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7199042 |
Semiconductor device with multi-layered wiring arrangement including reinforcing patterns, and production method for manufacturing such semiconductor device
A semiconductor device includes a semiconductor substrate having electronic elements produced therein, and an insulating underlayer formed thereon, and a multi-layered wiring arrangement...
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7195932 |
Enhancement of grain structure for tungsten contracts
A method for enhancing grain structure of a contact material for a semiconductor device is provided. The method initiates with exposing the contact material of a contact at a first depth within the...
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7195934 |
Method and system for deposition tuning in an epitaxial film growth apparatus
A method of calculating a process parameter for a deposition of an epitaxial layer on a substrate. The method includes the steps of measuring an effect of the process parameter on a thickness of...
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7195933 |
Semiconductor device having a measuring pattern and a method of measuring the semiconductor device using the measuring pattern
A semiconductor device having a measuring pattern that enhances measuring reliability and a method of measuring the semiconductor device using the measuring pattern. The semiconductor device...
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7196531 |
Method of manufacturing a probe card
A method of designing and manufacturing a probe card assembly includes prefabricating one or more elements of the probe card assembly to one or more predefined designs. Thereafter, design data...
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7196006 |
Manufacturing method for microelectronic device
A method of manufacturing a microelectronic device, including performing a first inspection of a device feature during an intermediate stage of manufacture, cleaning the device feature after the...
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7195930 |
Cleaning method for use in an apparatus for manufacturing a semiconductor device
A cleaning method for use in an apparatus for manufacturing a semiconductor device includes: measuring components and concentration of each component of gas in a process chamber of an apparatus for...
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7196338 |
Ultra-thin sample preparation for transmission electron microscopy
In accordance with the invention, there is a method of fabricating a material for transmission electron microscopy comprising removing a first portion from a material having a thickness of (d 1 )...
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RE39534 |
Method and apparatus to calibrate a semi-empirical process simulator
A method and apparatus for calibrating a semi-empirical process simulator used to determine process values in a plasma process for creating a desired surface profile on a process substrate includes...
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7195931 |
Split manufacturing method for advanced semiconductor circuits
A front-end-of-line piece of a semiconductor die is manufactured in a first manufacturing line. A back-end-of-line piece of a semiconductor die is manufactured using a second manufacturing line,...
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7192791 |
Semiconductor wafer having an edge based identification feature
A semiconductor wafer comprises a wafer formed of a semiconductor material having a peripheral edge portion and a repeating mark on the edge portion of the wafer to allow identification of the...
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7191082 |
Method of inspecting substrate processing apparatus, and storage medium storing inspection program for executing the method
A method of inspecting a substrate processing apparatus that enables a reduction in operator labor time to be achieved. A host computer instructs a substrate processing apparatus to prohibit...
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7186576 |
Stacked die module and techniques for forming a stacked die module
Embodiments of the present technique relate to forming die stacks. Specifically, embodiments of the present technique include a method of forming and testing semiconductor die comprising forming a...
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7187994 |
Method of interfacing ancillary equipment to FIMS processing stations
This invention includes a method of integrating into a semiconductor specimen fabrication station a process diagnostic module that performs on the semiconductor specimen a processing operation that...
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7186280 |
Method of inspecting a leakage current characteristic of a dielectric layer and apparatus for performing the method
A method of inspecting a leakage current of a dielectric layer on a substrate including a cell array region having a plurality of cell blocks including a patterned structure, the dielectric layer...
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7186574 |
CMP process metrology test structures
A method for forming metrology structures for a CMP process is described. A trench edge is formed in a base material or stack of materials which are preferably deposited as part of the process of...
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7186650 |
Control of bottom dimension of tapered contact via variation(s) of etch process
Systems and methods are described for controlling critical dimension (CD) variation at the bottom of a tapered contact via on a semiconductor substrate. The invention monitors contact vias on a...
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7184932 |
Reliability prediction for complex components
A method for assessing a reliability of a complex component having a plurality of similar subcomponents is described. The complex component is divided into a plurality of component parts, each...
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7183123 |
Method of surface preparation and imaging for integrated circuits
The present invention is a method of surface preparation and imaging for integrated circuits. First, a substrate is selected and an opening is cut in the substrate of a sufficient size to fit an...
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7183122 |
Physical nano-machining with a scanning probe system for integrated circuit modification
Nano-machining for circuit edits through the front side or backside of an integrated circuit may be performed using a scanning probe system. The system may create access holes with smaller...
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7179661 |
Chemical mechanical polishing test structures and methods for inspecting the same
Disclosed is a semiconductor die having a plurality of dummy fillings positioned and sized to minimize defects during chemical mechanical polishing is disclosed. At least one of the dummy fillings...
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7179662 |
Semiconductor fuse covering
A method and system for sealing or covering exposed fuses on a semiconductor device are disclosed. A semiconductor device prober incorporating a spray device for applying a sealing compound to...
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7179663 |
CDA controller and method for stabilizing dome temperature
A domed plasma reactor chamber uses an antenna driven by RF energy which is inductively coupled inside the reactor dome. The antenna generates a high density, low energy plasma inside the chamber...
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7179664 |
Method for generating work-in-process schedules
A method and program is disclosed for generating work in progress (WIP) schedules in semiconductor manufacturing facility. After determining starting and ending dates of predetermined schedule...
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7179665 |
Optical method for determining the doping depth profile in silicon
A method of processing a sample, comprising the steps of: introducing dopant into a sample thereby producing a doped sample; producing a healed sampled including a doping density profile in...
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7176508 |
Temperature sensor for high power very large scale integration circuits
Disclosed is a temperature sensor for an integrated circuit having at least one field effect transistor (FET) having a polysilicon gate, in which a current and a voltage is supplied to the...
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7176486 |
Structure of test element group wiring and semiconductor substrate
A structure of test element group wiring includes, in addition to an electrode on a substrate including one or more layers of insulating films, and real wirings electrically connected to the...
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7176111 |
Method for depositing polycrystalline SiGe suitable for micromachining and devices obtained thereof
Method and apparatus to obtain as-deposited polycrystalline and low-stress SiGe layers. These layers may be used in Micro Electro-Mechanical Systems (MEMS) devices or micromachined structures....
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7176042 |
Laser beam irradiation method that includes determining a thickness of semiconductor prior to crystallizing
A laser beam irradiation method that achieves uniform crystallization, even if a film thickness of an a-Si film or the like fluctuates, is provided. The present invention provides a laser beam...
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7169626 |
Method for detecting alignment mark shielding
A method of testing a test wafer includes shielding test centers on a test wafer using shielding tabs during the deposition of a layer. The test wafer has the same size and shape of product wafers....
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7169627 |
Method for inspecting a connecting surface of a flip chip
The present invention provides a method for inspecting a connecting surface of a flip chip to solve problems that the grinding, polishing and chemical etching method is used for making a sample....
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7167806 |
Method and system for measuring temperature and power distribution of a device
A present invention provides real-time temperature and power mapping of fully operating electronic devices. The method utilizes infrared (IR) temperature imaging, while an IR-transparent coolant...
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7166838 |
X-ray imaging for patterned film measurement
An x-ray metrology system includes an e-beam generator to cause a test sample to emit x-rays, x-ray optics for focusing the x-rays, and an x-ray imager to generate an image of the test sample from...
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7163829 |
Method of integration testing for packaged electronic components
A method of integration testing for packaged electronic components is capable of improving a conventional testing for packaged electronic components. In this method, non-tested sides of the...
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7160478 |
Method for producing electronic componets
A method for producing an electronic component is provided. The method includes providing at least one die on a wafer, the at least one die having at least one sensor-technologically active and/or...
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7160741 |
Planar voltage contrast test structure and method
An integrated circuit and e-beam testing method are disclosed. The integrated circuit includes a test structure with a ground grid, a metal pad having a space therein and positioned within the...
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7161243 |
System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher IC power delivery
A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC...
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7160786 |
Silicon on insulator device and layout method of the same
A silicon on insulator (SOI) semiconductor device includes a wire connected to doped regions formed in an active layer of a SOI substrate. A ratio of the area of the wire to the doped region or a...
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7160740 |
Methods of controlling properties and characteristics of a gate insulation layer based upon electrical test data, and system for performing same
The present invention is generally directed to various methods of controlling properties and characteristics of a gate insulation layer based upon electrical test data, and a system for performing...
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7160739 |
Feedback control of a chemical mechanical polishing device providing manipulation of removal rate profiles
A method of controlling surface non-uniformity of a wafer in a polishing operation includes (a) providing a model for a wafer polishing that defines a plurality of regions on a wafer and identifies...
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7161689 |
Apparatus and method for processing a microelectronic workpiece using metrology
A processing apparatus for processing a microelectronic workpiece includes a metrology unit and a control, signal-connected to the metrology unit. The control can modify a process recipe or a...
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7157131 |
Prevention of counterfeit markings on semiconductor devices
A lidded semiconductor device has a first layer applied to the lid, which first layer is chosen of a material which fluoresces upon application of non-visible electromagnetic waves thereto, for...
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7157289 |
Method for homogenizing the thickness of a coating on a patterned layer
A method for homogenizing the thickness of a uniform layer deposited on a layer of a material etched according to functional patterns, consisting of filling the empty areas with dummy patterns; a...
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7155963 |
Cleaning evaluation method for a substrate
The present invention relates to a cleaning evaluation method for evaluating a surface cleanliness of a substrate which has been cleaned after being polished. This method includes preparing a dummy...
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7158896 |
Real time immersion medium control using scatterometry
Systems and/or methods are disclosed for measuring and/or controlling an amount of impurity that is dissolved within an immersion medium employed with immersion lithography. The impurity can be...
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7158170 |
Test system for camera modules
A test system and a related method to perform optical and electrical tests, to adjust the focus and to seal the lens of digital fixed-focus cameras have been achieved. Said test system is...
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7153711 |
Method for improving a drive current for semiconductor devices on a wafer-by-wafer basis
The present invention provides a method for manufacturing semiconductor devices, a method for manufacturing an integrated circuit, and a method for improving a drive current for semiconductor...
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7155300 |
Method for using data regarding manufacturing procedures integrated circuits (IC's) have undergone, such as repairs, to select procedures the IC's will undergo, such as additional repairs
An inventive method in an integrated circuit (IC) manufacturing process for using data regarding repair procedures conducted on IC's at probe to determine whether any further repairs will be...
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7151003 |
Semiconductor wafer test system
A semiconductor wafer test system for carrying out a burn-in test on a semiconductor wafer including multiple semiconductor devices thereon. A metal interconnect is connected to the gate electrode...
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7152011 |
Smart component-based management techniques in a substrate processing system
A method of component management in a substrate processing system is disclosed. The substrate processing system has a set of components, at least a plurality of components of the set of components...
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