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8137995 |
Double-sided semiconductor device and method of forming top-side and bottom-side interconnect structures
A semiconductor device is made by forming a first active device on a first side of a semiconductor wafer. A first insulating layer is formed over the first side of the wafer. A first conductive...
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8012772 |
Substrate treating apparatus, substrate treating method, and method for manufacturing high-voltage device
A substrate treating apparatus, in which a voltage is applied to between a treatment electrode and a target substrate in such a state that the treatment electrode is opposed to the target substrate...
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8000928 |
Methods and apparatus for data analysis
A method and apparatus for data analysis according to various aspects of the present invention is configured to automatically select one or more outlier identification algorithms for identifying...
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7986146 |
Method and system for detecting existence of an undesirable particle during semiconductor fabrication
One exemplary embodiment is a method for detecting existence of an undesirable particle between a planar lithographic object, such as a semiconductor wafer or a lithographic mask, and a chuck...
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7985671 |
Structures and methods for improving solder bump connections in semiconductor devices
Structures with improved solder bump connections and methods of fabricating such structures are provided herein. The method includes forming an upper wiring layer in a dielectric layer and...
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7981700 |
Semiconductor oxidation apparatus and method of producing semiconductor element
A semiconductor oxidation apparatus is provided with a sealable oxidation chamber defined by walls, a base provided within the oxidation chamber and configured to support a semiconductor sample, a...
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7946499 |
Method for initializing and/or personalizng a portable data carrier
A method for either or both initializing and personalizing a portable data carrier having an electronic circuit, a data transmission device and a switching device. The method is characterized in...
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7935549 |
Seminconductor device
The present invention provides a signal transmitting/receiving method comprising: disposing a ferromagnetic film between a semiconductor device having an inductor and an external device which...
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7927892 |
Thermal treatment apparatus, thermal treatment method and method of manufacturing semiconductor device
A thermal treatment apparatus having a first light source emitting a first light having light diffusion property, a reflectance measuring unit irradiating a treatment target with the light from...
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7910395 |
LED structure
An LED structure includes a first substrate; an adhering layer formed on the first substrate; first ohmic contact layers formed on the adhering layer; epi-layers formed on the first ohmic contact...
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7897416 |
Composition control for photovoltaic thin film manufacturing
The present invention relates to methods and apparatus for providing composition control to thin compound semiconductor films for radiation detector and photovoltaic applications. In one aspect of...
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7888142 |
Copper contamination detection method and system for monitoring copper contamination
A method of monitoring copper contamination. The method includes method, comprising: (a) ion-implanting an N-type dopant into a region of single-crystal silicon substrate, the region abutting a top...
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7871843 |
Method of preparing light emitting device
The object of this invention is to provide a high-output type nitride light emitting device. The nitride light emitting device comprises an n-type nitride semiconductor layer, a p-type nitride...
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7871829 |
Metal wiring of semiconductor device and method of fabricating the same
A metal wiring forming method in a semiconductor device can include forming an interlayer insulating film on a lower metal wiring, the first interlayer insulating film having a non-planar upper...
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7844857 |
Writing data processing control apparatus, writing method, and writing apparatus
A writing data processing control apparatus includes an assignment part configured to assign processing of a plurality of pieces of writing data of predetermined divided writing regions, stored in...
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7749778 |
Addressable hierarchical metal wire test methodology
A method of monitoring and testing electro-migration and time dependent dielectric breakdown includes forming an addressable wiring test array, which includes a plurality or horizontally disposed...
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7736915 |
Method for neutralizing trapped charge in a charge accumulation layer of a semiconductor structure
A method for neutralizing trapped charges in a buried oxide layer. The method includes providing a semiconductor structure which includes (a) a semiconductor layer, (b) a charge accumulation layer...
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7687298 |
Microelectromechanical device with integrated conductive shield
A microelectromechanical device and method of fabricating the same, including a layer of patterned and deposited metal or mechanical-quality, doped polysilicon inserted between the appropriate...
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7662672 |
Manufacturing process of leadframe-based BGA packages
A manufacturing process of a leadframe-based BGA package is disclosed. A leadless leadframe with an upper layer and a lower layer is provided for the package. The upper layer includes a plurality...
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7625495 |
Methods and apparatuses for monitoring and controlling mechanical or chemical-mechanical planarization of microelectronic substrate assemblies
Methods and devices for mechanical and/or chemical-mechanical planarization of semiconductor wafers, field emission displays and other microelectronic substrate assemblies. One method of...
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7605014 |
Method of fabricating resistive probe having self-aligned metal shield
A method of fabricating a resistive probe having a self-aligned metal shield. The method includes sequentially forming a first insulating layer, a metal shield, and a second insulating layer on a...
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7598161 |
Method of forming transistor devices with different threshold voltages using halo implant shadowing
The halo implant technique described herein employs a halo implant mask that creates a halo implant shadowing effect during halo dopant bombardment. A first transistor device structure and a second...
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7595257 |
Process of forming an electronic device including a barrier layer
An electronic device can include a substrate (12) having a primary surface (14), a second surface (16, 22) opposite the primary surface (14), and an electrode (50). In one embodiment, the electrode...
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7521338 |
Method for sawing semiconductor wafer
Semiconductor wafer sawing systems and methods are described in which a wafer may be secured in a sawing position having a surface exposed to incur sawing with at least a portion of the exposed...
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7465977 |
Method for producing a packaged integrated circuit
There is described a method for producing a packaged integrated circuit. The method comprises a first step of building an integrated circuit having a micro-structure suspended above a micro-cavity,...
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7456092 |
Self-releasing spring structures and methods
According to various exemplary embodiments, a spring device that includes a substrate, a self-releasing layer provided over the substrate and a stressed-metal layer provided over the self-releasing...
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7407861 |
Method and system for high-speed, precise micromachining an array of devices
A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The...
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7393701 |
Method of adjusting buried resistor resistance
Methods of adjusting a resistance of a buried resistor in a semiconductor are disclosed. In one aspect, the method includes using a silicidation blocking mask to define the buried resistor in the...
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7258838 |
Solid state molecular probe device
A solid state nanopore device including two or more materials and a method for fabricating the same. The device includes a solid state insulating membrane having an exposed surface, a conductive...
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7223615 |
High emissivity capacitor structure
The present invention is directed to controlling wafer temperature during rapid thermal processing. Regions and devices in an integrated circuit may be surrounded, inlayed, and overlaid with high...
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7192846 |
Methods and systems for processing a device, methods and systems for modeling same and the device
A method and system for locally processing a predetermined microstructure formed on a substrate without causing undesirable changes in electrical or physical characteristics of the substrate or...
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7125729 |
Method for opening the plastic housing of an electronic module
In a method of opening of a housing of a plastic-housed electronic module by a laser, the electronic module is protected from the effects of the laser beam and the laser beam is stopped at a...
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7105877 |
Conductive line structure
A conductive line Structure. In one embodiment of the invention, a conductive line includes at least two outer conductive portions, an inner conductive portion between the outer conductive...
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7070476 |
In-situ metalization monitoring using eddy current measurements during the process for removing the film
A method for measuring conductance of a sample using an eddy current probe with a sensing coil. The method includes N repetitions of measuring first and second voltage pairs including in-phase and...
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7043830 |
Method of forming conductive bumps
A sealing layer is provided on the surface of a substrate such as a semiconductor wafer. The sealing layer includes apertures which expose external contact locations for semiconductor dice formed...
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7029927 |
Method of repairing an integrated electronic circuit using a formed electrical isolation
A method of repairing a defect in an integrated electronic circuit caused by an incorrect lithographic mask includes the formation of an electrical isolation between two conducting parts of the...
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6991944 |
Surface treatment for multi-layer wafers formed from layers of materials chosen from among semiconducting materials
This invention relates to a process for treatment of a multi-layer wafer with materials having differential thermal characteristics, the process comprising a high temperature heat treatment step...
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6987053 |
Method of evaluating reticle pattern overlay registration
A method for evaluating reticle registration between two reticle patterns. A wafer is defined and etched to form a first exposure pattern, by photolithography with a first reticle having a first...
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6954711 |
Test substrate reclamation method and apparatus
Test substrates used to test semiconductor fabrication tools are reclaimed by reading from a database the process steps performed on each test substrate and selecting a reclamation process from a...
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6900459 |
Apparatus for automatically positioning electronic dice within component packages
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the...
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6881592 |
Method and device for minimizing multi-layer microscopic and macroscopic alignment errors
A method of aligning a second layer to a first layer of a semiconductor structure by forming a first layer of a wafer having a distinguished feature via a first etching process that employs a first...
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6709980 |
Using stabilizers in electroless solutions to inhibit plating of fuses
The present invention relates to a method of forming a metal feature on an intermediate structure of a semiconductor device that comprises a first exposed metal structure and a second exposed metal...
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6703251 |
Semiconductor wafer
A plurality of IC chips each having an internal circuit are mounted on a wafer substrate. A plurality of scribe lines are formed on the wafer substrate for separating the IC chips from one another....
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6660538 |
Non-contacting deposition control of chalcopyrite thin films
Chalcopyrite semiconductors, such as thin films of copper-indium-diselenide (CuInSe2), copper-gallium-diselenide (CuGaSe2), and Cu(Inx,Ga1-x)Se2, all of which are sometimes generically referred to...
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6553332 |
Method for evaluating process chambers used for semiconductor manufacturing
A process chamber (12) is used for plasma etching of a wafer (21) disposed therein. A gas mixture supplied to the chamber eventually passes through openings (28) in a baffle plate (27). After the...
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6492187 |
Method for automatically positioning electronic die within component packages
A method and apparatus of assembling and disassembling semiconductor dice to be tested from the components of a temporary test package. A computer-controlled vision system is employed to align the...
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6365421 |
Method and apparatus for storage of test results within an integrated circuit
An integrated circuit memory device has a plurality of nonvolatile programmable elements which are used to store a pass/fail status bit at selected milestones in a test sequence. At selected points...
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6319420 |
Method and apparatus for electrically endpointing a chemical-mechanical planarization process
A method and apparatus for endpointing a planarization process of a microelectronic substrate. The apparatus can include a source of electrical power having first and second electrical contacts...
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6303396 |
Substrate removal as a function of resistance at the back side of a semiconductor device
A resistance monitoring approach is used for removing substrate from a back side of a semiconductor device. According to an example embodiment of the present invention, substrate is removed from a...
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6294395 |
Back side reactive ion etch
Current reactive ion etching (RIE) techniques are not applicable to back side etching of semiconductor devices. According to an example embodiment, the present invention is directed to a method for...
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