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7425756 |
Semiconductor device and electronic device
This invention provides a high frequency power module which is incorporated into a mobile phone and which incorporates high frequency portion analogue signal processing ICs including low noise...
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7416630 |
Fabrication of LTCC T/R modules with multiple cavities and an integrated ceramic ring frame
A method of fabricating a transmit/receive (T/R) module utilizing low temperature co-fired ceramic (LTCC) material in place of high temperature co-fired ceramic (HTCC) material and utilizing a...
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7414303 |
Lead on chip semiconductor package
The present invention provides an LOC package wherein the lead frame is in direct contact with the semiconductor device. The lead frame, which includes openings, is positioned directly on the...
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7413933 |
Integrated circuit package with leadframe locked encapsulation and method of manufacture therefor
A semiconductor including a leadframe having a die attach paddle and a number of leads is provided. The die attach paddle has a recess to provide a number of mold dams around the periphery of the...
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7413934 |
Leadframes for improved moisture reliability and enhanced solderability of semiconductor devices
A semiconductor device has a leadframe with a structure made of a base metal ( 105 ), wherein the structure consists of a chip mount pad ( 302 ) and a plurality of lead segments ( 303 ). Covering...
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7410833 |
Interconnections for flip-chip using lead-free solders and having reaction barrier layers
An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting composition including an...
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7410829 |
Method of fabricating a semiconductor chip package
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes...
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7410835 |
Method for fabricating semiconductor package with short-prevented lead frame
A short-prevented lead frame and a method for fabricating a semiconductor package with the lead frame are proposed, wherein each lead of the lead frame is formed with a thickness-reduced portion at...
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7411280 |
Chip support of a leadframe for an integrated circuit package
The central region of a leadframe ( 101, 201, 301, 401, 501, 601, 701, 801, 901, 1001, 1101, 1201 ), is selectively etched to leave upright portions ( 104, 204, 304, 404, 504, 604, 704, 804, 904,...
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7410834 |
Method of manufacturing a semiconductor device
A semiconductor device improved in packaging reliability is disclosed. Each of leads used in the semiconductor device has a first surface positioned between a main surface of a resin sealing body...
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7407835 |
Localized slots for stress relieve in copper
In accordance with the objectives of the invention a new method is provided for the creation of interconnect metal. Current industry practice is to uniformly add slots to wide and long copper...
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7408248 |
Lead frame for semiconductor device
A lead frame for semiconductor device is provided with an inner lead part and an outer lead part. A composite plating layer is provided on the entire plane of a base material constituting the lead...
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7405468 |
Plastic package and method of fabricating the same
A plastic package includes a plurality of terminal members each having an outer terminal, an inner terminal, and a connecting part connecting the outer and the inner terminal; a semiconductor...
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7405467 |
Power module package structure
A power module package structure is disclosed. The control circuits are fabricated on a circuit plate, instead of fabricating them directly on a main substrate. The fabrication cost is reduced...
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7405487 |
Method and apparatus for removing encapsulating material from a packaged microelectronic device
A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a...
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7405104 |
Lead frame and method of producing the same, and resin-encapsulated semiconductor device and method of producing the same
A resin-encapsulated semiconductor device includes a semiconductor chip, a plurality of inner leads that are connected to a group of electrodes of the semiconductor chip, respectively, and an...
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7405107 |
Semiconductor device, method and apparatus for fabricating the same
A semiconductor device has at least one semiconductor element, at least one radiator plate thermally connected with said semiconductor element, and a molded resin covering and sealing said...
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7405469 |
Semiconductor device and method of manufacturing the same
A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a...
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7402459 |
Quad flat no-lead (QFN) chip package assembly apparatus and method
In one embodiment the present invention includes a method of fabricating a quad flat no-lead (QFN) chip package. The method includes forming a stamped lead frame; forming a die pad and a lead...
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7402462 |
Folded frame carrier for MOSFET BGA
A folded frame carrier has a die attach pad (DAP) 30 and one or more folded edges 32, 33, 34, 35 . Each folded edge has one or more studs 36 and each stud has a trapezoidal tip. The folded...
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7391101 |
Semiconductor pressure sensor
A semiconductor pressure sensor can reduce the damage of bonding wires to increase their life time even under an environment in which the temperature and pressure change rapidly and radically. The...
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7390698 |
Packaged semiconductor device and method of manufacture using shaped die
A semiconductor packaging technique provides for a semiconductor device with improved electrical and thermal performance. According to one embodiment of the invention, die edges are shaped before...
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7387916 |
Sharp corner lead frame
An integrated circuit package lead frame, comprising a plurality of leads and a spine electrically connected to said plurality of leads, said spine comprising indentations between a pair of said...
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7381593 |
Method and apparatus for stacked die packaging
A method and apparatus for stacked die packaging provide a leadframe configured for supporting a lower semiconductor die. At least one pillar is formed on the leadframe for supporting an upper...
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7378299 |
Leadless semiconductor package and manufacturing method thereof
A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of...
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7374973 |
Manufacturing method of semiconductor device and manufacturing method of lead frame
Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160...
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7371616 |
Clipless and wireless semiconductor die package and method for making the same
A method for making a semiconductor die package is disclosed. In some embodiments, the method includes using a leadframe structure including at least one lead structure having a lead surface. A...
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7372133 |
Microelectronic package having a stiffening element and method of making same
A method of forming a leadframe package, a leadframe package formed according to the method, and a system incorporating the leadframe package. The leadframe package includes: a metallization layer...
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7368807 |
Low cost method to produce high volume lead frames
A method ( 300 ) for fabricating a lead frame ( 100 ), comprising forming a plurality of external leads ( 122 ) in a lead frame material ( 108 ), plating a metal ( 222 ) on all surfaces of the lead...
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7368806 |
Flip chip package with anti-floating structure
A flip chip package with an anti-floating structure includes a leadframe, a flip chip, and a plurality of solders. The leadframe includes a plurality of leads and a fastening part. At least one...
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7368328 |
Semiconductor device having post-mold nickel/palladium/gold plated leads
A semiconductor device having a leadframe comprised of a base metal ( 110 , e.g., copper), a chip mount pad ( 103 ) and a plurality of lead segments ( 104 ). Each of the segments has a first end (...
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7368326 |
Methods and apparatus to reduce growth formations on plated conductive leads
A process includes annealing one or more plated conductive leads at a predetermined temperature. The one or more plated conductive leads are plated with one or more layers, where each layer...
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7368329 |
Diode housing
A housing accommodating a semiconductor chip is set out. The housing and chip may be used for sending and/or receiving radiation. Popular applications of the housing may be in light emitting...
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7364947 |
Method for cutting lead terminal of package type electronic component
In an electronic component comprising a semiconductor chip packaged in a molded part from which the lead terminals of the semiconductor chip project, a main cutting notch is formed on the obverse...
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7364948 |
Method for fabricating semiconductor package
A semiconductor package and a fabrication method thereof are proposed. A lead frame is provided between a chip and a substrate in a window ball grid array semiconductor package, wherein an active...
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7364950 |
Semiconductor device and method of manufacturing the same
A semiconductor device is provided including a semiconductor element having a plurality of electrodes, a plurality of bonding portions of a lead frame, a plate-like current path material which...
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7361533 |
Stacked embedded leadframe
A method of forming a stackable embedded leadframe package includes coupling an electronic component having bond pads to a substrate; coupling on the substrate a leadframe having a plurality of...
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7361531 |
Methods and apparatus for Flip-Chip-On-Lead semiconductor package
Fabrication of a semiconductor package includes placing a conductive material on a protrusion from a leadframe to form a first assembly, forming a non-conductive mask about the protrusion, and...
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7354804 |
Method for fabricating lead frame and method of fabricating semiconductor device using the same
A method of fabricating a lead frame for a semiconductor device. The lead frame has a lead electrically connected to a semiconductor chip within sealing resin and sealed into the sealing resin such...
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7344968 |
Semiconductor chip having pads with plural junctions for different assembly methods
Development efficiency and mass production efficiency of a semiconductor chip (LSI) is improved, whereby the LSI on which an integrated circuit is formed has plural pad parts connecting the...
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7344920 |
Integrated circuit package and method for fabricating same
A process for fabricating an integrated circuit package includes: selectively etching a first side of a substrate thereby providing etched regions of the substrate to partially define at least a...
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7344921 |
Integrated circuit device having reduced bow and method for making same
An integrated circuit device includes a semiconductor component coupled with a lead frame, and an integrated circuit package encompassing at least a portion of the semiconductor component. The...
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7344917 |
Method for packaging a semiconductor device
A method for packaging a semiconductor device includes forming through holes ( 12 ) in a base substrate ( 10 ) and depositing a conductive material ( 14 ) on a first side ( 16 ) of the base...
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7341889 |
Lead frame for semiconductor package and method of fabricating semiconductor package
Provided is a method for fabricating a semiconductor package with a lead frame and the semiconductor package provided thereof. The method includes supplying a lead frame with a plurality of molding...
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7341890 |
Circuit board with built-in electronic component and method for manufacturing the same
A circuit board with an built-in electronic component according to the present invention includes an insulating layer, a first wiring pattern provided on a first main surface of the insulating...
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7339262 |
Tape circuit substrate and semiconductor apparatus employing the same
A tape circuit substrate and semiconductor apparatus employing the same, and a method for forming a tape circuit substrate may reduce or eliminate electromagnetic interference (EMI) and provide a...
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7339261 |
Semiconductor device
A semiconductor device which permits reduction in the number of pins and in size thereof is provided. The semiconductor device comprises a sealing body formed of an insulating resin, the sealing...
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7338838 |
Resin-encapsulation semiconductor device and method for fabricating the same
A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads...
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7338841 |
Leadframe with encapsulant guide and method for the fabrication thereof
A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant...
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7335534 |
Semiconductor component and method of manufacture
A semiconductor component having a semiconductor chip mounted on a packaging substrate and a method for manufacturing the semiconductor component that uses batch processing steps for fabricating...
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