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6261871 |
Method and structure for temperature stabilization in flip chip technology
Phase Change Material ("PCM") are used to reduce the range of temperature excursions in a semiconductor die attached to an interconnect substrate in the flip chip technology. In one embodiment a...
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6258630 |
Resin-sealed semiconductor device having island for mounting semiconductor element coupled to heat spreader
A resin-sealed semiconductor device of the present invention includes: a lead frame having an island on which a semiconductor element is mounted and inner leads; and a heat spreader for diffusing...
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6258632 |
Molded packaging for semiconductor device and method of manufacturing the same
One end of bonding wires made of aluminium, gold, etc., is connected to a plurality of electrode pads formed on the main surface of a semiconductor chip. The other end of these bonding wires is...
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6258624 |
Semiconductor package having downset leadframe for reducing package bow
A bow resistant semiconductor package includes a semiconductor die, a leadframe segment and a plastic body. The leadframe segment includes lead fingers attached and wire bonded to the die, and...
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6255142 |
Method for underfilling semiconductor devices
A method and apparatus for underfilling a gap between a multi-sided semiconductor device and a substrate with viscous underfill material. The viscous underfill material is moved into the gap to...
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6246124 |
Encapsulated chip module and method of making same
An encapsulated semiconductor chip module. The chip module has the overlying encapsulant adhered directly and integrally to bare portions of the substrate to which the chip is mounted. This...
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6245598 |
Method for wire bonding a chip to a substrate with recessed bond pads and devices formed
A method for forming chip scale packages and devices formed by utilizing a wire bonding technique and an interposer board which has recessed peripheral regions are disclosed. In the method, an IC...
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6242284 |
Method for packaging a semiconductor chip
A method for packaging a semiconductor chip, generally comprising the following steps of: (a) forming a plurality of openings on the top surface of the conducting substrate, wherein the upper...
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6228676 |
Near chip size integrated circuit package
A plurality of integrated circuit chip (IC chip) packages are fabricated simultaneously from a single insulating substrate having sections. In each section, an IC chip is attached. Bonding pads on...
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6228685 |
Framed sheet processing
A microelectronic component is fabricated by bonding a flexible sheet in tension on a rigid frame so that the sheet spans an aperture in the frame, and performing one or more operations on features...
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6228688 |
Flip-chip resin-encapsulated semiconductor device
A method of manufacturing a resin-encapsulated semiconductor device, which includes the steps of, mounting a semiconductor element facedown on a substrate provided with a wiring circuit with a main...
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6225144 |
Method and machine for underfilling an assembly to form a semiconductor package
A method and machine (1) for underfilling an assembly (8) to form semiconductor package is disclosed. The machine (1) has conveying tracks (2) for continuously conveying the assembly (8) past...
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6222259 |
Stack package and method of fabricating the same
Disclosed is a stack package and a method of manufacturing the same. The stack package of the present invention comprises a ceramic capsule. A pair of protruding portions are formed at both upper...
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6218213 |
Microelectronic components with frangible lead sections
Flexible leads for making electrical connection in microelectronic components include a frangible intermediate section. The frangible intermediate section is formed by a region within the lead...
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6214635 |
Method and apparatus for underfill of bumped or raised die
A method and apparatus for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an inclined plane....
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6214649 |
Integrated circuit package
An IC chip is mounted on a circuit substrate by the flip chip mounting. A projection is provided for forming an eccentric space between the IC chip and the circuit substrate at a position deviated...
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6214640 |
Method of manufacturing a plurality of semiconductor packages
A method of manufacturing a plurality of semiconductor chips packages and the resulting chip package assemblies. The method includes providing a circuitized substrate having terminals and leads. A...
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6214648 |
Semiconductor chip package and method for fabricating the same
The semiconductor chip package includes a package body with a recess and a plurality of barrier parts formed along one side thereof. Each of the barrier parts has a first region and a second region...
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6214638 |
Bond pad functional layout on die to improve package manufacturability and assembly
An integrated circuit package which has a staggered bond wire pattern that increases the bond finger width to pad pitch ratio of the package. The package includes a first bond shelf, a second bond...
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6214644 |
Flip-chip micromachine package fabrication method
To fabricate a flip-chip micromachine package, a micromachine chip is mounted as a flip chip to a substrate. The micromachine chip is attached such that a micromachine area on a first surface of...
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6207478 |
Method for manufacturing semiconductor package of center pad type device
In accordance with an embodiment of the present invention, a method for manufacturing a semiconductor package of a center pad type device includes: attaching a semiconductor chip to a tape wiring...
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6201299 |
Substrate structure of BGA semiconductor package
A substrate structure mainly comprises a plurality of substrate units and a plurality of dispensing holes thereon. A main hole is provided on the surface of the substrate unit, the two ends of...
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6197619 |
Method for reinforcing a semiconductor device to prevent cracking
A structure and methods for reinforcing a semiconductor device to prevent cracking is provided. The device may take the form of a semiconductor chip or a semiconductor chip package. When a...
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6194243 |
Method of production an underfill of a bumped or raised die using a barrier adjacent to the sidewall of a semiconductor device
A method and apparatus for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an inclined plane....
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6194250 |
Low-profile microelectronic package
A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An...
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6191952 |
Compliant surface layer for flip-chip electronic packages and method for forming same
Flip-chip electronic packages are provided with a compliant surface layer, normally positioned between an underfill layer and a substrate such as a chip carrier or a printed circuit board or card,...
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6191955 |
Encapsulation and enclosure of electronic modules
An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket...
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6190945 |
Integrated heat sink
A semiconductor device has an integrated heat sink. A package body encapsulates a die and a leadframe. A heat sink is in thermal contact with the die and the leadframe. The heat sink is...
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6187613 |
Process for underfill encapsulating flip chip driven by pressure
The present invention provides a process for underfill encapsulating a flip chip which is driven by pressure. First, a metal foil is placed on a flip chip that has been connected to a substrate....
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6166446 |
Semiconductor device and fabrication process thereof
A semiconductor device in which defective resin filling can be prevented. One embodiment has a metal heat-releasing plate (103) with good thermal conductivity, which is sealed within a resin...
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6162664 |
Method for fabricating a surface mounting type semiconductor chip package
A solder structure for a surface mounting type semiconductor chip package, and a method of fabricating the same are disclosed. The surface mounting type semiconductor chip package includes a...
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6159869 |
Method of making a circuit including a corral for containing a protective coating
A circuit including an active area, at least one bond pad and a corral formed on the circuit between the active area and the bond pad. A method including providing a circuit with an active area and...
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6150194 |
Semiconductor device sealed with resin, and its manufacture
A semiconductor device is provided which is capable of improving the productivity, the reliably, and the shielding of exposed parts such as leads or others and preventing chipping. The...
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6150193 |
RF shielded device
A shielded package for an IC chip having bond pads thereon includes an insulating substrate having metallizations formed on a surface of the substrate. The IC chip is mounted to the substrate...
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6150187 |
Encapsulation method of a polymer or organic light emitting device
The present invention relates to the encapsulation for extending the lifetime of a flexible organic or polymer light emitting device and, more particularly, to encapsulation by sealing with...
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6146923 |
Method of smoothing fluorine-containing resin molded article and smoothed molded article
A fluorine-containing resin molded article can be obtained by putting it between smooth molds having a surface roughness (Ra) of not more than 50 Å and compression-molding it under molding...
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6146921 |
Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink
An integrated circuit package which includes a thermal element that extends into a cavity of an injection molded housing. The cavity exposes at least a portion of an integrated circuit that is...
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6133068 |
Increasing the gap between a lead frame and a semiconductor die
Apparatus and method of increasing the distance of the gap between a lead frame and a semiconductor die surface in a package assembly. An adhesive layer and a gap increasing layer are disposed...
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6130115 |
Plastic encapsulated semiconductor device and method of manufacturing the same
A plastic encapsulated semiconductor device comprises a die pad, die pad support pins suspending the die pad, a semiconductor chip mounted on the die pad, thin metal wires for connecting the...
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6130116 |
Method of encapsulating a microelectronic assembly utilizing a barrier
A method of encapsulating a microelectronic assembly includes providing one or more microelectronic assemblies having one or more elements defining exterior surfaces and an array of terminals...
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6124152 |
Method for fabricating cob type semiconductor package
Method for fabricating a COB type semiconductor package, which is suitable for simplifiing a process from wire bonding to milling, including the steps of (1) mounting chips on a COB film having a...
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6124643 |
Device assembly facilitating gap filling between spaced layers of semiconductor substrates
A semiconductor device assembly with a gap to be filled has thermal vias formed in the supporting substrate. After the semiconductor device is connected to the substrate and fill material...
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6120301 |
Semiconductor device and method of manufacturing the same
In the BGA in which the bonding portions of the support frame bonded to the wiring substrate via adhesive layer are molded by a resin, the areas of the bonding portions are each selected to be from...
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6107121 |
Method of making interconnections between a multi-layer chip stack to a printed circuit board in a ceramic package
A semiconductor device package and method includes a thick, integrated circuit chip stack having a substantially planar bottom surface with a plurality of terminals. A carrier substrate is...
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6103554 |
Method for packaging integrated circuits with elastomer chip carriers
A semiconductor chip packaging method includes the provision of individual elastomer chip carriers cut from an elastomer sheet having a uniform thickness and smooth, parallel surfaces. The...
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6100114 |
Encapsulation of solder bumps and solder connections
Solder bumps on electronic components are encapsulated before attachment to a substrate or component carrier. A film of sealing material is pressed against top portions of the solder bumps by...
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6100108 |
Method of fabricating electronic circuit device
An electronic circuit device fabrication method securing a bond width of a seal portion when heat treatment is needed in sealing a device cavity by a cap. An electronic part mounting step is...
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6093584 |
Method for encapsulating a semiconductor package having apertures through a sacrificial layer and contact pads
A method of manufacturing a semiconductor chip package. A sacrificial layer is used as a base to selectively form an array of conductive pads such that a central region is defined by the pads. A...
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6083776 |
Molded lead frame ball grid array
A ball grid array (BGA) package configuration for packaging an integrated-circuit die includes a lead frame having a plurality of inwardly-extending bonding fingers and a centrally-located...
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6080604 |
Semiconductor device having tab-leads and a fabrication method thereof
A semiconductor device having a semiconductor chip and a TAB lead adhering to a surface of the semiconductor chip by a TAB tape which electrically connects an internal terminal arranged in a center...
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