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7612446 |
Structures to enhance cooling of computer memory modules
A spring-like cooling structure for an in-line chip module is formed from a continuous sheet of a thermally conducting material having a front side and a back side, the sheet folded at...
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7612429 |
Chip resistor, process for producing the same, and frame for use therein
A chip resistor (A 1 ) comprises a first insulation layer ( 2 A) covering the regions between a plurality of electrodes ( 3 ) on a rear surface ( 10 a ) of a resistor ( 1 ), and a second insulation...
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7608925 |
Relay board with bonding pads connected by wirings
A relay board provided in a semiconductor package where a plurality of semiconductor chips are provided, the relay board relaying a wire for wiring the semiconductor chips or a wire for wiring a...
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7608916 |
Aluminum leadframes for semiconductor QFN/SON devices
A post-mold plated semiconductor device has an aluminum leadframe ( 105 ) with a structure including a chip mount pad and a plurality of lead segments without cantilevered lead portions. A...
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7608484 |
Non-pull back pad package with an additional solder standoff
Disclosed herein is a method of manufacturing a semiconductor package with a solder standoff on lead pads that reach to the edge of the package (non-pullback leads). It includes encapsulating a...
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7608482 |
Integrated circuit package with molded insulation
A variety of improved arrangements and processes for packaging integrated circuits are described. More particularly, methods of encapsulating dice in lead frame based IC packages are described that...
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7602054 |
Method of forming a molded array package device having an exposed tab and structure
In one embodiment, a method for forming a molded flat pack style package includes attaching electronic chips to an array lead frame, which includes a plurality of elongated flag portions with tab...
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7602053 |
Leadframe of a leadless flip-chip package and method for manufacturing the same
A leadframe of a leadless flip-chip package includes a plurality of inner leads, a nonconductive ink layer and a solder mask layer. The inner leads have a plurality of bump-connecting terminals, a...
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7601562 |
Microelectronic component assemblies having lead frames adapted to reduce package bow
The present disclosure suggests various microelectronic component assembly designs and methods for manufacturing microelectronic component assemblies. In one particular implementation, the...
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7601560 |
Method for producing an electronic circuit
The invention relates to a method for producing an electronic circuit. According to said method, two semiconductor chips ( 46 ) with essentially the same structure are mounted on a surface ( 13 )...
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7598596 |
Methods and apparatus for a dual-metal magnetic shield structure
A shield structure for shielding an electromagnetic-field-susceptible region of a semiconductor component (e.g., a magnetoresistive random access memory, or “MRAM”) includes a stress-relief...
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7598101 |
LED of side view type and the method for manufacturing the same
A side view type light emitting diode and a method of manufacturing the same are disclosed. The method may include (a) providing lead frames which include a cathode terminal and an anode terminal,...
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7595228 |
Method for manufacturing electronic component-mounted board
A method for manufacturing an electronic component-mounted board (X) includes a temperature raising step for heating an electronic component ( 30 A), with a solder bump electrode ( 31 ) containing...
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7589404 |
Semiconductor device
A semiconductor device includes: a semiconductor element; a die pad with the semiconductor element mounted thereon; a plurality of electrode terminals each having a connecting portion electrically...
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7582552 |
Electronic apparatus with busbar assembly and electronic component mounted thereon by soldering
In an electronic apparatus, a busbar assembly is composed of busbars made of at least one previously selected metal material. Each of the busbars has one surface. A solder joint is made of an alloy...
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7575957 |
Leadless semiconductor package and method for manufacturing the same
A leadless semiconductor package mainly includes a plurality of inner leads, a chip pad, a semiconductor chip and a molding compound. A non-conductive ink is filled between every two of the inner...
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7575956 |
Fabrication method for semiconductor package heat spreaders
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least...
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7572678 |
Methods of making and using a floating lead finger on a lead frame
A semiconductor device assembly includes a semiconductor device and a lead frame having lead fingers for connection to the semiconductor device. The lead frame may include floating no-connect (NC)...
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7566592 |
Method and process of manufacturing robust high temperature solder joints
The principles described herein relate to methods for soldering electrode terminals, pins or lead-frames of commercial electric components for high temperature reliability. In one embodiment, prior...
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7563648 |
Semiconductor device package and method for manufacturing same
A lead frame ( 52, 100, 112 ) for a semiconductor device (die) package ( 50, 102, 110 ) is described. Each of the leads ( 60 ) in the lead frame ( 52, 100, 112 ) includes an interposer ( 64 )...
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7560312 |
Void formation for semiconductor junction capacitance reduction
Semiconductor structures having a decreased semiconductor junction capacitance of a semiconductor junction within an active semiconductor layer may be fabricated using an ion implantation and...
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7560311 |
Robust leaded molded packages and methods for forming the same
A method for making a flip chip in a leaded molded package is disclosed. In some embodiments, the method includes using a leadframe structure including a die attach region and leads. The die attach...
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7557432 |
Thermally enhanced power semiconductor package system
The present invention provides a thermally enhanced power semiconductor package system comprising providing a power semiconductor die, forming an upper lead frame on the power semiconductor die and...
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7556987 |
Method of fabricating an integrated circuit with etched ring and die paddle
An integrated circuit package system is provided including forming a D-ring comprising half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring....
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7554181 |
Semiconductor device with non-overlapping chip mounting sections
The present invention provides a non-insulated type DC-DC converter having a circuit in which a power MOS•FET for a high side switch and a power MOS•FET for a low side switch are connected in...
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7554179 |
Multi-leadframe semiconductor package and method of manufacture
A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached...
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7550828 |
Leadframe package for MEMS microphone assembly
A cavity semiconductor package has a pre-molded leadframe construction. The leadframe is formed by molding around a die pad, and plural terminal lands. The leadframe has a hole for an acoustic...
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7547583 |
Light emitting diode package with direct leadframe heat dissipation
A packaged circuit and method for packaging an integrated circuit are disclosed. The packaged circuit has a lead frame, an integrated circuit chip, and an encapsulating layer. The lead frame has...
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7547582 |
Method of fabricating a surface adapting cap with integral adapting material for single and multi chip assemblies
A surface adapting cap with an integrated adapting thermally conductive material on single and multi chip module provides reduced gap tolerance and hence better thermal performance of the...
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7547581 |
Manufacturing method of a semiconductor device to suppress generation of whiskers
It is suppressed that a whisker occurs on a lead for external connection. A lead for external connection is formed of the alloy (42Alloy) of Fe and Ni, and a plating film which includes alloy of...
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7541278 |
Interconnect substrate, semiconductor device, methods of manufacturing the same, circuit board, and electronic equipment
A first conductive layer is formed. An insulating layer is formed so that at least a part of the insulating layer is disposed on the first conductive layer. A second conductive layer is formed so...
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7541221 |
Integrated circuit package system with leadfinger support
An integrated circuit package system including forming a leadframe having a lead with a leadfinger support of a predetermined height, and attaching an integrated circuit die with an electrical...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7537965 |
Manufacturing method for a leadless multi-chip electronic module
A leadless multi-chip electronic module with leadframe bond pads is manufactured in a manner to place small signal bond pads in a central region of the module for significantly increased...
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7537958 |
High performance multi-chip flip chip package
A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of...
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7535086 |
Integrated circuit package-on-package stacking system
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and...
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7534661 |
Method of forming molded resin semiconductor device
A semiconductor chip and a wiring strip are placed on a flat side of a base sheet. The semiconductor chip has parallel first and second surfaces. Electrodes are connected to the first surface. The...
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7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer
A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type...
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7528013 |
Method for fabricating high performance leadframe in electronic package
Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current...
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7525184 |
Semiconductor device and its manufacturing method
There are constituted by a tab ( 1 b ) on which a semiconductor chip ( 2 ) is mounted, a sealing portion ( 3 ) formed by resin-sealing the semiconductor chip ( 2 ), a plurality of leads ( 1 a )...
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7524701 |
Chip-scale package
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
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7524696 |
Sensor including lead frame and method of forming sensor including lead frame
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
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7521295 |
Leadframe and method of manufacturing the same
A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not...
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7521294 |
Lead frame for semiconductor package
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting...
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7521290 |
Method of manufacturing circuit device
The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having...
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7521276 |
Compliant terminal mountings with vented spaces and methods
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
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7517733 |
Leadframe design for QFN package with top terminal leads
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top...
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7517732 |
Thin semiconductor device package
A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material...
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7514297 |
Methods for a multiple die integrated circuit package
Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and...
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7514296 |
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes preparing a wiring board including a base board having a first surface and a second surface, a wiring pattern having a plurality of...
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