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8183879 |
Measuring arrangement, semiconductor arrangement and method for operating a semiconductor component as a reference source
The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are...
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8183682 |
Methods of packaging a semiconductor die and package formed by the methods
A method of packaging a semiconductor die. The method comprises mounting a semiconductor die to a die attach pad on a carrier and electrically coupling an electrode of the semiconductor die and a...
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8178364 |
Testing method of surface-emitting laser device and testing device thereof
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane...
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8178876 |
Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test...
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8178972 |
Semiconductor device and manufacturing method therefor
A semiconductor device is obtained, in which excellent characteristics are achieved, the reliability is improved, and an SiC wafer can also be used for the fabrication. A plurality of...
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8174349 |
Electronic component and manufacturing method of electronic component
A manufacturing method of electronic components includes forming a first insulation layer on a substrate, forming a plurality of passive elements on the first insulation layer, forming a second...
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8163598 |
Clipless integrated heat spreader process and materials
In one or more embodiments, a method comprising applying thermo compression to a package assembly including a lid, a die, and a package substrate to assemble the package assembly is disclosed. The...
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8159076 |
Method of producing a via in a reconstituted substrate
A method of producing an electronic connection device, including: a) formation, in a plane of a support substrate, of at least one first contact element and, in a direction approximately...
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8129201 |
Stacking apparatus and method for stacking integrated circuit elements
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move...
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8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
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8114303 |
Method of manufacturing ceramic probe card
Provided is a method of manufacturing a ceramic probe card. A ceramic laminated body having a plurality of ceramic green sheets and an interlayer circuit including a conductive via and a conductive...
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8114687 |
Adapter board and method for manufacturing same, probe card, method for inspecting semiconductor wafer, and method for manufacturing semiconductor device
A method of manufacturing a semiconductor device includes preparing two package substrates, electrically coupling a semiconductor wafer to a measuring apparatus, inspecting the wafer, dicing the...
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8111081 |
Method for evaluating silicon wafer
The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon...
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8110905 |
Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming a substrate; mounting a base integrated circuit on the substrate; forming a leadframe interposer, over the base...
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8110415 |
Silicon based microchannel cooling and electrical package
A chip package includes: a substrate; a plurality of conductive connections in contact with the silicon carrier; a silicon carrier in a prefabricated shape disposed above the substrate, the silicon...
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8111900 |
Computer-implemented methods for detecting and/or sorting defects in a design pattern of a reticle
Various computer-implemented methods are provided. One method for sorting defects in a design pattern of a reticle includes searching for defects of interest in inspection data using priority...
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8106654 |
Magnetic sensor integrated circuit device and method
An sensor includes a substrate with a magnetic field sensor mounted on the substrate. The magnetic field sensor has a first surface defining a plane. A magnetic flux conducting member has a second...
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8101434 |
Method for LED-module assembly
A method for LED-module assembly comprising the steps of providing a base portion with a base inner surface and a cover with a cover inner surface which together define a module interior, the cover...
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8101435 |
Fabrication method for semiconductor device
A semiconductor device fabrication method can improve yield of semiconductor devices and decrease (or prevent) waste of non-defective semiconductor chips. This fabrication method has a step of...
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8101436 |
Dicing method, method of inspecting integrated circuit element, substrate holding device, and pressure sensitive adhesive film
A dicing method, integrated circuit chip testing method, substrate holding apparatus, and adhesive film are disclosed. A first adhesive film 22 in which the adhesion is reduced by ultraviolet...
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8101457 |
Mounting method, mounted structure, manufacturing method for electronic equipment, electronic equipment, manufacturing method for light-emitting diode display, and light-emitting diode display
Provided is a mounting method making it possible to, when an object such as an element, or more particularly, a microscopic object is mounted on a substrate, achieve mounting readily and reliably...
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8101433 |
Semiconductor device and manufacturing method of the same
Provided is a semiconductor device having a pad on a semiconductor chip, a first passivation film formed over the semiconductor chip and having an opening portion on the pad of a probe region and a...
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8084277 |
Semiconductor device and manufacturing method thereof
A semiconductor device and manufacturing method thereof improving moisture resistance of a FeRAM. After a probe test using a pad, a metal film is formed to cover the pad in an opening of a...
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8082119 |
Method and system for mask fabrication process control
A method for controlling mask fabrication is provided, wherein the method uses statistical process control analysis. A manufacturing model is defined. A process run of a mask is performed as...
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8080993 |
Sensor module with mold encapsulation for applying a bias magnetic field
A method of manufacturing a sensor module includes providing a substrate comprising a magnetically sensitive sensor element. The sensor element and the substrate are encapsulated with at least one...
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8080444 |
Method for forming a packaged semiconductor device having a ground plane
A method of placing a die includes providing an embedded plane. The embedded plane has a openings, grid lines, and protruding portions. Each of the plurality of openings are surrounding by a subset...
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8072076 |
Bond pad structures and integrated circuit chip having the same
Bonding pad structures and integrated circuits having the same are provided. An exemplary embodiment of a bond pad structure comprises a bond pad layer. A passivation layer partially covers the...
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8071399 |
Method of manufacturing a semiconductor integrated circuit device
An object is to prevent a breakage of a membrane probe and a wafer to be tested in a probe testing using a membrane probe with styluses formed by a manufacturing technology for a semiconductor...
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8067251 |
Semiconductor device and a method of manufacturing the same
A method including forming an intermediate product, the intermediate product being configured to include a wiring substrate including a plurality of first electrodes, a plurality of second...
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8063656 |
Method of enabling a circuit board analysis
A method of enabling a circuit board analysis is disclosed. The method comprising removing a portion of the circuit board on a first side of the circuit board opposite a second side of the circuit...
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8064071 |
Floating sheet measurement apparatus and method
A sheet measurement apparatus has a sheet disposed in a melt. The measurement system uses a beam to determine a dimension of the sheet. This dimension may be, for example, height or width. The beam...
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8048794 |
3D silicon-silicon die stack structure and method for fine pitch interconnection and vertical heat transport
A method of fabricating a thin wafer die includes creating circuits and front-end-of-line wiring on a silicon wafer, drilling holes in a topside of the wafer, depositing an insulator on the drilled...
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8048690 |
Pressure-sensitive adhesive sheet and process for producing semiconductor device having same
A pressure-sensitive adhesive sheet according to the present invention is a pressure-sensitive adhesive sheet in which a pressure-sensitive adhesive layer is provided on a base film, in which the...
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8039303 |
Method of forming stress relief layer between die and interconnect structure
A semiconductor device is made by forming a first conductive layer over a sacrificial carrier. A conductive pillar is formed over the first conductive layer. An active surface of a semiconductor...
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8039275 |
Integrated circuit packaging system with rounded interconnect and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming a rounded interconnect on a package carrier having an integrated circuit attached thereto; placing a mold chase...
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8039274 |
Multi-chip package semiconductor device and method of detecting a failure thereof
A semiconductor chip may include at least one power supply pad for receiving an external power voltage, at least one input/output pad, an internal function block that may be configured to operate...
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8034641 |
Method for inspection of defects on a substrate
A method for inspection of defects on a substrate includes positioning a probe of a scanning probe microscopy (SPM) over and spaced apart from a substrate, includes scanning the substrate by...
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8035203 |
Radio frequency over-molded leadframe package
An over-molded leadframe (e.g., a Quad Flat No-lead (QFN)) package capable of operating at frequencies in the range of about five gigahertz (GHz) to about 300 GHz and a method of making the...
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8030098 |
Pre-formed conductive bumps on bonding pads
Apparatuses including pre-forming conductive bumps on bonding pads for probing and wire-bonding connections and methods for making the same are disclosed. A method may include providing a...
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8025204 |
Method of wire bond encapsulation profiling
A method for profiling a bead of encapsulant extending along an edge of a die mounted to a supporting structure, by depositing a bead of encapsulant onto wire bonds along the edge of the die,...
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8017871 |
Wired circuit board assembly sheet
A wired circuit board assembly sheet has a plurality of wired circuit boards, distinguishing marks for distinguishing defectiveness of the wired circuit boards, and a supporting sheet for...
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8017450 |
Method of forming assymetrical encapsulant bead
A method of forming an asymmetrical encapsulant bead on a series of wire bonds electrically connecting a micro-electronic device to a series of conductors, the micro-electronic device having a...
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8017436 |
Thin substrate fabrication method and structure
A method of forming a package includes forming a circuit pattern on a first carrier and embedding the circuit pattern in a dielectric material on a second carrier. The first carrier is removed and...
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8017447 |
Laser process for side plating of terminals
A method of preparing a portion of the side of a terminal of an Integrated Circuit (IC) package for solder is disclosed. The method comprises the steps of attaching an IC die to a leadframe...
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8012867 |
Wafer level chip scale package system
A wafer level chip scale package system is provided including placing a first integrated circuit over a semiconductor wafer having a second integrated circuit; connecting a second electrical...
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8002600 |
Method for repairing defective line of organic light emitting display device
A method of repairing a defective line of an organic light emitting display device which repairs a short defect occurring between a bidirectional line and an adjacent line includes separating a...
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7998760 |
Manufacture method for photovoltaic module including inspection and repair
After overlaying a conductive adhesive film and the wiring material on an electrode of a solar cell and temporarily fixing the wiring material to the solar cell by pressure bonding under first...
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7993939 |
Integrated circuit package system with laminate base
An integrated circuit package system with laminate base is provided including forming a base package including, forming a laminate substrate strip, mounting an integrated circuit on the laminate...
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7993941 |
Semiconductor package and method of forming Z-direction conductive posts embedded in structurally protective encapsulant
A semiconductor package is made using a prefabricated post carrier including a base plate and plurality of conductive posts. A film encapsulant is disposed over the base plate of the post carrier...
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7993940 |
Component attach methods and related device structures
A method, and associated apparatus, for attaching a component (e.g., an electronic and/or optoelectronic component) is provided which can facilitate low-voiding of an attachment layer. The method...
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