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7622334 |
Wafer-level packaging cutting method capable of protecting contact pads
A cutting method for wafer-level packaging capable of protecting the contact pad, in which several cavities and precutting lines are formed at the front surface of a cap wafer, and the depth of...
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7622327 |
Covered devices in a semiconductor package
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A...
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7615842 |
Inductor integrated chip
An inductor integrated chip and fabrication method thereof is provided. The inductor integrated chip includes a wafer; an inductor bonded on a surface of the wafer; a circuit element formed on the...
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7615704 |
Multiple digital printing techniques for fabricating printed circuits
Methods of fabricating a printed circuit and printed circuits, including a method comprising: (a) depositing a conductive material to form a first conductive pathway upon a substrate; (b)...
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7615415 |
Vertical stack type multi-chip package having improved grounding performance and lower semiconductor chip reliability
A vertical stack type multi-chip package is provided having improved reliability by increasing the grounding performance and preventing the decrease in reliability of the multi-chip package from...
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7608485 |
Highly reliable, cost effective and thermally enhanced AuSn die-attach technology
In a circuit, an integrated circuit package and methods for attaching integrated circuit dies or discrete power components to flanges of integrated circuit packages, each of the integrated circuit...
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7598125 |
Method for wafer level packaging and fabricating cap structures
A cap wafer with cavities is etched through areas not covered by a patterned photoresist to form a plurality of openings. The cap wafer is bonded to a transparent wafer at the surface having the...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7592204 |
Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical...
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7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one...
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7588962 |
Method of making semiconductor device
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a...
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7586189 |
Heat dissipation structure accommodated in electronic control device
A circuit board mounting electronic components including a heat generating element is accommodated in a casing. A heat dissipation member is disposed between the heat generating element and an...
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7582514 |
Microelectromechanical systems encapsulation process with anti-stiction coating
An encapsulated MEMS process including a high-temperature anti-stiction coating that is stable under processing steps at temperatures over 450° C. is described. The coating is applied after device...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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7579217 |
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second...
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7575956 |
Fabrication method for semiconductor package heat spreaders
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least...
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7575953 |
Stacked die with a recess in a die BGA package
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
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7572681 |
Embedded electronic component package
A method of forming an embedded electronic component package includes coupling a substrate to a first dielectric layer, strip, or panel, and forming first electrically conductive vias and traces in...
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7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
In a semiconductor flip-chip package having a semiconductor die as part of a substrate assembly, a lid (or lid assembly) and substrate are supported to prevent tilting and teetering of the lid. The...
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7572670 |
Methods of forming semiconductor packages
The invention includes semiconductor packages having a patterned substrate with openings extending therethrough, conductive circuit traces over the substrate and having portions extending over the...
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7572665 |
Microelectronics grade metal substrate, related metal-embedded devices and methods for fabricating same
Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial...
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7569917 |
Semiconductor device
A semiconductor device includes a semiconductor chip, an insulating base film and first projecting electrodes. The first projecting electrodes are formed in a single row on one face of the...
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7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.
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7566584 |
Electronic substrate manufacturing method, semiconductor device manufacturing method, and electronic equipment manufacturing method
A method of manufacture of an electronic substrate, having a process of embedding electronic components in a substrate, and a process of ejecting liquid droplets containing a conductive material,...
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7563651 |
Method of fabricating a substrate with a concave surface
Bending generated in a side of a device mounting surface of an organic resin substrate after an assembly process for a semiconductor device is inhibited, thereby providing an improved production...
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7563650 |
Circuit board and the manufacturing method
A method for manufacturing a circuit board ( 7 ); in which, an electronic component is injected into a resin substrate at a low temperature, and then the resin substrate is improved in its heat...
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7563646 |
Molded ceramic surface mount package
The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or...
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7557014 |
Semiconductor system-in-package
A semiconductor apparatus comprises a support substrate having through holes filles with conductor adapted to a first pitch; a capacitor formed on or above said support substrate; a wiring layer...
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7553699 |
Method of fabricating microelectronic devices
Microelectronic devices and methods for manufacturing microelectronic devices are disclosed herein. An embodiment of one such method includes forming a plurality of through holes in a substrate...
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7550320 |
Method of fabricating substrate with embedded component therein
A method of fabricating a substrate with an embedded component therein including the following steps is provided. First, a core layer having a first dielectric layer, a first patterned circuit...
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7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers...
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7545027 |
Wafer level package having redistribution interconnection layer and method of forming the same
A wafer level package may include a semiconductor substrate supporting an electrode pad. A first insulating layer may be provided on the semiconductor substrate. The first insulating layer may...
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7544542 |
Reduction of damage to thermal interface material due to asymmetrical load
Various method and apparatus for packaging an integrated circuit are provided. In one aspect, a method of packaging an integrated circuit is provided that includes coupling an integrated circuit to...
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7541222 |
Wire sweep resistant semiconductor package and manufacturing method therefor
A method for manufacturing a wire sweep resistant semiconductor package provides a die attached to an interposer. The die is electrically connected to the interposer with conductive wires. A...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7537967 |
Mold cleaning sheet and manufacturing method of a semiconductor device using the same
A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed...
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7537964 |
Method of fabricating a miniature silicon condenser microphone
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the...
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7534658 |
Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices
The specification teaches a technique for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and...
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7534636 |
Lids for wafer-scale optoelectronic packages
A method for forming a lid for a wafer-scale package includes (1) forming a cavity in a substrate, (2) forming an oxide layer over the cavity and over a bond area around the cavity on the...
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7531894 |
Method of electrically connecting a microelectronic component
A method of electrically connecting a microelectronic component having a first surface bearing a plurality of contacts. The method including the steps of forming a subassembly by juxtaposing a...
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7525188 |
Multilayer circuit board and production method for same
In a multilayer circuit board of the present invention, a plurality of circuit substrates configured by forming a circuit pattern on an insulating base material are stacked via an insulating layer,...
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7524703 |
Integrated circuit stacking system and method
The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion...
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7524701 |
Chip-scale package
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
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7521795 |
Semiconductor package
A semiconductor package has: a semiconductor chip having first and second main electrodes arranged on two principal surfaces being opposite to each other; a first main wiring plate connected to the...
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7521296 |
Methods of fabricating a microlens including selectively curing flowable, uncured optically trasmissive material
Microlenses for directing radiation toward a sensor of an imaging device include a plurality of mutually adhered layers of cured optically transmissive material. Systems include at least one...
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7517734 |
Method of manufacturing a wafer level package with a cap structure for hermetically sealing a micro device
A wafer level package includes a device wafer having a micro device, and bonding pads which are connected to the micro device, and formed at one surface of the device wafer, via connectors...
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7517723 |
Method for fabricating a flip chip system in package
Embodiments of the invention provide a method for fabricating a system in package. In one embodiment, the method comprises preparing a printed circuit board (PCB) strip comprising a plurality of...
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7514298 |
Printed wiring board for mounting semiconductor
A printed wiring board for mounting a semiconductor, which printed wiring board has a taper-shaped through hole connecting an upper surface circuit and a lower surface circuit, and/or an internal...
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7514289 |
Methods and structures for facilitating proximity communication
One embodiment of the present invention provides an integrated chip module and a corresponding method of manufacture that facilitates proximity communication. This module includes a base chip and a...
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