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6383842 |
Method for producing semiconductor device having increased adhesion between package and semiconductor chip bottom
A method of manufacturing a semiconductor device which includes a semiconductor chip and a plastic package of a thermosetting polymer, including the steps of performing an ultraviolet cleaning...
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6383841 |
Method for encapsulating with a fixing member to secure an electronic device
The present invention is to provide a effective method for packing an electronic device including steps of: (a) putting an electronic device having a plurality of pins in a frame having a plurality...
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6380002 |
Method for fabricating a flexible substrate based ball grid array (BGA) package
A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed...
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6380001 |
Flexible pin count package for semiconductor device
A package for a semiconductor device and a method for packaging a semiconductor device are disclosed. The semiconductor package uses a tape which allows for the production of packaged semiconductor...
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6372547 |
Method for manufacturing electronic device with resin layer between chip carrier and circuit wiring board
In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the...
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6372541 |
Method of fabricating a microcircuit card
A method of fabricating a microcircuit card provides better control of the spreading of a hardenable coating material during fabrication of the microcircuit card. The surface of a support is...
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6368886 |
Method of recovering encapsulated die
A method of decapsulating a packaged die includes removing packaging material from the bottom section of a die-containing package to expose a die pan, removing the die pan, removing material...
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6365920 |
Luminescent diode
The present invention relates to electronics and especially to semiconductors. It is an improved embodiment of a luminescent diode, intended to increase the radiated power thereof. The device...
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6365499 |
Chip carrier and method of manufacturing and mounting the same
In BGA (Ball Grid Array), LGA (Land Grid Array) and the like, a resin layer is formed between an external connecting electrode of a chip carrier and a circuit wiring board. Consequently, the...
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6365436 |
Connecting multiple microelectronic elements with lead deformation
A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a...
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6358773 |
Method of making substrate for use in forming image sensor package
A substrate manufacturing method comprises the steps of: (a) providing a molding die including a top mold and a bottom mold, the bottom mold being provided with at least two projections each having...
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6358780 |
Semiconductor package assemblies with moisture vents and methods of making same
A semiconductor chip package includes a semiconductor chip having surfaces and contacts, a layer of a moisture-permeable material bonded to one surface of the chip and a moisture-impermeable...
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6350634 |
Semiconductor device having a built-in heat sink and process of manufacturing same
The present invention provides a semiconductor device assembly comprising a semiconductor chip, a heat sink having internal and external portions, and a housing that encapsulates the semiconductor...
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RE37554 |
Method for producing an optoelectronic semiconductor component
The optoelectronic semiconductor component has an optoelectronic semiconductor chip disposed on a chip carrier with an approximately planar chip carrier surface. The semiconductor chip is fastened...
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6348399 |
Method of making chip scale package
A method of making a chip scale package comprises the following steps: providing a semiconductor chip having a plurality of metal bumps formed on the active surface thereof; providing a metal plate...
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6342407 |
Low stress hermetic seal
A sealed electronic circuit module includes a ceramic chip carrier with a top surface, a cover having a mating surface and a seal at the periphery of the carrier between the carrier and the cover....
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6338985 |
Making chip size semiconductor packages
A method for making low cost chip size semiconductor packages (“CSPs”) includes preparing a substrate having a first surface with metal pads and lands thereon, and an opposite second surface...
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6338981 |
Centrifugally assisted underfill method
A method of underfilling a space between a semiconductor flip chip and a substrate to encapsulate a plurality of electrical connections with a viscous underfill material. The flip chip is mounted...
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6333211 |
Process for manufacturing a premold type semiconductor package using support pins in the mold and external connector bumps
A premold type semiconductor package includes a plurality of leads arranged side by side and having upper and lower common surfaces, a mold resin integrally molded with the leads for securing them...
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6333209 |
One step method for curing and joining BGA solder balls
A one step method for curing encapsulant and joining Ball Grid Array (BGA) solder balls comprises curing an encapsulant material simultaneously with the joining of the eutectic material of the...
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6331453 |
Method for fabricating semiconductor packages using mold tooling fixture with flash control cavities
A method for fabricating a semiconductor package is performed using a mold tooling fixture having a mold cavity and a pair of flash control cavities on either side of the mold cavity. The...
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6331451 |
Methods of making thin integrated circuit device packages with improved thermal performance and substrates for making the packages
Methods of making integrated circuit device packages and substrates for making the packages are disclosed. An embodiment of a method of making a substrate includes providing an unpatterned sheet of...
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6329228 |
Semiconductor device and method of fabricating the same
A semiconductor device having a PBGA structure comprising a wiring board, a semiconductor integrated circuit chip, substrate electrodes of the semiconductor integrated circuit chip for electrically...
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6326243 |
Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
A semiconductor chip having a plurality of electrodes on its surface is fixed onto a die pad. The leads are spaced away from the die pad and connected to the electrodes of the semiconductor chip by...
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6326244 |
Method of making a cavity ball grid array apparatus
A ball grid array (BGA) package includes a central cavity for receiving a semiconductor die therein. The die rests on a base laminate, the die side of which includes traces therein extending into...
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6326700 |
Low profile semiconductor package and process for making the same
A low-profile semiconductor device is disclosed which includes a substrate having a base layer formed with at least a hole and a plurality of conductive traces arranged on the base layer. A...
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6323065 |
Methods for manufacturing ball grid array assembly semiconductor packages
Disclosed is a semiconductor package arrangement. The package arrangement includes a heat spreader for dissipating heat generated within the semiconductor package arrangement. The package further...
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6319739 |
Mold compound selection for TSOP post mold cure processing
Warpage-free post-mold curing (PMC) of encapsulated device arrays, e.g., TSOPs, is performed without requiring placement of heavy metal weights on the arrays by utilization of molding/encapsulant...
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6319753 |
Semiconductor device having lead terminals bent in J-shape
A semiconductor device having lead terminals bent in a J-shape is disclosed. A radiating plate having a recess formed on an outer peripheral portion thereof is exposed to a lower face of a resin...
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6316291 |
Method of fabricating a non-laminate carrier substrate utilizing a mold
A semiconductor device package includes a carrier substrate molded of a non-laminate material. A plurality of conductive metal balls are molded within the non-laminate carrier substrate to provide...
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6316290 |
Method of fabricating a semiconductor device utilizing a residual organic compound to facilitate gate break on a carrier substrate
An encapsulant molding technique used in chip-on-board encapsulation wherein a residual organic compound layer on the surface of a substrate is used to facilitate removal of unwanted encapsulant...
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6309902 |
Method for coating semiconductor element with resin, coating resin, and liquid crystal display device
It is an object of this invention to provide a method for simply and quickly covering a semiconductor device with a coating resin. In the method for covering a semiconductor device 2 used for a...
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6309912 |
Method of interconnecting an embedded integrated circuit
A method of interconnecting electrical terminations (12) of an integrated circuit die (30) to corresponding circuit traces (22) of a circuit carrying substrate (20). The die is placed in a cavity...
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6309915 |
Semiconductor chip package with expander ring and method of making same
A method of making a semiconductor chip assembly, including providing a dielectric element with a plurality of electrically conductive terminals, disposing an expander ring over the dielectric...
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6306688 |
Method of reworkably removing a fluorinated polymer encapsulant
The present invention provides an improved fluorinated polymer encapsulant for protectively coating electronic devices in an electronic device module. Also provided is a method for applying and...
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RE37413 |
Semiconductor package for a semiconductor chip having centrally located bottom bond pads
A semiconductor package having outer leads which are not protruded from the package but only exposed to outside. The semiconductor package comprises a semiconductor chip which is formed with a...
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6300163 |
Stacked leads-over-chip multi-chip module
A multi-chip module (MCM) and method of manufacturing is disclosed that provides for attachment of semiconductor dice to both sides of the MCM printed circuit board (PCB). Semiconductor dice...
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6300169 |
Method for manufacturing a pressure sensor
In a method for manufacturing a pressure sensor, in which a semiconductor pressure sensing element is applied to an assembly segment of a lead grid, the semiconductor pressure sensing element is...
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6294411 |
Method for molding a semiconductor device utilizing a satin finish
A semiconductor component includes, before molding, a lead frame, a semiconductor chip mounted on the lead frame, and bonding wires for connecting pads of the semiconductor chip to inner leads....
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6291260 |
Crack-preventive substrate and process for fabricating solder mask
A crack-preventive substrate for fabricating a solder mask in a device site region includes a substrate, which has a top surface and a bottom surface, and a solder mask layer. The substrate is...
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6291271 |
Method of making semiconductor chip package
A method of making a semiconductor chip package utilizes a film carrier to support a semiconductor chip. The method comprises the steps of: forming a plurality of through-holes in a film carrier;...
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6291274 |
Resin molded semiconductor device and method for manufacturing the same
A method for manufacturing a semiconductor chip (15) which is bonded on a die pad (13) of a leadframe, and inner leads (12) are electrically connected to electrode pads of the semiconductor chip...
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6291267 |
Process for underfilling chip-under-chip semiconductor modules
A process for underfilling a chip-under-chip module. The module comprises a first larger chip, a second smaller chip attached to the underside of the first chip, a substrate having a top surface to...
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6287892 |
Shock-resistant semiconductor device and method for producing same
A plurality of substrate to which have been flip-chip mounted semiconductor chips are laminated by solder bumps provided for the purpose of lamination. A elastic resin is caused to fill the space...
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6288905 |
Contact module, as for a smart card, and method for making same
A module, such as a contact module for embedding an electronic device into a credit card, smart card, identification tag or other article, comprise a pattern of metal contacts having a first and a...
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6284570 |
Method of manufacturing a semiconductor component from a conductive substrate containing a plurality of vias
A semiconductor leadframe assembly (20A) and a method for manufacturing a semiconductor component (50) using the semiconductor leadframe assembly (20A). The semiconductor leadframe assembly (20A)...
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6284569 |
Method of manufacturing a flexible integrated circuit package utilizing an integrated carrier ring/stiffener
A carrier ring provides a stiffening function for assembling flexible circuits or semi-rigid circuits. The carrier ring is attached to a substrate adapted for attachment of a matrix of...
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6281044 |
Method and system for fabricating semiconductor components
A method for fabricating semiconductor components, such as BGA packages, chip scale packages, and multi chip modules, includes the steps of cutting decals from ribbons of adhesive tape, and then...
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6277660 |
Method and apparatus for testing chips
Method and apparatus for the testing of substrates which are provided with a wiring structure, in particular, chips (21), in conjunction with which, by means of a solder-deposit carrier (25) which...
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6268648 |
Board for mounting semiconductor element, method for manufacturing the same, and semiconductor device
A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The...
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