circuit package system comprising: forming a substrate having a solder mask with a support structure formed from the solder mask; mounting a first integrated circuit device over the...
8951834 Methods of forming solder balls in semiconductor packages  
Methods of forming solder balls for semiconductor packages using film-assisted molding include providing a substrate, forming a plurality of solder balls on the substrate where each solder ball...
8945953 Method of manufacturing semiconductor device  
Provided is a method of manufacturing a semiconductor device including a step of testing every one of through-electrodes. A second probe test is conducted to check an electrical coupling state...
8946883 Wafer level fan-out package with a fiducial die  
A wafer level fan-out package with a fiducial die is disclosed and may include a semiconductor die and a transparent fiducial die both encapsulated in a molding compound resin, passivation layers...
8941742 Luminance measurement method, luminance measurement device, and image quality adjustment technique using the method and device  
Provided is a luminance measurement method for accurately measuring luminance of each pixel even if pixel images of a display panel overlap each other on an imaging surface of a camera. A central...
8940557 Method of fabricating wafer level package  
A method of fabricating a wafer level package includes preparing a wafer including a plurality of first semiconductor chips, mounting a plurality of second semiconductor chips on the wafer,...
8927333 Die carrier for package on package assembly  
A package-on-package arrangement for maintaining die alignment during a reflow operation is provided. A first top die has a first arrangement of solder bumps. A bottom package has a first...
8928129 Semiconductor packaging for a memory device and a fabricating method thereof  
A semiconductor device includes a substrate, a semiconductor chip, a first molding member and a metal layer. The substrate includes a first ground pad formed therein, the first ground pad having a...
8928008 Light emitting device package comprising a lead electrode exposed to a recessed bottom portion of the package body  
A light emitting device package is provided. The light emitting device package comprises a package body comprising a first cavity, and a second cavity connected to the first cavity; a first lead...
8921165 Elimination of silicon residues from MEMS cavity floor  
The present invention generally relates to a MEMS device in which silicon residues from the adhesion promoter material are reduced or even eliminated from the cavity floor. The adhesion promoter...
8921128 Method of manufacturing MEMS devices with reliable hermetic seal  
Manufactured capped MEMS device wafers are tested for hermeticity on a vacuum prober at differing pressures or on a wafer prober at differing temperatures. Resonant frequency testing is conducted....
8921127 Semiconductor device and method of simultaneous testing of multiple interconnects for electro-migration  
A semiconductor device has a substrate and conductive layer over the substrate. A resistive element is formed between first and second portions of the conductive layer. A plurality of...
8912540 Semiconductor device  
Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening portion on the pad of a probe region and...
8912015 Operating method of hardwired switch  
An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is...
8906740 Integrated circuit packaging system having dual sided connection and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: mounting an integrated circuit, having a device through via and a device interconnect, over a substrate with the device...
8895326 Method of attaching wafer to sheet  
A wafer attaching method of attaching a wafer having a warp to a sheet includes a wafer warp detecting step of detecting a surface shape of the wafer, a wafer positioning step of applying a...
8890143 Method to optimize and reduce integrated circuit, package design, and verification cycle time  
A method for fabricating an integrated circuit (IC) product and IC product formed thereby. The method includes designing an IC package having a plurality of IC connection sets, each configured to...
8884639 Methods, apparatus and articles of manufacture for testing a plurality of singulated die  
In one embodiment, a method for testing a plurality of singulated semiconductor die involves 1) placing each of the singulated semiconductor die on a surface of a die carrier, 2) mating an array...
8877552 Method and apparatus for manufacturing electronic integrated circuit chip  
A method (and apparatus) of assembling a die on an electronic substrate, includes processing an assembly including a substrate and a die, and during the processing, introducing a pre-stress to the...
8878205 Light emitting diode wafer-level package with self-aligning features  
Several embodiments of light emitting diode packaging configurations including a substrate with a cavity are disclosed herein. A patterned wafer has a plurality of individual LED attachment sites,...
8878561 Screening method, screening device and program  
This invention is to detect defective products of semiconductor devices with high accuracy even when the characteristics of the semiconductor devices vary according to their positions on each of...
8878559 IC current measuring apparatus and IC current measuring adapter  
An IC current measuring apparatus is provided between an IC and a substrate. The IC current measuring apparatus electrically connects each of a plurality of IC-facing terminals and a different one...
8871532 Method of manufacturing semiconductor device  
A method of manufacturing a semiconductor device which solves a problem with a burn-in process where current and voltage are applied to finished semiconductor devices at high-temperature. The...
8873920 Light-guiding cover structure  
A light-guiding cover structure includes a top cover unit and a light-guiding unit. The top cover unit has a plurality of receiving spaces formed therein. The light-guiding unit includes a...
8872355 Semiconductor device with pre-molding chip bonding  
This disclosure relates generally to a semiconductor device and method of making the semiconductor device by pressing an electrical contact of a chip into a bonding layer on a carrier. The bonding...
8859300 On chip inductor with frequency dependent inductance  
A set of metal line structures including a signal transmission metal line and a capacitively-grounded inductively-signal-coupled metal line is embedded in a dielectric material layer. A capacitor...
8852973 Method for manufacturing light emitting diode module  
A method for manufacturing an LED module includes following steps: providing a SMT (Surface Mount Technology) apparatus having a CCD (Charge-Coupled Device) image sensor and a nozzle, and...
8853694 Chip on film package including test pads and semiconductor devices including the same  
Provided are a chip on film (COF) package and semiconductor having the same. The COF package can include a flexible film having first and second surfaces opposite to and facing each other and...
8846447 Thin wafer handling and known good die test method  
A method of attaching a microelectronic element to a substrate can include aligning the substrate with a microelectronic element, the microelectronic element having a plurality of spaced-apart...
8848127 Liquid crystal panel, manufacture method and repair method thereof  
An embodiment of the invention provide a liquid crystal panel comprising a driving chip assembly comprising: a chip lead wiring and a chip repair line, which are overlapped but insulated from each...
8841169 High density chip packages, methods of forming, and systems including same  
Methods and devices for multi-chip stacks are shown. A method is shown that assembles multiple chips into stacks by stacking wafers prior to dicing into individual chips. Methods shown provide...
8836355 Dynamic testing based on thermal and stress conditions  
A plurality of sets of test conditions of a die in a stacked system is established, wherein the plurality of test conditions are functions of temperatures of the die, and wherein the stacked...
8835922 Monitoring pad and semiconductor device including the same  
A method of manufacturing a semiconductor device and a semiconductor device package are disclosed. A method of manufacturing a semiconductor device comprises the steps of testing the semiconductor...
8828798 Semiconductor die assemblies, semiconductor devices including same, and methods of fabrication  
Methods of fabricating multi-die assemblies including a wafer segment having no integrated circuitry thereon and having a plurality of vertically stacked dice thereon electrically interconnected...
8828746 Compensation for a charge in a silicon substrate  
A silicon device includes an active silicon layer, a buried oxide (BOX) layer beneath the active silicon layer and a high-resistivity silicon layer beneath the BOX layer. The device also includes...