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7423286 |
Laser transfer article and method of making
The present invention is directed to methods for transferring pre-formed electronic devices, such as transistors, resistors, capacitors, diodes, semiconductors, inductors, conductors, and...
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7422914 |
Fabrication method of semiconductor integrated circuit device
A memory test is carried out on semiconductor integrated circuit devices including a semiconductor memory at low cost with efficiency. In a test burn-in system, twenty-four test boards are...
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7416910 |
Pyramid socket suspension
An apparatus and method for flexibly suspending a sensing mechanism between a pair of cover plates, including a sensing mechanism formed in a crystalline silicon substrate; a pair of cover plates...
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7414323 |
Tab tape and method of manufacturing the same
Input test pads of an adjacent pattern area are placed in a vacant area of a layout area of output test pads, optimizing the layout area of test pads for use in inspection of a semiconductor chip....
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7407822 |
Method for inspecting insulating film for film carrier tape for mounting electronic components thereon, inspection apparatus for inspecting the insulating film, punching apparatus for punching the insulating film, and method for controlling the punching apparatus
The invention provides an inspection apparatus and an inspection method for detecting defects, a punching apparatus, and a method for controlling a punching apparatus, for the purpose of immediate...
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7405103 |
Process for fabricating chip embedded package structure
A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active...
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7393754 |
Tape carrier type semiconductor device and method of producing the same
A tape carrier type semiconductor device comprising: a long flexible insulating tape; and a plurality of semiconductor devices sequentially arranged on one surface of the tape, wherein each...
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7391119 |
Temperature sustaining flip chip assembly process
A temperature sustaining flip chip process in which ILD cracking and delamination are lessened. A sequence of substrate prebake, underfill dispense, chip placement, solder reflow and underfill cure...
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7390681 |
Derived metric for monitoring die placement
A method for monitoring die placement includes receiving measurements of an alignment of a semiconductor die mounted in a package by a die packaging tool. The measurements include center offset...
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7384805 |
Transfer mold semiconductor packaging processes
In one implementation, a circuit substrate includes a substrate having opposing sides. At least one of the sides is configured for transfer mold packaging and has conductive traces formed thereon....
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7380333 |
Chip resistor fabrication method
A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to...
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7378288 |
Systems and methods for producing light emitting diode array
Systems and methods are disclosed for producing vertical LED array on a metal substrate; evaluating said array of LEDs for defects; destroying one or more defective LEDs; forming good LEDs only LED...
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7374957 |
Method of calibrating or qualifying a lithographic apparatus or part thereof, and device manufacturing method
A system and method are provided for qualifying or calibrating lithographic apparatus or parts therefor, using a predetermined objective criterion such as Chauvenet's criterion is used to reject...
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7371606 |
Manufacturing method of a semiconductor device
The yield of a sealing process for a semiconductor device which adopts a flip-chip mounting method is to be improved. In a molding process wherein plural semiconductor chip ICs mounted on a parts...
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7368933 |
Method for testing standby current of semiconductor package
A system and method for testing standby current of a semiconductor package is provided. The method includes testing semiconductor chips formed on a wafer having a predetermined wafer run number,...
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7368304 |
Fabricating die with separate test pads selectively coupled to cores
Timely testing of die on wafer reduces the cost to manufacture ICs. This disclosure describes a die test structure and process to reduce test time by adding test pads on the top surface of the die....
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7348597 |
Apparatus for performing high frequency electronic package testing
Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC,...
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7348210 |
Post bump passivation for soft error protection
A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct...
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7348190 |
Method of detecting a defect in a semiconductor device
A method of detecting a defect in a semiconductor device may involve immersing a substrate into a chemical solution. The substrate may support a metal wiring and an insulation layer may cover the...
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7348191 |
Semiconductor device with terminals, and method of manufacturing the same
A plurality of semiconductor chips is mounted on a surface of a substrate to be used for manufacturing semiconductor devices. The semiconductor chips are collectively sealed with resin, thereby...
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7348559 |
Defect inspection and charged particle beam apparatus
In a defect inspection apparatus which combines a plurality of probes for measuring electric properties of a specimen including a fine circuit line pattern with a charged particle beam apparatus,...
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7349223 |
Enhanced compliant probe card systems having improved planarity
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that...
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7338819 |
System and method for matching chip and package terminals
A system and method for matching chip and package terminals and for packaging integrated circuits. Various aspects of the present invention may comprise receiving as input a first list of chip...
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7335582 |
Component
Semiconductor component, having a first chip arranged on a second chip, in which the first and second chips in each case have, on one of their main areas, first and second metalizations,...
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7335517 |
Multichip semiconductor device, chip therefor and method of formation thereof
A multichip semiconductor device is disclosed in which chips are stacked each of which comprises a semiconductor substrate formed on top with circuit components and an interlayer insulating film...
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7335969 |
Method of monitoring introduction of interfacial species
A method for monitoring a nitridation process, including: (a) providing a semiconductor substrate; (b) forming a first dielectric layer on a top surface of the substrate; (c) introducing a quantity...
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7332362 |
Method for inspecting semiconductor device
A wafer is irradiated with laser light having a wavelength which is transmitted through an inside of a crystal of the wafer and does not generate an electromotive force due to photo-excitation...
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7329555 |
Method of selectively forming MEMS-based semiconductor devices at the end of a common fabrication process
Various semiconductor devices can be formed at the end of a common fabrication process, thereby significantly improving manufacturing flexibility, by selectively wiring bonding different CMOS...
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7323359 |
Mounting method for a semiconductor component
A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one contact/mounting element made of...
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7319042 |
Method and apparatus for manufacture and inspection of semiconductor device
A semiconductor device is manufactured in such a way that a semiconductor chip connected with leads whose internal ends are interconnected with bonding wires are completely sealed and enclosed in a...
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7316936 |
Laser decapsulation method
A decapsulation apparatus 100 has a laser 8 that removes plastic encapsulant from a device 24 . Chamber 20 is sealed. Exhaust port 9 removes debris and fumes. The device 24 is positioned...
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RE39957 |
Method of making semiconductor package with heat spreader
A method is provided of making a semiconductor package with a heat spreader in which a chip carrier module plate consisting of a plurality of array-arranged chip carriers is mounted with at least...
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7301225 |
Multi-row lead frame
A lead frame ( 10 ) for a semiconductor device includes a first row of terminals ( 12 ) surrounding a die receiving area ( 14 ) and a second row of terminals ( 16 ) spaced from and surrounding the...
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7297562 |
Circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns
A circuit-on-foil process for manufacturing a laminated semiconductor package substrate having embedded conductive patterns provides a high-density mounting and interconnect structure for...
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7294530 |
Method for encapsulating multiple integrated circuits
A device, such as an integrated circuit or an electronic circuit component is affixed to a substrate. A first encapsulation structure encases a first integrated circuit and has at least one groove...
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7294853 |
Substrate for mounting a semiconductor
A substrate ( 1 ) is formed from a non-electrically conducting material and is for mounting a semiconductor chip ( 10 ). The substrate has a semiconductor chip mounting portion ( 6 ). A number of...
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7285429 |
Mounting device for high frequency microwave devices
In a package mounting structure for mounting a package on a case, wherein the package internally incorporates at least one of a high-frequency transistor, MIC and MMIC used in the microwave to...
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7282375 |
Wafer level package design that facilitates trimming and testing
A wafer level method of packaging, trimming and testing integrated circuits is described. A wafer having trim pads is bumped before the wafer is trimmed. After the bumping, the dice on the wafer...
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7279358 |
Mounting method and mounting device
A mounting method includes the steps of, after positioning objects being bonded relative to each other, moving a movable wall positioned there around until coming into contact with one object...
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7279785 |
Stacked die package system
A stacked die package system including forming a bottom package including a bottom substrate and a bottom die mounted and electrically connected under the bottom substrate and forming a top package...
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7273761 |
Box-in-box field-to-field alignment structure
A lithographic pattern includes a first scribe along an edge of a die region, and a second scribe along an opposing edge of the die region. The first scribe includes at least a first translucent...
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7272896 |
Data transfer between moisture sensors
A method of monitoring electrical component moisture exposure includes calculating a remaining floor life value for a group of electrical component containers and a first container, based on an...
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7271013 |
Semiconductor device having a bond pad and method therefor
A bond pad ( 10 ) has a probe region ( 14 ) and a wire bond region ( 12 ) that are substantially non-overlapping. In one embodiment, the bond pad ( 10 ) is connected to a final metal layer pad ( 16...
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7268001 |
Enhancement of grain structure for contacts
A method for cross sectioning a feature of a semiconductor device while preserving the grain structure of a contact material is provided. The method initiates with exposing the contact material of...
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7264994 |
Method of fabricating a semiconductor device
A package substrate is placed in a first predetermined position on a supporting equipment. A chip guide equipment and a magnetic-field-generating equipment in a second predetermined position are...
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7264977 |
Method of RFIC die-package configuration
A method for packaging a radio frequency integrated circuit (RFIC) in multiple packages begins by determining a 1 st position of the RFIC die in a 1 st package wherein the positioning is such to...
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7262074 |
Methods of fabricating underfilled, encapsulated semiconductor die assemblies
An apparatus and method may be used for packaging a semiconductor die and a carrier substrate to substantially prevent trapped moisture therebetween and provide a robust, inflexible cost-effective...
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7257887 |
Die holding apparatus for bonding systems
A die holding apparatus to form electrical contacts on individual dies is described. In one embodiment, a semiconductor device holder is used to hold individual dies for processing and...
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7259028 |
Test pads on flash memory cards
A semiconductor package is disclosed including test pads formed of solder bumps affixed to the semiconductor package during fabrication. When the package is encapsulated, due to the pressure...
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7259027 |
Low energy dose monitoring of implanter using implanted wafers
A method for processing semiconductor wafers, e.g., silicon. The method includes providing a monitor wafer, which is made of a crystalline material. The method includes introducing a plurality of...
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