AcclaimIP-ad

Match Document Document Title
9040358 Semiconductor device and method for manufacturing the same  
A semiconductor device permitting the reduction of cost is disclosed. In a semiconductor package wherein electrode pads of a semiconductor chip and corresponding inner leads are electrically...
9041172 Semiconductor device for restraining creep-age phenomenon and fabricating method thereof  
The present invention relates generally to a semiconductor device and, more specifically, to optimizing the creep-age distance of the power semiconductor device and a preparation method thereof....
9040356 Semiconductor including cup-shaped leadframe packaging techniques  
A semiconductor package includes a leadframe which is cup-shaped and holds a semiconductor die. The leadframe is in electrical contact with a terminal on one side of the die, and the leads of the...
9040357 Semiconductor packaging method using connecting plate for internal connection  
A semiconductor package with connecting plate for internal connection comprise: a plurality of chips each having a plurality of contact areas on a top surface; one or more connecting plates having...
9035468 Copper post structure for wafer level chip scale package  
In a method for forming a packaging structure, a metal pad is formed on a semiconductor substrate, and a first polymer insulating layer is formed over the semiconductor substrate. An opening...
9035439 Apparatus, system and method for use in mounting electronic elements  
The present embodiments provide surface mount devices and/or systems. In some embodiments, the surface mount devices comprise a casing having a recess formed extending at least partially into said...
9034697 Apparatus and methods for quad flat no lead packaging  
A method for fabricating a semiconductor package is disclosed that includes providing a supply of lead elements, mounting a plurality of the lead elements on a lead frame until a predetermined...
9029202 Method of forming a high thermal conducting semiconductor device package  
A semiconductor device package (100) includes a heat spreader (503) formed by depositing a first thin film layer (301) of a first metal on a top surface (150) of a die (110) and to exposed...
9029195 Leadframe, semiconductor device, and method of manufacturing the same  
A method of manufacturing a semiconductor device includes mounting at least one of a first semiconductor chip and a second semiconductor chip over a die pad of a leadframe, and inspecting a...
9029991 Semiconductor packages with reduced solder voiding  
An example semiconductor package with reduced solder voiding is described, which has a leadframe having an I/O pad and a thermal pad, a fabricated semiconductor die having a bond pad, where the...
9029194 Making an integrated circuit module with dual leadframes  
A method of making an integrated circuit module starts with a top leadframe strip comprising a plurality of integrally connected top leadframes. A plurality of flipchip dies are mounted on the top...
9024421 Connection arrangement for semiconductor power modules  
A semiconductor power module includes at least two sub modules. The sub modules include at least one respective transistor having a collector, an emitter, and a gate. The module includes a...
9023690 Leadframe area array packaging technology  
Embodiments of the present invention are directed to leadframe area array packaging technology for fabricating an area array of I/O contacts. A manufactured package includes a polymer material...
9018035 Pressed-contact type semiconductor device and method for manufacturing the same  
A pressed-contact type semiconductor device includes a power semiconductor element, on an upper surface of which at least a first electrode is formed and on a lower surface of which at least a...
9018744 Semiconductor device having a clip contact  
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main surface opposite to the first main...
9018745 Method for manufacturing semiconductor device, and semiconductor device  
A method according to the invention has a bonding process of mounting a semiconductor chip on an upper surface of a die pad that has the upper surface whose area is larger than a reverse side of...
9012268 Leadless packages and method of manufacturing same  
Embodiments of the present disclosure are directed to leadframe strips and methods of forming packages that include first separating adjacent leads of a leadframe strip and subsequently...
9012267 Method of manufacturing a packaged circuit including a lead frame and a laminate substrate  
Embodiments of the subject application provide for a circuit comprising: a lead frame having a first plurality of exposed terminals, the lead frame defining a plane; a laminate substrate in the...
9006896 Chip package and method for forming the same  
An embodiment of the invention provides a chip package which includes: a semiconductor substrate having a first surface and a second surface; a device region formed in the semiconductor substrate;...
9006038 Selective leadframe planishing  
A method for fabricating a leadframe strip is disclosed. A leadframe pattern is formed from flat sheet of base metal. Additional metal layers are plated on patterned tape of base metal and the...
9006039 Fabrication method of packaging substrate, and fabrication method of semiconductor package  
A fabrication method of a packaging substrate includes: providing a metal board having a first surface and a second surface opposite to the first surface, wherein the first surface has a plurality...
8999761 Method of manufacturing semiconductor device  
To stably remove a resin body formed in a supply route of a resin in a sealing step. A leadframe has, in a sub-runner portion thereof, a sub-through-hole. The sub-through-hole has, along a first...
8993376 Semiconductor device and method of forming wafer-level multi-row etched leadframe with base leads and embedded semiconductor die  
A semiconductor device has a base substrate with first and second opposing surfaces. A plurality of cavities and base leads between the cavities is formed in the first surface of the base...
8993381 Method for forming a thin semiconductor device  
A method for forming a thin semiconductor device is disclosed. In one embodiment, a lead frame is provided over a carrier. At least one semiconductor chip is provided on the lead frame and the at...
8994156 Semiconductor device packages with solder joint enhancement elements  
Electronic devices including a semiconductor device package, a substrate, and first and second solder joints. The semiconductor device package includes a die pad, leads and enhancement elements...
8987875 Balanced stress assembly for semiconductor devices  
An assembly for packaging one or more electronic devices in die form. The assembly includes substrates on opposite sides of the assembly, with lead frames between the electronic devices and the...
8987064 Integrated circuit packaging system with molded grid-array mechanism and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a lead-frame having a metal connector mounted thereon and having a peripheral mounting region; forming an...
8987879 Semiconductor device including a contact clip having protrusions and manufacturing thereof  
A semiconductor device includes a leadframe with a die pad and a first lead, a semiconductor chip with a first electrode, and a contact clip with a first contact area and a second contact area....
8987063 Manufacturing method of semiconductor device  
A manufacturing method of a semiconductor device of a thin resin sealed multichip rectangular package having wire connection between the chips, wherein: at least one chip is fixed to a die pad...
8987882 Semiconductor device  
A semiconductor device is reduced in size. The semiconductor device includes a die pad, a plurality of leads arranged around the die pad, a memory chip and a power source IC chip mounted over the...
8987883 Semiconductor package with multiple conductive clips  
One exemplary disclosed embodiment comprises a high power semiconductor package configured as a buck converter having a control transistor and a sync transistor disposed on a common leadframe pad,...
8981578 Sensor array package  
A sensor array package can include a sensor disposed on a first side of a substrate. Signal trenches can be formed along the edges of the substrate and a conductive layer can be deposited in the...
8980687 Semiconductor device and method of manufacturing thereof  
A method of manufacturing a semiconductor device includes providing a transfer foil. A plurality of semiconductor chips is placed on and adhered to the transfer foil. The plurality of...
8975117 Semiconductor device using diffusion soldering  
A method includes providing a semiconductor chip having a first main surface and a second main surface. A semiconductor chip is placed on a carrier with the first main surface of the semiconductor...
8975119 Manufacturing method of semiconductor device  
A manufacturing yield of a semiconductor device including a power transistor is improved. When forming a tip portion LE1c of a first lead, a tip portion LE2c of a second lead, and a tip portion...
8975118 Component having a via and method for manufacturing it  
An advantageous method and system for realizing electrically very reliable and mechanically extremely stable vias for components whose functionality is realized in a layer construction on a...
8970019 Semiconductor device with sealed semiconductor chip  
A semiconductor device includes a semiconductor chip with bonding pads, the bonding pads being arranged along one side of an element forming surface of the semiconductor chip, a lead frame...
8969139 Lead frame array package with flip chip die attach  
A small form factor near chip scale package is provided that includes input/output contacts not only along the periphery of the package, but also along the package bottom area. Embodiments provide...
8969136 Integrated circuit packaging system for electromagnetic interference shielding and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: providing a lead frame having a die attach paddle pad and a peripheral lead pad with an inner lead pad between the die...
8969135 Semiconductor device and method of assembling same  
A semiconductor device includes a lead frame having a down bond area, a die attach area and a dam formed between the down bond area and the die attach area. A bottom of the dam is attached on a...
8969137 Solder flow-impeding plug on a lead frame  
Embodiments described herein relate to a method of manufacturing a packaged circuit having a solder flow-impeding plug on a lead frame. The method includes partially etching an internal surface of...
8969138 Semiconductor device and a method of manufacturing the same and a mounting structure of a semiconductor device  
The semiconductor device includes a tab including a chip supporting surface, and a back surface opposite to the chip supporting surface; a plurality of suspension leads supporting the tab; a...
8962389 Microelectronic packages including patterned die attach material and methods for the fabrication thereof  
Embodiments of microelectronic packages and methods for fabricating microelectronic packages are provided. In one embodiment, the fabrication method includes printing a patterned die attach...
8963301 Integrated circuit package and method of making the same  
Packages for an integrated circuit die and methods and lead frames for making such packages are disclosed. The package includes a die, a die pad, peripheral metal contacts, bond wares, and an...
8962395 QFN package and manufacturing process thereof  
The present invention provides a Quad Flat Non-leaded (QFN) package, which comprises a chip, a lead frame, a plurality of composite bumps and an encapsulant. The chip has a plurality of pads, and...
8956920 Leadframe for integrated circuit die packaging in a molded package and a method for preparing such a leadframe  
Embodiments of a method for preparing a leadframe for integrated circuit (IC) die packaging in a molded package with an exposed die pad are disclosed. In one embodiment, a method involves...
8957510 Using an integrated circuit die configuration for package height reduction  
A semiconductor device includes a semiconductor die having a first major surface and a second major surface opposite the first major surface, a first minor surface and a second minor surface...
8957509 Integrated circuit packaging system with thermal emission and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a lead array having an innermost space with an innermost lead having an inner lead profile different around an...
8956918 Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrier  
A method for manufacturing a chip arrangement in accordance with various embodiments may include: placing a chip on a carrier within an opening of a metal structure disposed over the carrier;...
8957531 Flat laminate, symmetrical test structures and method of use to gauge white bump sensitivity  
A symmetrical, flat laminate structure used to minimize variables in a test structure to experimentally gauge white bump sensitivity to CTE mismatch is disclosed. The test structure includes a...