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7374957 |
Method of calibrating or qualifying a lithographic apparatus or part thereof, and device manufacturing method
A system and method are provided for qualifying or calibrating lithographic apparatus or parts therefor, using a predetermined objective criterion such as Chauvenet's criterion is used to reject...
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7374956 |
Method for improved metrology by protecting photoresist profiles
A method for preserving semiconductor feature opening profiles for metrology examination including providing semiconductor wafer having a process surface comprising semiconductor feature openings;...
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7371590 |
Integrated inspection system and defect correction method
A system for the inspection of and a process for the correction of defects in a microreplicated optical display film manufacturing process. The process steps of manufacturing a master, a plurality...
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7368712 |
Y-shaped carbon nanotubes as AFM probe for analyzing substrates with angled topography
A Y-shaped carbon nanotube atomic force microscope probe tip and methods comprise a shaft portion; a pair of angled arms extending from a same end of the shaft portion, wherein the shaft portion...
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7370257 |
Test vehicle data analysis
A system and method for collecting and analyzing integrated circuit test vehicle test data by identifying various blocks of circuitry through at least two different intersecting test paths. In one...
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7368303 |
Method for temperature control in a rapid thermal processing system
A method is disclosed for a multi-zone interference correction processing for a rapid thermal processing (RTP) system. This processing allows for improved calibration/tuning of RTP systems by...
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7368302 |
Dynamic metal fill for correcting non-planar region
Methods and a system are disclosed for correcting a non-planar region during fabrication of a semiconductor product on a wafer. The invention separates an exposure of at least a portion of a fill...
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7369697 |
Process variable of interest monitoring and control
Methods for monitoring and controlling process variables of interest during the substrate manufacturing process is provided. Numerical estimates for selected attributes of a feature of interest may...
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7369947 |
Quantification of adsorbed molecular contaminant using thin film measurement
A test method for measuring adsorbed molecular contamination uses a test structure that includes a substrate comprising a plurality of separated test sites having a plurality separate thicknesses...
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7364095 |
Apparatus for judging target to be temperature-regulated
Between a characteristic a of a process chamber 21 a having a large pressure loss and a characteristic b of a process chamber 21 b having a small pressure loss, threshold value A (flow rate...
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7361920 |
Substrate processing apparatus and transfer positioning method thereof
A substrate processing apparatus has a transfer mechanism arranged on a transfer base and configured to transfer a processing substrate between predetermined transfer positions, a mapping sensor...
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7361913 |
Methods and apparatus for glitch recovery in stationary-beam ion implantation process using fast ion beam control
An ion implanter includes a source of a stationary, planar ion beam, a set of beamline components that steer the ion beam along a normal beam path as determined by first operating parameter values,...
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7363099 |
Integrated circuit metrology
Sites to be measured on a device that is to be fabricated using at least one fabrication process, are selected based on a pattern-dependent model of the process. A metrology tool to measure a...
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7355266 |
Semiconductor wafer test system
A semiconductor wafer test system for carrying out a burn-in test on a semiconductor wafer including multiple semiconductor devices thereon. A metal interconnect is connected to the gate electrode...
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7354524 |
Method and system for processing multi-layer films
A method of processing multi-layer films, the method including: (1) processing a plurality of layers according to selected parameters, (2) determining a plurality of optical characteristics each...
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7355176 |
Method of forming TEM specimen and related protection layer
A method of forming a protection layer on a specimen for TEM inspection and a method of forming a specimen for TEM inspection are provided. The method of forming a protection layer on a specimen...
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7351639 |
Increasing an electrical resistance of a resistor by oxidation or nitridization
A method and structure for increasing an electrical resistance of a resistor that is within a semiconductor structure, by oxidizing or nitridizing a fraction of a surface layer of the resistor with...
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7352001 |
Method of editing a semiconductor die
Resistance and capacitance are added to a prototype die to fix or identify performance issues with the integrated circuit formed in the die by forming a thin piece of silicon on the top surface of...
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7348187 |
Method, device, computer-readable storage medium and computer program element for the monitoring of a manufacturing process of a plurality of physical objects
In the case of the method, an analysis is performed by using values of at least one process parameter of the manufacturing process of the physical object and, as a result of the analysis, when they...
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7348594 |
Test structures and models for estimating the yield impact of dishing and/or voids
A test structure comprising a test pattern is formed on a substrate. The test pattern includes a first comb structure having a plurality of tines, and a second structure. The second structure may...
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7348109 |
Reticle, semiconductor die and method of manufacturing semiconductor device
The invention is directed to increasing the number of semiconductor dice obtained from one semiconductor wafer and enhancing the reliability and yield of the semiconductor dice when the...
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7348189 |
Field transistor monitoring pattern for shallow trench isolation defects in semiconductor device
A field transistor monitoring pattern has two active areas, i.e., a source region and a drain region, spaced apart from each other by an STI area intervening therebetween. The STI area is generally...
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7348597 |
Apparatus for performing high frequency electronic package testing
Various apparatus for performing high frequency electronic package testing are disclosed. A test fixture assembly includes an electronics package having an interface structure, a mock-up IC,...
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7348210 |
Post bump passivation for soft error protection
A structure and a method for forming the same. The method includes (a) providing a structure which includes (i) a dielectric layer, (ii) an electrically conducting bond pad on and in direct...
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7349752 |
Dynamically coupled metrology and lithography
Methods for determining tolerances are disclosed that can be used for determining whether a lot of semiconductor wafers needs to be reworked. Overlay tolerance, critical dimension tolerance and a...
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7348190 |
Method of detecting a defect in a semiconductor device
A method of detecting a defect in a semiconductor device may involve immersing a substrate into a chemical solution. The substrate may support a metal wiring and an insulation layer may cover the...
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7348186 |
Method for improving a semiconductor substrate having SiGe film and semiconductor device manufactured by using this method
A method of improving a semiconductor substrate including a SiGe film on a Si or SOI substrate is provided. The method includes determining a relationship between a film condition of the SiGe film...
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7348188 |
Method for analyzing metal element on surface of wafer
Various kinds of metal elements existing on the surface of a wafer are analyzed with higher sensitivity. A high concentration HF solution is dropped onto a surface of a wafer. By providing the...
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7349223 |
Enhanced compliant probe card systems having improved planarity
Several embodiments of enhanced integrated circuit probe card and package assemblies are disclosed, which extend the mechanical compliance of both MEMS and thin-film fabricated probes, such that...
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7344899 |
Die assembly and method for forming a die on a wafer
A method for forming a die on a wafer is provided. The method includes forming on a wafer a die having an active portion that includes integrated circuitry. The method further includes forming at...
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7345305 |
Control of liner thickness for improving thermal cycle reliability
A device, system and method for evaluating reliability of a semiconductor chip are disclosed. Strain is determined at a location of interest in a structure. Failures are evaluated in a plurality of...
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7341673 |
Methods and apparatus for in situ substrate temperature monitoring by electromagnetic radiation emission
A method in a plasma processing system of determining the temperature of a substrate. The method includes providing a substrate comprising a set of materials, wherein the substrate being configured...
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7341877 |
Calibration method in a chip mounting device
A method of accurately calibrating a movement control system of mark recognition means in a chip mounting device, comprising the steps of: recognizing a first recognition mark put on a head ( 2 )...
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7338817 |
Body bias compensation for aged transistors
Embodiments of the invention include on-chip transistor degradation detection and compensation. In one embodiment of the invention, an integrated circuit is provided including a circuit with a body...
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7340372 |
Apparatus and method for investigating parameters of layers deposited on semiconductor wafers
In order to determine the dielectric constant of a layer deposited on a semiconductor wafer ( 2 ), the density of the layer is obtained. To obtain that density, the wafer ( 2 ) without the layer is...
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7340320 |
Method of recipe control operation
An operation method of a recipe control process in which multiple processing targets are processed continuously in a processing apparatus using recipes that specify a set of control parameters...
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7338818 |
Systems and arrangements to assess thermal performance
Systems and arrangements to assess the thermal performance of a thermal solution based upon the ability of a device under test (DUT) to operate in accordance with electrical performance criteria...
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7337091 |
Method and apparatus for coordinating fault detection settings and process control changes
A system includes a process tool for processing a workpiece, a process controller, and a fault monitor. The process controller is configured to determine a control action for updating an operating...
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7335969 |
Method of monitoring introduction of interfacial species
A method for monitoring a nitridation process, including: (a) providing a semiconductor substrate; (b) forming a first dielectric layer on a top surface of the substrate; (c) introducing a quantity...
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7336086 |
Measurement of bias of a silicon area using bridging vertices on polysilicon shapes to create an electrical open/short contact structure
An apparatus and method are disclosed for measuring bias of polysilicon shapes relative to a silicon area wherein the presence of an electrical coupling is used to determine the presence of bias....
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7332361 |
Xerographic micro-assembler
Xerographic micro-assembler systems and methods are disclosed. The systems and methods involve manipulating charge-encoded micro-objects. The charge encoding identifies each micro-object and...
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7332360 |
Early detection of metal wiring reliability using a noise spectrum
The present invention generally provides an apparatus and a method for inspecting a substrate in a substrate processing system. In one aspect, a voltage or current source is used in conjunction...
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7332359 |
Semiconductor device inspection method
Techniques for inspecting semiconductor devices. An inspection condition using chip matrix data and chip size data is set. The intricate circuit patterns of at least one semiconductor device is...
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7329551 |
Manufacturing and testing of electrostatic discharge protection circuits
A semiconductor die has a bonding pad for a MOSFET such as a power MOSFET and a separate bonding pad for ESD protection circuitry. Connecting the bonding pads together makes the ESD protection...
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7329550 |
Method for analyzing the structure of deep trench capacitors and a preparation method thereof
A method for analyzing the structure of deep trench capacitors and a preparation method thereof are described. A protective layer is formed on a selected inspection area. Overlying circuit layers...
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7329549 |
Monitoring method of processing state and processing unit
The present invention is a monitoring method of monitoring a change of a processing state of an object to be processed when a predetermined process is conducted to the object to be processed by...
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7326581 |
System, method and apparatus for automatic control of an RF generator for maximum efficiency
A method of dynamically adjusting a RF generator to an instantaneous resonant frequency of a transducer includes providing an RF input signal from an oscillator to the RF generator and measuring a...
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7324866 |
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device is provided in which it is possible to perform process control taking account of wafer information and to deal with the process control in which a...
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7323116 |
Methods and apparatus for monitoring a process in a plasma processing system by measuring self-bias voltage
A method for in-situ monitoring a process in a plasma processing system having a plasma processing chamber is disclosed. The method includes positioning a substrate in the plasma processing...
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7323359 |
Mounting method for a semiconductor component
A mounting method for a semiconductor component. The method includes application of solder material to the semiconductor component, application of at least one contact/mounting element made of...
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