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7141446 |
Optically- and electrically-addressable concentrators of biological and chemical materials
A concentrator for detecting biological and/or chemical materials in an environment. The concentrator comprises an engineered superlattice structure having alternating layers of elemental, binary...
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7141995 |
Semiconductor manufacturing device and semiconductor manufacturing method
A semiconductor manufacturing device includes a prober whose needles are at once engaged for contacting pads of two chip forming regions within a wafer. In one chip forming region, trimming is...
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7138284 |
Method and apparatus for performing whole wafer burn-in
A method and apparatus for burning in a semiconductor wafer having a plurality of active devices utilizes temporary conductive interconnect layers to separately couple at least a portion of the...
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7139632 |
Enhanced process and profile simulator algorithms
A method for enhancing a process and profile simulator algorithm predicts the surface profile that a given plasma process will create. An energetic particle is first tracked. The ion fluxes...
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7139671 |
Semiconductor device fabrication method
A semiconductor device fabrication method comprises; a first step S 1 of fabricating a plurality of semiconductor chips on a plurality of semiconductor wafers, respectively; a second step S 4 of...
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7138283 |
Method for analyzing fail bit maps of wafers
A method of detecting a wafer failure includes extracting the wafer ID of a target wafer in the target lot from the lot ID, extracting the location information of a failure in the target wafer,...
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7139630 |
Allocating manufactured devices according to customer specifications
A method and system sorts manufactured integrated circuit devices by evaluating performance characteristics of the manufactured integrated circuit devices. All of the integrated circuit devices are...
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7135123 |
Method and system for integrated circuit backside navigation
The backside navigation method of the present invention includes milling a fiducial opening through the substrate of an integrated circuit. The milling process is stopped when the fiducial opening...
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7135346 |
Structure for monitoring semiconductor polysilicon gate profile
Detection of a profile drift of a polysilicon line is enhanced by a test structure that (1) measures a bottom width and an average width of a cross sectional area of the same polysilicon line (2)...
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7135344 |
Design-based monitoring
A method for monitoring fabrication of an integrated circuit (IC) on a semiconductor wafer includes generating a product design profile (PDP) using an electronic design automation (EDA) tool, the...
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7132302 |
Method of increasing cell retention capacity of silicon nitride read-only-memory cell
A method of increasing the cell retention capacity of a silicon nitride read-only-memory on a wafer. The method includes carrying out a baking process after performing the last plasma treatment of...
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7129099 |
Method for manufacturing semiconductor device
A manufacturing method for a semiconductor device which is capable of manufacturing the semiconductor device with a high quality in high yields while reducing variations in electric characteristic...
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7129100 |
In-wafer testing of integrated optical components in photonic integrated circuits (PICs)
Disclosed is a method of in-wafer testing of integrated optical components and in-wafer chips with photonic integrated circuits (PICs).
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7127316 |
Method and system for estimating manufacturing target bias
A computer implemented method for estimating manufacturing target bias for products in manufacturing tools. The method first establishes a first data set according to manufacturing target bias...
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7125730 |
Power supply, a semiconductor making apparatus and a semiconductor wafer fabricating method using the same
In power supply and a semiconductor making apparatus and a semiconductor fabricating method using the same, an abnormality can be detected when an offset occurs in a part constituting a closed-loop...
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7122829 |
Probe look ahead: testing parts not currently under a probehead
A semiconductor substrate, probe card, and methods for stressing and testing dies on a semiconductor substrate are provided. The semiconductor substrate, typically a semiconductor wafer, comprises...
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7115210 |
Measurement to determine plasma leakage
Disclosed is a method and system for detecting abnormal plasma discharge that is useful in, for example, detecting plasma leakage in a reactive ion etching (RIE) chamber. The system includes...
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7115426 |
Method and apparatus for addressing thickness variations of a trench floor formed in a semiconductor substrate
A method for utilizing interference fringe patterns generated when milling a trench through a semiconductor substrate by a method such as FIB milling, to determine and optimize the thickness...
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7115211 |
Endpoint detection using laser interferometry
A method and system for determining an endpoint in a (near) real-time environment using statistical process control. By utilizing such control, an endpoint of a semiconductor process (e.g., an...
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7115425 |
Integrated circuit process monitoring and metrology system
A method for monitoring polishing process parameters for an integrated circuit structure on a substrate. A first metrology site is constructed on the substrate. The first metrology site represents...
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7114556 |
Burn-in oven heat exchanger having improved thermal conduction
A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a...
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7112304 |
Robust chemiresistor sensor
A chemiresistor sensor probe for detecting target analytes. The probe includes a body having a first control surface and a second control surface recessed within the first. A sensor film comprises...
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7112889 |
Semiconductor device having an alignment mark formed by the same material with a metal post
A semiconductor device has an alignment mark which can be recognized by a conventional wafer prober. A redistribution layer connects electrodes of the semiconductor device to electrode pads located...
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7109047 |
Method and device for analyzing circuits
A method of analyzing a circuit comprising a plurality of interconnects is disclosed herein. The method may comprise analyzing at least one electrical property associated with a first interconnect,...
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7105365 |
Method of manufacturing a semiconductor device
The present invention supplies a manufacturing method of a semiconductor device, which includes a non-contact inspection process capable of confirming if a circuit or circuit element formed on an...
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7106897 |
Universal spatial pattern recognition system
A method and apparatus for analyzing patterns in semiconductor wafers wherein the patterns are compared to a plurality of patterns stored in a common pattern library. A spatial pattern recognition...
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7105379 |
Implementation of protection layer for bond pad protection
A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond...
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7105366 |
Method for in-line testing of flip-chip semiconductor assemblies
Flip-chip semiconductor assemblies, each including integrated circuit (IC) dice and an associated substrate, are electrically tested before encapsulation using an in-line or in situ test socket or...
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7107115 |
Method for controlling semiconductor processing apparatus
Occurrence of a process abnormality in a semiconductor processing apparatus is obtained by obtaining an index of a processing size of each of wafers within an X-th lot, in which the X represents an...
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7101817 |
System and method for determining line widths of free-standing structures resulting from a semiconductor manufacturing process
A apparatus and method for determining minimum line widths of free standing structures built by a semiconductor (S/C) manufacturing process. Free standing structures are created in a semiconductor...
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7101721 |
Adaptive manufacturing for film bulk acoustic wave resonators
An adaptive manufacturing process for a Film Bulk Acoustic Resonator (FBAR) tests the FBAR circuit during manufacturing to determine a resonant frequency thereof. Reactive tuning elements may be...
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7098050 |
Corona based charge voltage measurement
A method of measuring electrical characteristics of a gate dielectric. The gate dielectric is local annealed by directing a highly localized energy source at the measurement area, such that the...
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7098049 |
Shallow trench isolation void detecting method and structure for the same
Disclosed is a method for detecting STI void of a semiconductor wafer. The method of the present invention comprises steps of assigning a detecting area in a predetermined region of the wafer;...
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7099733 |
Semiconductor production system
A semiconductor production system has storage devices for storage of all kinds of information including, but not limited to, the information concerning semiconductor design and information as to...
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7098048 |
Method and apparatus for capturing fault state data
A method includes receiving a fault notification message associated with a fault condition in a manufacturing system. Workpiece identification information is determined for at least one workpiece...
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7098047 |
Wafer reuse techniques
Briefly, test wafer reuse techniques.
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7096752 |
Environmental damage reduction
A substrate processor that processes and inspects a substrate. A substrate handler moves a substrate within the substrate processor. A processing chamber receives the substrate from the substrate...
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7094616 |
High resolution cross-sectioning of polysilicon features with a dual beam tool
A method for high resolution cross sectioning of polysilicon features with a dual electron (E) beam and focused ion beam. The method comprises consecutive steps of encapsulating the polysilicon...
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7094615 |
Method of controlling probe tip sanding in semiconductor device testing equipment
In a method of and apparatus for controlling probe tip sanding in semiconductor device testing equipment, resistance values of pads of a probed chip are measured and stored. If a maximum resistance...
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7095045 |
Semiconductor device and manufacturing method thereof
A semiconductor device includes a substrate, a pad electrode formed on the substrate and a bump electrode formed on the pad electrode, wherein the pad electrode has an irregular flaw, and there is...
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7094614 |
In-situ monitoring of chemical vapor deposition process by mass spectrometry
A method and apparatus are provided for controlling a CVD process used to deposit films on semiconductor substrates wherein the by-products of the reaction are measured and monitored during the...
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7091597 |
Power supply device
A power supply device includes a control IC fabricated by a bipolar process and a power supply element fabricated by a MOS process, both of them die-bonded on a leadframe, and with a chip edge of...
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7092077 |
System and method for monitoring contamination
The present invention provides passive sampling systems and methods for monitoring contaminants in a semiconductor processing system. In one embodiment, that passive sampling system comprises a...
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7091134 |
Deposition of integrated circuit fabrication materials using a print head
In one embodiment, an integrated circuit (IC) fabrication material is dispensed from a print head by dividing its nozzles into several groups, and sequentially allowing each group to fire. The...
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7087441 |
Method of making a circuitized substrate having a plurality of solder connection sites thereon
A method of making a circuitized substrate in which two solder deposits, either of the same or different metallurgies, are formed on at least two different metal or metal alloy conductors and PTHs....
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7081368 |
Method for detecting gas with the use of photocurrent amplification and the like and gas sensor
An indium electrode film ( 2 ) is formed closely adhering to one face of an organic semiconductor film ( 1 ) made of copper phthalocyanine while a gold electrode film ( 3 ) is formed on the other...
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7081758 |
Inspection pattern, inspection method, and inspection system for detection of latent defect of multi-layer wiring structure
An inspection pattern, an inspection method, and an inspection system for detection of a latent defect of a multi-layer wiring structure formed on the semiconductor wafer. The inspection pattern...
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7079433 |
Wafer level burn-in of SRAM
A wafer level burn-in method for static-random access memory. The SRAM memory has a plurality of word lines and a plurality of bit lines. The SRAM memory also has pull up circuits and equalizer...
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7078689 |
Integrated electron beam and contaminant removal system
One embodiment disclosed relates to an integrated electron beam inspection and contaminant removal tool. An electron beam column is configured to image an area on a substrate being inspected. A...
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7078247 |
Early detection of contact liner integrity by chemical reaction
The integrity of a liner in an interconnect structure or other layer in an integrate circuit is tested in a short time by exposing the liner to a reactive gas that attacks the underlying silicon or...
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