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7629695 |
Stacked electronic component and manufacturing method thereof
A stacked electronic component comprises a first electronic component adhered on a substrate via a first adhesive layer, and a second electronic component adhered by using a second adhesive layer...
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7629672 |
Semiconductor devices and manufacturing method thereof
A semiconductor device is provided with a semiconductor substrate having circuit elements formed therein, and an insulating protective film formed on the semiconductor substrate. Hydroxyl groups...
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7622324 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
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7622311 |
Inspection of underfill in integrated circuit package
In inspecting for quality of underfill material dispensed in an IC package, a camera image is captured for the IC package having the underfill material dispensed between an IC die and a package...
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7622325 |
Integrated circuit package system including high-density small footprint system-in-package
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
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7619312 |
Method and apparatus for precisely aligning integrated circuit chips
A system that facilitates precise inter-chip alignment. The system includes a first integrated circuit chip, whose surface has etch pit wells. The system also includes a second integrated circuit...
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7617600 |
Process of making an electronic circuit device having flexibility and a reduced footprint
An electronic circuit formed by removing only a baseboard from an electronic module. The electronic circuit may be formed by providing a baseboard made of a water-soluble material, applying a...
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7618849 |
Integrated circuit package with etched leadframe for package-on-package interconnects
Methods, systems, and apparatuses for integrated circuit packages, and for package stacking, are provided. An electrically conductive frame is attached to a first surface of a substrate. The...
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7618842 |
Method of applying encapsulant to wire bonds
A method of applying encapsulant to wire bonds between a die and conductors on a supporting substrate, by forming a bead of the encapsulant on a profiling surface, positioning the profiling surface...
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7615395 |
Method for containing a device and a corresponding device
A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element...
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7615412 |
System in package (SIP) integrated circuit and packaging method thereof
The present invention discloses a system in package (SIP) integrated circuit and a packaging method thereof. The SIP integrated circuit includes one or more first block dices produced by a first...
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7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from...
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7615409 |
Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages
An electronic component is disclosed including a plurality of stacked semiconductor packages. A first such embodiment includes an internal connector for electrically coupling the stacked...
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7614888 |
Flip chip package process
A flip chip package process is provided. First, a substrate strip including at least one substrate is provided. Next, at least one chip is disposed on the substrate, and the chip is electrically...
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7615408 |
Method of manufacturing semiconductor device
An internal connecting terminal 12 is formed on electrode pads 23 of a plurality of semiconductor chips 11 formed on a semiconductor substrate 35 , and there is formed a resin member 13 ...
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7615416 |
Secure package with anti-tamper peripheral guard ring
A ball grid array (BGA) package (such as one BGA package of a package-on-package (POP) secure module assembly) includes a substrate, and integrated circuit, and array of bond balls. The BGA package...
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7608487 |
B-stageable underfill encapsulant and method for its application
A curable underfill encapsulant composition that is applied directly onto semiconductor wafers before the wafers are diced into individual chips. The composition comprises a thermally curable resin...
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7605018 |
Method for forming a die-attach layer during semiconductor packaging processes
Disclosed is a method for forming a die-attach layer during semiconductor packaging processes. A chip carrier includes a substrate core and a stiffener. Top surface of the substrate core includes a...
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7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
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7598881 |
Sensor and circuit configuration for occupant detection
In occupant detection systems, direct connections, such as fixed or permanent connections, are provided between the antenna and measurement circuit and between the measurement circuit and wiring...
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7598122 |
Die attach method and microarray leadframe structure
In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray...
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7598126 |
Use of nanoscale particles for creating scratch-resistant protective layers on semiconductor chips
Inorganic-based nanoparticles, such as nanoparticles based on silicon dioxide, are used in order to produce protective layers for semiconductor chips having scratch-resistant properties. The...
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7595209 |
Low stress thin film microshells
Multi-layered, planar microshells having low stress for encapsulation of devices such as MEMS and microelectronics. The microshells may include a perforated pre-sealing layer, below which a...
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7592205 |
Over-passivation process of forming polymer layer over IC chip
A method for forming a semiconductor chip or wafer includes following steps. A semiconductor substrate is provided, and then a polymer layer is deposited over the semiconductor substrate, wherein...
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7592204 |
Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical...
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7591863 |
Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip
The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film...
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7588968 |
Linked chip attach and underfill
A method for attaching an integrated circuit chip to a package substrate includes placing the integrated circuit onto the package substrate, and performing reflow to attach the integrated circuit...
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7588967 |
Curable silicone rubber composition and semiconductor device
A curable silicone rubber composition comprising (A) a vinyl-containing organopolysiloxane, (B) an organohydrogenpolysiloxane, (C) an aluminum chelate catalyst, (D) a platinum catalyst, and (E) a...
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7582510 |
Electronic packaging materials for use with low-k dielectric-containing semiconductor devices
Electronic packaging materials for use with Low-k dielectric-containing semiconductor devices are provided.
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7582514 |
Microelectromechanical systems encapsulation process with anti-stiction coating
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device...
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7579215 |
Method for fabricating a low cost integrated circuit (IC) package
A method for fabricating a low cost integrated circuit package ( 600 ) includes separating a processed silicon wafer into a plurality of individual die ( 601 ) and then positioning the die ( 603 )...
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7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7579213 |
Modified chip attach process
A process for assembling a package for a semiconductor device is described. The process includes reducing the stress in an inner dielectric layer during packaging by heating the die and the...
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7579219 |
Semiconductor device with a protected active die region and method therefor
A semiconductor device includes a semiconductor die having a plurality of contact pad sites, a plurality of contact pads, an encapsulant barrier, and an encapsulant. A plurality of contact pads is...
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7572679 |
Heat extraction from packaged semiconductor chips, scalable with chip area
A semiconductor device ( 100 A) with plastic encapsulation compound ( 102 ) and metal sheets ( 103 a and 104 ) on both surfaces, acting as heat spreaders. One or more thermal conductors ( 103 a )...
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7572680 |
Packaged integrated circuit with enhanced thermal dissipation
A semiconductor package ( 10 ) uses a plurality of thermal conductors ( 56 - 64 ) that extend upward within an encapsulant ( 16 ) from one or more thermal bond pads ( 22, 24, 26 ) on a die ( 14 )...
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7572681 |
Embedded electronic component package
A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in...
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7569427 |
Semiconductor component with connecting elements and method for producing the same
A semiconductor component with connecting elements between a semiconductor chip made from a semiconductor wafer with discrete semiconductor components and a superordinate circuit carrier is...
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7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material,...
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7563649 |
Chip packaging with metal frame pin grid array
A packaging technology for silicon chips is similar to ball grid array packaging technology of the prior art without, however, the use of printed board substrate of the prior art Instead pins are...
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7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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7560309 |
Drop-in heat sink and exposed die-back for molded flip die package
A system and method for modifying a molded flip die (MFD) integrated circuit package that includes an integrated circuit die to include a heat sink such that the heat sink is thermally coupled to...
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7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle
An integrated circuit package system is provided including forming a D-ring comprising half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring....
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7556984 |
Package structure of chip and the package method thereof
For a package structure of chip and the formation thereof, adhesive, conductive and metal layers are positioned on a substrate. The portions of the conductive and metal layers are removed to form...
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7554182 |
Semiconductor device and package, and method of manufacturer therefor
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7550315 |
Method for fabricating semiconductor package with multi-layer die contact and external contact
A semiconductor package includes a substrate formed of a board material, a semiconductor die bonded to the substrate, and an encapsulant on the die. The package also includes an array of external...
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7550320 |
Method of fabricating substrate with embedded component therein
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit...
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7544727 |
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate
An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor...
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7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A...
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