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7618850 |
Method of making a diode read/write memory cell in a programmed state
A method of making a nonvolatile memory device includes fabricating a diode in a low resistivity, programmed state without an electrical programming step. The memory device includes at least one...
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7608910 |
Semiconductor ESD device and methods of protecting a semiconductor device
A semiconductor device and methods for protecting a semiconductor device. In an example, the semiconductor device may include a semiconductor substrate including at least one electrostatic...
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7608488 |
Semiconductor memory device and method of manufacturing the same
A manufacturing method of a semiconductor memory device for manufacturing a first semiconductor device and a second semiconductor device wherein a cell array ratio is smaller than that of the first...
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7606056 |
Process for manufacturing a phase change memory array in Cu-damascene technology and phase change memory array thereby manufactured
A process for manufacturing a phase change memory array includes the steps of: forming a plurality of phase change memory cells in an array region of a semiconductor wafer, the phase change memory...
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7605079 |
Manufacturing method for phase change RAM with electrode layer process
A method for manufacturing a phase change memory device comprises forming an electrode layer. Electrodes are made in the electrode layer using conductor fill techniques that are also used...
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7598100 |
Manufacturing method of semiconductor integrated circuit device
As the thickness of the card holder for preventing warping of a multilayered wiring substrate 1 is increased, there occurs a problem that a thin film sheet 2 is buried in a card holder and...
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7585703 |
Pixel control element selection transfer method, pixel control device mounting device used for pixel control element selection transfer method, wiring formation method after pixel control element transfer, and planar display substrate
There is provided a method for selectively transferring pixel control devices onto a planar display substrate, which method enables prepared pixel control devices to be easily, reliably and...
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7582494 |
Device structures for reducing device mismatch due to shallow trench isolation induced oxides stresses
A circuit and method are disclosed for reducing device mismatch due to trench isolation related stress. One or more extended active regions are formed on the substrate, wherein the active regions...
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7579269 |
Microelectronic spring contact elements
Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic...
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7579210 |
Planar segmented contact
An electronic device including a planar segmented contact. A method for forming the device includes depositing a first insulator on a substrate, forming an opening in the first insulator, disposing...
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7566923 |
Isolated power domain core regions in platform ASICs
A platform application specific integrated circuit (ASIC) including a base layer. The base layer generally comprises a predefined input/output (I/O) region and a predefined core region. The...
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7563640 |
Semiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereof
A first semiconductor element is mounted on a base plate, and is in a sealed state by the periphery thereof being covered by an insulation member, and the upper surface thereof being covered by an...
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7556988 |
Thin film transistor substrate of horizontal electric field type liquid crystal display device and fabricating method thereof
A thin film transistor substrate of horizontal electric field type includes: a gate line and a first common line formed on a substrate to be in parallel to each other; a data line crossing the gate...
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7553708 |
Fabricating method for a liquid crystal display of horizontal electric field applying type
A liquid crystal display having an applied horizontal electric field comprising: a gate line; a common line substantially parallel to the gate line; a data line arranged to cross the gate line and...
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7550323 |
Electrical fuse with a thinned fuselink middle portion
A metal layer is deposited on the patterned semiconductor material layer containing a cathode semiconductor portion, a fuselink semiconductor portion, and an anode semiconductor portion. The metal...
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7547584 |
Method of reducing charging damage to integrated circuits during semiconductor manufacturing
An integrated circuit die includes thereon a first device region, a second device region and a non-active region. A first implant mask, which covers the second device region and the non-active...
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7541223 |
Array substrate and liquid crystal display apparatus having the same
In an array substrate and an LCD apparatus having the same, the array substrate includes a signal line, a first insulating layer formed on the signal line, and a pixel electrode formed on the first...
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7541213 |
Semiconductor device and manufacturing method thereof
The semiconductor device includes a thin film transistor; a first interlayer insulating film over the thin film transistor; a first electrode electrically connected to one of a source region and a...
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7540970 |
Methods of fabricating a semiconductor device
Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between...
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7535035 |
Cross-point nonvolatile memory devices using binary metal oxide layer as data storage material layer and methods of fabricating the same
A cross-point nonvolatile memory device using a binary metal oxide layer as a data storage material layer includes spaced apart doped lines disposed in a substrate. Spaced apart upper electrodes...
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7531852 |
Electronic unit with a substrate where an electronic circuit is fabricated
In an electronic unit with a substrate, a control circuit is mounted on the substrate and is configured to execute an operation related to a load. A package encapsulates the control circuit and the...
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7531391 |
CMOS image sensor and method for manufacturing the same
A CMOS image sensor includes a semiconductor substrate with a first conductive type including a photodiode region and a transistor region, a gate electrode formed on the transistor region of the...
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7531388 |
Electrically programmable fuse structures with narrowed width regions configured to enhance current crowding and methods of fabricating thereof
Electrically programmable fuse structures and methods of fabrication thereof are presented, wherein a fuse includes first and second terminal portions interconnected by an elongate fuse element....
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7524694 |
Funneled light pipe for pixel sensors
A photo sensing structure and methods for forming the same. The structure includes (a) a semiconductor substrate and (b) a photo collection region on the semiconductor substrate. The structure also...
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7521736 |
Electromechanical three-trace junction devices
Three-trace electromechanical devices and methods of using same are described. The device of the present invention includes first and second electrically conductive elements with a nanotube ribbon...
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7521298 |
Thin film transistor array panel of active liquid crystal display and fabrication method thereof
A thin film transistor (TFT) array panel structure and a fabrication method thereof are provided. The method includes the following steps. An insulating substrate is provided, on which a first...
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7517736 |
Structure and method of chemically formed anchored metallic vias
Methods are provided that enable the ability to use a less aggressive liner processes, while producing structures known to give a desired high stress migration and electro-migration reliability....
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7517735 |
Method of manufacturing active matrix substrate, active matrix substrate, electro-optical device, and electronic apparatus
A method of manufacturing an active matrix substrate includes forming wiring lines each having a matrix pattern on a substrate such that a wiring line extending in any one of a first direction and...
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7501316 |
Asymmetric memory cell
Some embodiments provide a memory cell that includes a body region, a source region and a drain region. The body region is doped with charge carriers of a first type, the source region is disposed...
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7501315 |
Methods and devices for forming nanostructure monolayers and devices including such monolayers
Methods for forming or patterning nanostructure arrays are provided. The methods involve formation of arrays on coatings comprising nanostructure association groups, patterning using resist, and/or...
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7498674 |
Semiconductor module having a coupling substrate, and methods for its production
A semiconductor module has a coupling substrate which is used for the internal electrical coupling of an integrated circuit on adjacent semiconductor chips. The semiconductor chips have integrated...
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7498206 |
Order receiving process for manufacturing a semiconductor display device
Irrespective of a specification of the controller, a plurality of TFTs are formed for the controller on a substrate in advance. Then, in accordance with a design of the controller, connection is...
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7491584 |
ESD protection device in high voltage and manufacturing method for the same
Electrostatic discharge (ESD) protection device in high voltage and the relevant manufacturing method is disclosed. The mentioned ESD protection device is disposed to bridge a ground and an input...
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7491576 |
Yield-enhancing methods of providing a family of scaled integrated circuits
An integrated circuit die (e.g., a programmable logic device (PLD) die) is manufactured that has the capability of being configured as at least two differently-sized family members. The IC die is...
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7489072 |
Organic electroluminescence display device and method for fabricating the same
An organic electroluminescence display device and a method for fabricating the same is described. The organic electroluminescence display device comprises pixels defined by a gate line and a data...
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7470572 |
Thin film transistor liquid crystal display and manufacturing method thereof
A manufacturing method and the structure of a thin film transistor liquid crystal display (TFT-LCD) are disclosed. The TFT-LCD uses metal electrodes as a mask to thoroughly remove the unwanted...
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7449371 |
VIA configurable architecture for customization of analog circuitry in a semiconductor device
A semiconductor device having a plurality of layers and a plurality of circuit elements arranged in tiles. At least one of the plurality of layers in the semiconductor device may be a via layer...
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7449354 |
Trench-gated FET for power device with active gate trenches and gate runner trench utilizing one-mask etch
A trench-gated field effect transistor (FET) is formed as follows. Using one mask, a plurality of active gate trenches and at least one gate runner trench are defined and simultaneously formed in a...
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7427537 |
Semiconductor integrated circuit device and method for manufacturing the same
In a semiconductor integrated circuit device having a system-on-chip structure in which a DRAM and a logic integrated circuit are mixedly mounted on a chip, a silicide layer is formed on the...
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7427536 |
High density stepped, non-planar nitride read only memory
A non-planar, stepped NROM array is comprised of cells formed in trenches and on pillars that are etched into a substrate. Each cell has a plurality of charge storage regions in its nitride layer...
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7422945 |
Cell based integrated circuit and unit cell architecture therefor
In a unit cell, a first conductive type active region and a second conductive type active region are provided. Those two active regions extend in a first direction. Each of the active regions have...
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7422932 |
Nonvolatile semiconductor memory device
A nonvolatile semiconductor memory device includes a semiconductor substrate, a memory cell region which is disposed on the semiconductor substrate and has a transistor array of a stacked gate...
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7420211 |
Wiring line and manufacture process thereof, and semiconductor device and manufacturing process thereof
To provide a technique for manufacturing a wiring line having a low resistance and a high heat resistance so as to make an active matrix type display device larger and finer. The wiring line is...
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7419856 |
Methods of fabricating integrated circuit devices having fuse structures including buffer layers
An integrated circuit device is provided including an integrated circuit substrate having a fuse region. A window layer is provided on the integrated circuit substrate that defines a fuse region....
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7418692 |
Method for designing structured ASICS in silicon processes with three unique masking steps
A multi-function core base cell includes a set of functional microcircuits. These microcircuits are used to design a Library of Logic Function Macros. The functional macros consisting of one or...
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7411228 |
Integrated circuit chip and manufacturing process thereof
An integrated circuit chip includes a substrate, a device layer, an interconnection layer, a sealing base layer and a sealing ring stack layer. The substrate has a sealing region and a chip region....
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7407819 |
Polymer memory having a ferroelectric polymer memory material with cell sizes that are asymmetric
A polymer memory and its method of manufacture are provided. One multi-layer construction of the polymer memory has two sets of word lines and a set of bit lines between the word lines. The word...
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7402770 |
Nano structure electrode design
A microelectronic switch having a substrate layer, an electrically conductive switching layer formed on the substrate layer, an electrically conductive cavity layer formed on the switching layer,...
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7402474 |
Manufacturing method of semiconductor device
A method of manufacturing a semiconductor device comprises the following steps: a step of depositing a silicon oxide film on the top surface of an epitaxial layer of the region where a high...
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7398280 |
Method and system for manufacturing integrated circuits meeting special customer requirements with multiple subcontractors in remote locations
Disclosed are a method and system for manufacturing integrated circuits meeting special customer requirements with multiple subcontractors in remote locations. The disclosed manufacturing...
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