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8185337 |
System, method, and computer program product for testing and re-testing integrated circuits
A system, method, and computer program product are provided for testing and re-testing integrated circuits. In use, a group of integrated circuits is tested. In use, before finishing the test, at...
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8183879 |
Measuring arrangement, semiconductor arrangement and method for operating a semiconductor component as a reference source
The invention relates to a measuring arrangement, a semiconductor arrangement and a method for operating a reference source, wherein at least one semiconductor component and a voltage source are...
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8181336 |
Micro-assembler
A xerographic micro-assembler system, method and apparatus that includes a sorting unit that is adapted to receive a plurality of micro-objects. The micro-objects can also be sorted and oriented on...
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8178364 |
Testing method of surface-emitting laser device and testing device thereof
A method of performing a wafer level burn-in test for a plurality of surface-emitting laser devices formed on a wafer includes causing a plurality of contact electrodes arranged in a same plane...
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8178366 |
Pattern forming method, manufacturing method of semiconductor device, and template manufacturing method
In the pattern forming method according to the embodiment, second templates are manufactured by an imprint technology using first templates manufactured by applying a predetermined misalignment...
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8178367 |
Process condition evaluation method for liquid crystal display module
A process condition evaluation method for a liquid crystal display module (LCM) includes: a first step of obtaining a threshold power measuring pattern, an analysis sample for a cell bonding status...
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8178365 |
Method of manufacturing semiconductor device
A semiconductor wafer having IGBT elements and transistors formed on a surface thereof is prepared. Electron beams are emitted all over the surface of the semiconductor wafer. Recombination centers...
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8178876 |
Method and configuration for connecting test structures or line arrays for monitoring integrated circuit manufacturing
A test chip comprises at least one level having an array of regions. Each region is capable of including at least one test structure. At least some of the regions include respective test...
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8180589 |
System for managing recipes for operating a measurement device
A semiconductor wafer inspection device which identifies an operator when an operation is performed and checks if the requested operation is permitted is provided. In a device that has already...
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8173451 |
Etch stage measurement system
Provided is a system for measuring an etch stage of an etch process involving one or more layers in a substrate, the etch stage measurement system configured to meet two or more etch stage...
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8173448 |
Wafer with scribe lanes comprising external pads and/or active circuits for die testing
A wafer comprises i) at least one independent die having internal integrated components, a multiplicity of internal pads connected to some of the internal integrated components, ii) scribe lanes...
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8174283 |
Calibration technique for measuring gate resistance of power MOS gate device at wafer level
This invention discloses a method for calibrating a gate resistance measurement of a semiconductor power device that includes a step of forming a RC network on a test area on a semiconductor wafer...
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8173450 |
Method of designing an etch stage measurement system
Provided is a method for designing an etch stage measurement system involving an etch process for one or more layers on a substrate using an etch process tool. The etch process tool uses two or...
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8173449 |
Method for making COP evaluation on single-crystal silicon wafer
An evaluation area of an evaluation object wafer is concentrically divided in a radial direction, an upper limit value to the number of COPs is set in each divided evaluation segment, and an...
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8168450 |
Semiconductor package, stacked semiconductor package having the same, and a method for selecting one semiconductor chip in a stacked semiconductor package
A semiconductor package includes a semiconductor chip having a circuit section. A first chip selection electrode passes through a first position of the semiconductor chip, and the first chip...
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8163572 |
Method for evaluating impurity distribution under gate electrode without damaging silicon substrate
A method of manufacturing a semiconductor device forms the semiconductor device in a device region of a semiconductor substrate simultaneously with forming a monitor semiconductor device that...
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8165704 |
Method of release and product flow management for a manufacturing facility
A method and computer program product for scheduling product lots through operations of a manufacturing line. The method including: selecting a set of sequential operations required to manufacture...
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8163573 |
Method for manufacturing nitride semiconductor element
InyGa1-yN (0
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8158065 |
In situ monitoring of metal contamination during microstructure processing
By providing a tool internal sensor device in a process tool in a semiconductor facility, metal contamination may be monitored in situ, thereby avoiding or at least significantly reducing the...
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8159257 |
Element substrate, inspecting method, and manufacturing method of semiconductor device
A substrate including a semiconductor layer, where characteristics of an element can be evaluated with high reliability, and an evaluating method thereof are provided. A substrate including a...
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8159254 |
Crack sensors for semiconductor devices
Crack sensors for semiconductor devices, semiconductor devices, methods of manufacturing semiconductor devices, and methods of testing semiconductor devices are disclosed. In one embodiment, a...
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8153451 |
System and method for performing semiconductor processing on target substrate
A semiconductor process system (10) includes a measuring section (40), an information processing section (51), and a control section (52). The measuring section (40) measures a characteristic of a...
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8154019 |
Semiconductor apparatus and calibration method thereof
A semiconductor apparatus includes a reference voltage generation unit, a comparison voltage generation unit, and a calibration unit. The reference voltage generation unit is disposed in a...
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8148176 |
Methods for distinguishing a set of highly doped regions from a set of lightly doped regions on a silicon substrate
A method of distinguishing a set of highly doped regions from a set of lightly doped regions on a silicon substrate is disclosed. The method includes providing the silicon substrate, the silicon...
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8143076 |
Manufacture of defect cards for semiconductor dies
A method for producing a defect card for individual dies located on a wafer, comprising: producing first and second defect cards, where the defective individual dies whose adjoining individual dies...
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8134382 |
Semiconductor wafer having scribe line test modules including matching portions from subcircuits on active die
A semiconductor wafer includes a plurality of integrated circuit (IC) die areas for accommodating IC die that include at least a first subcircuit having at least one matched component portion that...
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8124429 |
Reprogrammable circuit board with alignment-insensitive support for multiple component contact types
The present invention is directed to a system that programmably interconnects integrated circuit chips and other components at near-intra-chip density. The system's contact structure allows it to...
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8124428 |
Structure and method for testing MEMS devices
A method for determining the presence of a sacrificial layer under a structure. The method includes providing at least one structure arranged above a substrate having a major surface lying in a...
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8126258 |
Method of detecting defects in patterns on semiconductor substrate by comparing second image with reference image after acquiring second image from first image and apparatus for performing the same
In a method of detecting defects in patterns and an apparatus for performing the method, a first image of a detection region on a semiconductor substrate may be acquired. A second image may be...
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8124427 |
Method of creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness
A method for creating an extremely thin semiconductor-on-insulator (ETSOI) layer having a uniform thickness includes: measuring a thickness of a semiconductor-on-insulator (SOI) layer at a...
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8122394 |
Performance-aware logic operations for generating masks
A method for forming masks for manufacturing a circuit includes providing a design of the circuit, wherein the circuit comprises a device; performing a first logic operation to determine a first...
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8120026 |
Testing wiring structure and method for forming the same
The invention provides a testing wiring structure of a thin film transistor (TFT) motherboard for applying signals to a plurality of signal lines in a pixel region on the motherboard and a method...
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8119426 |
Method of manufacturing an ultrasonic transducer semiconductor device
A manufacturing yield of a semiconductor device (capacitive micromachined ultrasonic transducer) is increased. A plurality of first chips 1 in which a plurality of cells each having functions of...
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8114686 |
Phase change material based temperature sensor
A block of phase change material located in a semiconductor chip is reset to an amorphous state. The block of phase change material may be connected to an internal resistance measurement circuit...
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8114699 |
Integration manufacturing process for MEMS device
A method for manufacturing an MEMS device is provided. The method includes steps of a) providing a first substrate having a concavity located thereon, b) providing a second substrate having a...
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8111081 |
Method for evaluating silicon wafer
The present invention is a method for evaluating a silicon wafer by measuring, after fabricating a MOS capacitor by forming an insulator film and one or more electrodes sequentially on a silicon...
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8110414 |
Forming integrated circuit devices with metal-insulator-metal capacitors using selective etch of top electrodes
A method of forming integrated circuits (IC) having at least one metal insulator metal (MIM) capacitor. A bottom electrode is formed on a predetermined region of a semiconductor surface of a...
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8103478 |
Method and system for semiconductor process control and monitoring by using PCA models of reduced size
By dividing a complex set of parameters of a production process in forming semiconductor devices into individual blocks, respective PCA models may be established for each block and may thereafter...
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8102014 |
Proximity head heating method and apparatus
Provided is an apparatus and a method for heating fluid in a proximity head. A method for semiconductor wafer processing, includes providing liquid to a proximity head including a heating portion,...
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8093072 |
Substrate processing apparatus and method of manufacturing semiconductor device
Provided are a substrate processing apparatus and a method of manufacturing a semiconductor device, in which shape variations of discharge electrodes can be early detected so as to prevent a film...
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8093074 |
Analysis method for semiconductor device
An analysis method for a semiconductor device is described. The semiconductor device having an abnormal region is provided. Thereafter, a focused ion beam microscope analysis process is performed...
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8093103 |
Multiple chip module and package stacking method for storage devices
Stacking techniques are illustrated in example embodiments of the present invention wherein semiconductor dies are mounted in a module to become a MCM which serves as the basic building block. A...
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8093073 |
Manufacturing method of a tray, a socket for inspection, and a semiconductor device
The yield of semiconductor devices is to be enhanced. A tray is provided with a plurality of pockets each capable of accommodating a wafer level CSP, and each of the pockets is provided with a base...
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8088632 |
Elemental analysis method and semiconductor device manufacturing method
Protons are entered into a substrate to be analyzed at a proton incident angle larger than 0° and smaller 90°. Excited by the entered protons and emitted from the substrate to be analyzed, the c...
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8084278 |
Method of manufacturing silicon carbide semiconductor device
A wafer WF is mounted in a substrate holder, and the substrate holder is placed in a film forming furnace. The film forming furnace is evacuated by a vacuum pump through a gas discharge part to...
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8084277 |
Semiconductor device and manufacturing method thereof
A semiconductor device and manufacturing method thereof improving moisture resistance of a FeRAM. After a probe test using a pad, a metal film is formed to cover the pad in an opening of a...
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8084872 |
Overlay mark, method of checking local aligmnent using the same and method of controlling overlay based on the same
An overlay mark is described, including N sets of parallel x-directional linear patterns respectively defined by N (≧2) exposure steps and N sets of parallel y-directional linear patterns r...
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8080113 |
Method and apparatus for collecting chemicals from semiconductor wafer
An apparatus and a method are provided for accurately analyzing and evaluating a degree of contamination on a chamfered part without mixing impurities from parts other than the chamfered part into...
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8076951 |
Spray cooling thermal management system and method for semiconductor probing, diagnostics, and failure analysis
A micro-spray cooling system beneficial for use in testers of electrically stimulated integrated circuit chips is disclosed. The system includes micro-spray heads disposed about a probe head. The...
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8072076 |
Bond pad structures and integrated circuit chip having the same
Bonding pad structures and integrated circuits having the same are provided. An exemplary embodiment of a bond pad structure comprises a bond pad layer. A passivation layer partially covers the...
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