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7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from...
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7611926 |
Thermosetting die bonding film
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a...
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7608486 |
Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier
The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts...
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7605021 |
Manufacturing method of electronic device
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
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7605018 |
Method for forming a die-attach layer during semiconductor packaging processes
Disclosed is a method for forming a die-attach layer during semiconductor packaging processes. A chip carrier includes a substrate core and a stiffener. Top surface of the substrate core includes a...
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7601563 |
Small form factor molded memory card and a method thereof
A shape-molding structure of a memory card comprises a circuit substrate, at least one chip, and an encapsulant covering. The upper and lower surfaces of the circuit substrate have a circuit layer...
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7592694 |
Chip package and method of manufacturing the same
A chip package including a metal layer, a film-like circuit layer, a chip, a lead matrix and an encapsulant is provided. The film-like circuit layer disposed on the metal layer includes an...
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7579219 |
Semiconductor device with a protected active die region and method therefor
A semiconductor device includes a semiconductor die having a plurality of contact pad sites, a plurality of contact pads, an encapsulant barrier, and an encapsulant. A plurality of contact pads is...
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7579215 |
Method for fabricating a low cost integrated circuit (IC) package
A method for fabricating a low cost integrated circuit package ( 600 ) includes separating a processed silicon wafer into a plurality of individual die ( 601 ) and then positioning the die ( 603 )...
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7572680 |
Packaged integrated circuit with enhanced thermal dissipation
A semiconductor package ( 10 ) uses a plurality of thermal conductors ( 56 - 64 ) that extend upward within an encapsulant ( 16 ) from one or more thermal bond pads ( 22, 24, 26 ) on a die ( 14 )...
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7569427 |
Semiconductor component with connecting elements and method for producing the same
A semiconductor component with connecting elements between a semiconductor chip made from a semiconductor wafer with discrete semiconductor components and a superordinate circuit carrier is...
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7569419 |
Method for manufacturing semiconductor device that includes mounting chip on board and sealing with two resins
The present invention provides a method for manufacturing a semiconductor device, which is capable of suppressing an overflow of a sealing resin and obtaining good sealing quality, simply and at...
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7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to...
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7563652 |
Method for encapsulating sensor chips
A method for encapsulating sensor chips is disclosed. A protective layer is formed on an active surface of a sensor chip, and at least covers a sensor region in the active surface. The active...
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7563649 |
Chip packaging with metal frame pin grid array
A packaging technology for silicon chips is similar to ball grid array packaging technology of the prior art without, however, the use of printed board substrate of the prior art Instead pins are...
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7556984 |
Package structure of chip and the package method thereof
For a package structure of chip and the formation thereof, adhesive, conductive and metal layers are positioned on a substrate. The portions of the conductive and metal layers are removed to form...
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7554182 |
Semiconductor device and package, and method of manufacturer therefor
A semiconductor package encapsulating a semiconductor chip provides inner leads and outer leads for establishing electrical connections with the substrate. Herein, a lead frame is set into the...
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7553710 |
Composition for stripping photoresist and method for manufacturing thin transistor array panel using the same
The present invention provides a photoresist stripper including about 5 wt % to about 20 wt % alcohol amine, about 40 wt % to about 70 wt % glycol ether, about 20 wt % to about 40 wt % N-methyl...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7553697 |
Multiple chip semiconductor package
A semiconductor device package and method of fabricating the same are disclosed. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip...
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7550859 |
System and method for hermetically sealing a package
A method for hermetically sealing a package includes applying a light or energy active resist to a fill port to act as a temporary hermetic seal, patterning the resist, and applying a solder to the...
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7550322 |
Manufacturing method for resin sealed semiconductor device
A semiconductor device manufacturing method comprises etching a front side of a conductive board to form plural sets of a die pad portion and bonding areas, each set corresponding to one...
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7550320 |
Method of fabricating substrate with embedded component therein
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit...
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7547580 |
Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is...
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7547564 |
Method of manufacturing device having flexible substrate and device having flexible substrate manufactured using the same
The present invention relates to a method of manufacturing a device having a flexible substrate and a device having a flexible substrate manufactured using the method. According to the method of...
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7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A...
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7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same
A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed...
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7537966 |
Method for fabricating board on chip (BOC) semiconductor package with circuit side polymer layer
A method for fabricating a BOC package includes the steps of providing a semiconductor die having planarized bumps encapsulated in a polymer layer, and providing a substrate having a plurality of...
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7534662 |
Methods for hermetic sealing of post media-filled MEMS package
This invention provides a system and method for hermetically sealing a post media-filled package with a metal cap. The method can include the operation of filling a MEMS package through a fill port...
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7528077 |
Semiconductor device and method for manufacturing the same
The present invention provides a semiconductor device having a coating film of a predetermined thickness provided along the circumference of a semiconductor light emitting element, and provide a...
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7524704 |
Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam
A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable...
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7521293 |
Method of manufacturing semiconductor device, semiconductor device, circuit board, and electronic instrument
A method of manufacturing a semiconductor device uses a substrate on which an interconnect pattern is formed and on which a protective film is formed to include an opening and to cover the...
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7514299 |
Chip package structure and manufacturing method thereof
A manufacturing method of a chip package structure is provided. A circuit substrate having a first surface, a second surface, and a through hole connecting the first surface and the second surface...
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7514276 |
Aligning stacked chips using resistance assistance
The present invention relates to a method of aligning stacked chips wherein the apparatus and method utilize bumps in the form of exposed metal lines on a first chip. The present invention further...
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7508083 |
Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same
The invention relates to an electronic component, which comprises a semiconductor chip. The semiconductor chip is embedded in a plastic housing in such a way that is rear side and its lateral sides...
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7501696 |
Semiconductor chip-embedded substrate and method of manufacturing same
A semiconductor chip-embedded substrate comprising a supporting substrate and an insulating layer thereon, members for the connection to external circuits, and a plurality of semiconductor chips...
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7498197 |
Silica nanoparticles thermoset resin compositions
A themosettable material having excellent processability, and which cures to form a thermoset composition having a low coefficient of thermal expansion and a high glass transition temperature...
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7494843 |
Method of making a semiconductor chip assembly with thermal conductor and encapsulant grinding
A method of making a semiconductor chip assembly includes mechanically attaching a semiconductor chip to a routing line, forming a thermal conductor on the chip, forming an encapsulant that covers...
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7488622 |
Method for producing a surface-mountable semiconductor component
Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical...
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7485491 |
Secure digital memory card using land grid array structure
A memory card comprising a substrate which has a plurality of contacts, at least one die pad, and a plurality of traces. The contacts, the die pad and the traces are disposed in spaced relation to...
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7479413 |
Method for fabricating semiconductor package with circuit side polymer layer
A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die...
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7479407 |
Digital and RF system and method therefor
A stacked die system ( 10 ) has a first die ( 16 ) having a first surface with active circuitry, a second die ( 18 ) having a first surface with active circuitry, and a conductive shield ( 28 )...
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7476969 |
Semiconductor packages for surface mounting and method of producing same
A semiconductor package for surface mounting has a substrate having electrode patterns formed on both its surfaces which are electrically connected through passages such as throughholes formed...
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7473585 |
Technique for manufacturing an overmolded electronic assembly
A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a...
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7465609 |
Method of manufacturing semiconductor device
In the method of manufacturing a semiconductor device that semiconductor chips are mounted facing-up on the printed wiring board on which a protective insulation film is formed by means of a...
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7459349 |
Method of forming a stack of semiconductor packages
A stackable semiconductor package includes a substrate with a first side surface that includes circuit patterns. Each circuit pattern includes a pad. A semiconductor die is electrically coupled to...
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7459348 |
Method for manufacturing a semiconductor device
A method for manufacturing a semiconductor device formed by stacking a plurality of semiconductor elements on a substrate includes the steps of stacking the plurality of semiconductor elements on...
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7449362 |
One-component hot-setting epoxy resin composition and semiconductor mounting underfill material
The present invention provides an one-pack thermosetting type epoxy resin composition which is useful as an underfilling material used when a flip chip or a semiconductor package comprised of a...
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