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7109057 |
Sealing apparatus for semiconductor wafer and method of manufacturing semiconductor device by using sealing apparatus
A sealing apparatus for a semiconductor wafer includes an upper mold and a lower mold. The lower mold includes a recess in which the semiconductor wader is placed, and a pot for introducing resin...
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7109062 |
Semiconductor integrated device including support substrate fastened using resin, and manufacturing method thereof
A semiconductor integrated device, provided with a semiconductor chip on which a semiconductor integrated circuit is formed and a support substrate laminated on at least one surface of the...
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7103969 |
Methods and systems for forming a die package
The described embodiments relate to methods and systems for forming die packages. In one exemplary embodiment, the method for forming die packages contacts interface areas of a die assembly to keep...
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7098082 |
Microelectronics package assembly tool and method of manufacture therewith
A method of manufacturing a microelectronic package comprising, in one embodiment, providing a package substrate, coupling a device substrate to the package substrate, and assembling a bifurcated...
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7094630 |
Method of fabricating semiconductor device having a chip, reinforcing plate, and sealing material sharing a common rear surface
A plurality of chips are mounted on a substrate, coupling portions between the chips and the substrate are sealed, the chips have rear surfaces thereof collectively polished, and the substrate with...
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7091060 |
Circuit and substrate encapsulation methods
A ball grid array assembly includes a package cover that encapsulates a die and a portion of a substrate to which the die is attached, including an edge of the substrate. Encapsulation of the...
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7087465 |
Method of packaging a semiconductor light emitting device
A semiconductor light emitting device is packaged by forming a sealed compartment enclosing the device, at least one of the walls of the sealed compartment being formed of an elastomeric material....
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7084511 |
Semiconductor device having resin-sealed area on circuit board thereof
A semiconductor device having a molded sealing resin for sealing a semiconductor chip on a circuit board thereof reduces resin burrs resulting from the leakage of the sealing resin, and also...
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7078265 |
Method for fabricating a semiconductor device having a heat radiation layer including forming scribe lines and dicing
A fabricating method for a semiconductor device includes forming a heat spreading material on rear surface of the semiconductor wafer. The semiconductor wafer has a plurality of device areas and...
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7071034 |
Method of making semiconductor device
A semiconductor device includes a first lead having an inner portion on which a semiconductor chip is mounted, a second lead having an inner portion electrically connected to the semiconductor chip...
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7065867 |
Low temperature hermetic sealing method having passivation layer
A hermetic sealing method, which is capable of preventing oxidation of a micro-electromechanical system (MEMS) and sealing the MEMS at a low temperature. A low temperature hermetic sealing method...
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7067358 |
Package structure with a retarding structure and method of making same
An encapsulant easily flows into a space between a substrate and an electronic device and contacts with an active region of the electronic device to affect the characteristic of the electronic...
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7067356 |
Method of fabricating microelectronic package having a bumpless laminated interconnection layer
A microelectronic device fabrication technology that places at least one microelectronic die within at least one opening in a microelectronic package core and secures the microelectronic die/dice...
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7060532 |
Manufacturing method of semiconductor device
A manufacturing method of a semiconductor device includes: providing a groove having a thickness equal to or larger than a finishing thickness on a first surface of a semiconductor wafer on which a...
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7056770 |
Method of resin encapsulation, apparatus for resin encapsulation, method of manufacturing semiconductor device, semiconductor device and resin material
First, a board is placed on a board mounting portion with a lower mold and an upper mold being opened. Then, a resin material having such size and shape that correspond to the size and shape of a...
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7056765 |
Semiconductor device package and method of manufacture
A semiconductor package having a substrate; a semiconductor die attached to the substrate; a housing attached to the substrate and arranged to surround the semiconductor die; and solidified molding...
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7056771 |
Method of forming an array of semiconductor packages
A semiconductor package is provided which includes a substrate having a plurality of semiconductor dice mounted thereon. The substrate is divided into segments by grooves formed in the bottom...
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7049179 |
Semiconductor device and manufacturing method thereof
A source electrode, a gate electrode, and a drain electrode formed on a front face active region of a semiconductor substrate in a shape of teeth of a comb are covered with an insulating film such...
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7045440 |
Method of fabricating radio frequency microelectromechanical systems (MEMS) devices on low-temperature co-fired ceramic (LTCC) substrates
A phased-array antenna system and other types of radio frequency (RF) devices and systems using microelectromechanical switches (“MEMS”) and low-temperature co-fired ceramic (“LTCC”)...
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7041535 |
Power module and method of manufacturing the same
In a power module, a wiring substrate to which a heat generating component is connected electrically and a heat sink are connected through the medium of a thermally conductive and electrically...
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7038321 |
Method of attaching a flip chip device and circuit assembly formed thereby
A method of flip-chip mounting a circuit device to a substrate in a manner that avoids damage and impairment of a fragile or otherwise sensitive element on the device facing the substrate, and a...
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7037805 |
Methods and apparatus for attaching a die to a substrate
A method for increasing the bonding strength between a die and a housing for the die is described where a micro-electromechanical system (MEMS) device is formed on the die. The method includes...
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7037761 |
Method of producing an electronic component
An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor...
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7029952 |
Method for making a semiconductor package and semiconductor package with integrated circuit chips
Method of fabricating a semiconductor package and semiconductor package containing an integrated circuit chip having, on one front face, electrical connection regions, in which a first multilayer...
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7030505 |
Resin-sealed-type semiconductor device, and production process for producing such semiconductor device
A resin-sealed type semiconductor device has a mount stage, a semiconductor chip mounted on the stage such that a rear surface of the chip is in contact with the stage, a heat spreader associated...
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7029953 |
Semiconductor package for three-dimensional mounting, fabrication method thereof, and semiconductor device
A semiconductor package for three-dimensional mounting is provided. The package includes a wiring substrate having a first surface on which a first wiring pattern is formed and a second surface on...
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7026180 |
Screen-printing metal mask plate and method of resin-sealing vibrating part
A squeegee is slid over a metal mask plate so as to fill a sealing resin in a resin inflow space through a through hole, and the sealing resin, deposited on an outer surface of an electronic part...
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7026176 |
Mold making method for wafer scale caps
Disclosed is a method for fabricating a mold. The mold is used for protective caps which will be applied to a wafer. The method comprises the steps of fabricating first and second cooperating mold...
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7022554 |
Method for fabricating circuit module
A method for fabricating a circuit module includes a step of filling the gap between a chip component and a substrate on which the chip component is mounted in a flip chip configuration with resin....
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7015073 |
Method of forming heat spreader with down set leg attachment feature
Numerous embodiments of a heat spreader, comprised of a plurality of downset legs, which provides a simple and lower cost method of forming a heat spreader as compared to conventional methods are...
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7008822 |
Method for fabricating semiconductor component having stacked, encapsulated dice
A semiconductor component includes a substrate and multiple stacked, encapsulated semiconductor dice on the substrate. A first die is back bonded to the substrate and encapsulated in a first...
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7008820 |
Chip scale package with open substrate
A method for manufacturing an integrated circuit package comprises forming a substrate by forming a core layer with a through opening and vias. A first conductive layer is formed on the core layer...
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7005327 |
Process and structure for semiconductor package
A packaging process for a semiconductor chip that includes the following steps. A carrier having an upper surface and a corresponding lower surface is provided. A photoresist layer is formed on the...
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7002236 |
Semiconductor package and method for producing the same
A semiconductor package in which solder balls can be loaded on an encapsulated resin to reduce the package area and a method for producing the semiconductor package. An apparatus for carrying out...
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6998296 |
Electronic component and method for its production
The invention relates to an electronic component and to a method for its production. The electronic component has a semiconductor chip and a wiring board, and a plastic package. The plastic package...
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6987031 |
Multiple chip semiconductor package and method of fabricating same
A semiconductor device package and method of fabricating the same. The semiconductor device package may include a variety of semiconductor dice, thereby providing a system on a chip solution. The...
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6985363 |
Card type recording medium and production method therefor
To provide a card-type recording medium which is capable of increasing memory capacity and excellent in rigidity and shock resistance, and to provide a method for manufacturing the same. A...
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6984546 |
Method for forming a thin film light emitting device
A method is to form a thin film light emitting device. The method includes providing a transparent substrate. A transparent anode layer, a light emitting layer, a metal cathode layer are...
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6984866 |
Flip chip optical semiconductor on a PCB
Semiconductor devices and methods for making semiconductor devices. The present invention allows a flip chip assembly to be used with an optical semiconductor device. The optical semiconductor flip...
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6982486 |
Cavity ball grid array apparatus having improved inductance characteristics and method of fabricating the same
A ball grid array (BGA) package that includes a central cavity for receiving a semiconductor die therein is disclosed. The die rests on a base laminate, the die side of which includes traces...
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6977428 |
Semiconductor device adapted to remove noise from a signal
What is invented is a semiconductor device ( 10 ) comprising a pellet ( 12 ) having a ground electrode ( 18 ), an outside signal terminal ( 15 ) connected to the pellet ( 12 ), so as to receive...
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6974635 |
Package for electronic component, lid material for package lid, and production method for lid material
A lid material is provided which comprises: a core layer composed of an Fe—Ni alloy or an Fe—Ni—Co alloy; a nickel-based (Ni-based) metal layer press- and diffusion-bonded onto the core layer...
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6969640 |
Air pocket resistant semiconductor package system
A die is attached to a substrate and is enclosed in a heat spreader, the heat spreader having a first encapsulant guide and a heat spreader air vent in the heat spreader extending therethrough. An...
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6969636 |
Semiconductor package with stress inhibiting intermediate mounting substrate
A semiconductor package includes a chip carrier to receive a semiconductor with a dimension generally greater than 26 mm. The chip carrier has a first coefficient of thermal expansion that is...
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6969641 |
Method and system for integrated circuit packaging
According to one embodiment of the invention, a method of packaging integrated circuits includes disposing an integrated circuit chip outwardly from a first surface of a substrate, positioning the...
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6967127 |
Methods for making semiconductor packages with leadframe grid arrays
Methods of forming a semiconductor assembly are described which include a leadframe with leads having offset portions exposed at an outer surface of a material package to form a grid array. An...
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6964888 |
Semiconductor device and method for fabricating the same
A semiconductor device is proposed, in which a chip is placed in an opening penetratingly formed in a substrate in a manner as not to come into contact with the substrate, and an encapsulant formed...
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6964881 |
Multi-chip wafer level system packages and methods of forming same
The present invention defines a packaging implementation providing a multichip multilayer system on a chip solution. Greater integration of a plurality and variety of known good die are contained...
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6964887 |
Method for manufacturing semiconductor device
Method for manufacturing a semiconductor device wherein thin semiconductor chips having a thickness of 50 μm or so are imbedded and mounted inside a package, and multi-level stacking is...
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6960494 |
Semiconductor package and method of manufacturing the same
A semiconductor package has (a) a package base, (b) package terminals formed on the package base and used to connect the semiconductor package to another device, (c) a wiring layer formed on the...
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