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7537965 |
Manufacturing method for a leadless multi-chip electronic module
A leadless multi-chip electronic module with leadframe bond pads is manufactured in a manner to place small signal bond pads in a central region of the module for significantly increased...
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7537958 |
High performance multi-chip flip chip package
A structure and method of manufacture for an improved multi-chip semiconductor package that reduces package resistance to a negligible level, and offers superior thermal performance. Housing of...
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7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer
A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type...
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7535086 |
Integrated circuit package-on-package stacking system
An integrated circuit package-on-package stacking system is provided including, forming a leadframe interposer including: forming a leadframe; forming a molded base on the leadframe; and...
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7534661 |
Method of forming molded resin semiconductor device
A semiconductor chip and a wiring strip are placed on a flat side of a base sheet. The semiconductor chip has parallel first and second surfaces. Electrodes are connected to the first surface. The...
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7528013 |
Method for fabricating high performance leadframe in electronic package
Systems and techniques to provide a high performance leadframe architecture in electronic packages. An electronic package includes an extended area for wire bonding to provide improved high-current...
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7524701 |
Chip-scale package
A method for manufacturing a semiconductor package that includes forming a frame inside a conductive can, the frame being unwettable by liquid solder.
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7524696 |
Sensor including lead frame and method of forming sensor including lead frame
A sensor includes a plurality of leads that have bottom surfaces extending in a first plane, a stage that extends in a second plane that tilts from the first plane, a sensor chip that is supported...
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7525184 |
Semiconductor device and its manufacturing method
There are constituted by a tab ( 1 b ) on which a semiconductor chip ( 2 ) is mounted, a sealing portion ( 3 ) formed by resin-sealing the semiconductor chip ( 2 ), a plurality of leads ( 1 a )...
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7521295 |
Leadframe and method of manufacturing the same
A leadframe is plated with palladium only to a surface of a metal plate on which semiconductors elements are to be mounted and a surface of the metal plate to be placed on a substrate, and is not...
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7521276 |
Compliant terminal mountings with vented spaces and methods
A method of making chip assemblies includes providing an in-process assembly including a semiconductor wafer, a wafer compliant structure overlying a front surface of the wafer and cavities, and...
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7521294 |
Lead frame for semiconductor package
A semiconductor package including a lead frame comprising a frame including both a ground ring and a chip mounting board located therein. Extending between the ground ring and the chip mounting...
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7521290 |
Method of manufacturing circuit device
The method of the present invention includes a first step of preparing a substrate in which a plurality of circuit boards are integrally connected to one another, each of the circuit boards having...
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7517732 |
Thin semiconductor device package
A thin semiconductor device package, comprising a thin substrate, at least one thin die coupled with the substrate and having a perimeter dimension less than that of the substrate, a mold material...
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7517733 |
Leadframe design for QFN package with top terminal leads
A semiconductor package includes a leadframe. A first lead finger has a lower portion, a connecting portion extending vertically upward from the lower portion, and a substantially flat, top...
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7514296 |
Method for manufacturing semiconductor device
A method for manufacturing a semiconductor device includes preparing a wiring board including a base board having a first surface and a second surface, a wiring pattern having a plurality of...
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7514297 |
Methods for a multiple die integrated circuit package
Methods for a multiple die package for integrated circuits are disclosed. An insulator layer is provided and one or more vias are formed within it. The insulator may be provided without vias, and...
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7507606 |
Semiconductor device and method of manufacturing the same
As a means for promoting the increase of the number of pins in a QFN (Quad Non-leaded package), a semiconductor die mounted on a die pad is arranged at the center of a plastic package, and a...
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7507605 |
Low cost lead-free preplated leadframe having improved adhesion and solderability
A leadframe with a structure made of a base metal ( 105 ), wherein the structure has a plurality of surfaces. On each of these surfaces are metal layers in a stack adherent to the base metal. The...
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7508054 |
Semiconductor device and a method of manufacturing the same
Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a...
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7504712 |
Electronic device with selective nickel palladium gold plated leadframe and method of making the same
An electronic device comprises a leadframe attached to a die and embedded in a mold packaging with enhanced adhesion property. The leadframe comprises a bonding surface, a soldering surface, a mold...
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7504714 |
Chip package with asymmetric molding
A chip package with asymmetric molding including a lead frame, a chip, an adhesive layer, bonding wires and an encapsulant, is provided. The lead frame includes a frame body and at least a...
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7504281 |
Substrate based unmolded package
A semiconductor die package is disclosed. In one embodiment, the semiconductor die package has a substrate. It includes (i) a lead frame structure including a die attach region with a die attach...
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7501313 |
Method of making semiconductor BGA package having a segmented voltage plane
A semiconductor device assembly and method of making the device are disclosed. The assembly comprises a semiconductor die attached to an electrically conductive layer, which is, in turn, connected...
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7498665 |
Integrated circuit leadless package system
An integrated circuit leadless package system is presented comprising forming a QFN leadframe comprises providing a die pad, forming a fishtail tie-bar on the die pad, forming a row of an outer...
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7495323 |
Semiconductor package structure having multiple heat dissipation paths and method of manufacture
In one embodiment, a semiconductor package structure includes a conductive bridge having coupling portions on opposing ends. A lead frame includes alignment or receiving features for receiving the...
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7494838 |
Manufacturing method for magnetic sensor and lead frame therefor
A magnetic sensor is constituted using magnetic sensor chips mounted on stages supported by interconnecting members and a frame having leads in a lead frame. Herein, the stages are inclined upon...
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7492037 |
Package structure and lead frame using the same
A package structure and a lead frame using the same are provided. The package structure includes a lead frame, a chip and an adhesive. The lead frame has a first surface and a second surface...
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7488623 |
Integrated circuit chip packaging assembly
An integrated circuit chip packaging assembly having a first and second package side. An integrated circuit chip has a substrate side and an active circuit side. The chip includes integrated...
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7489021 |
Lead frame with included passive devices
An semiconductor device package ( 10 ) includes a semiconductor device (die) ( 12 ) and passive devices ( 14 ) electrically connected to a common lead frame ( 17 ). The lead frame ( 17 ) is formed...
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7488622 |
Method for producing a surface-mountable semiconductor component
Presented is a method for simultaneously producing a multiplicity of surface-mountable semiconductor components each having at least one semiconductor chip, at least two external electrical...
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7489043 |
Semiconductor chip package and fabrication method thereof
A semiconductor chip package includes a first semiconductor chip, that is an MEMS chip having a movable structure. The movable structure has a movable section. The first semiconductor chip includes...
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7485498 |
Space-efficient package for laterally conducting device
Efficient utilization of space in a laterally-conducting semiconductor device package is enhanced by creating at least one supplemental downbond pad portion of the diepad for receiving the downbond...
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7479410 |
Hybrid-orientation technology buried n-well design
A semiconductor structure is provided that includes a hybrid orientated substrate having at least two coplanar surfaces of different surface crystal orientations, wherein one of the coplanar...
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7479412 |
Adhesive film for semiconductor, lead frame and semiconductor device using the same, and method of producing semiconductor device
An adhesive film for semiconductor, which comprises at least one resin layer, and, after bonded to a lead frame, has at 25° C. a 90°-peel strength of at least 5 N/m between the resin layer and...
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7479409 |
Integrated circuit package with elevated edge leadframe
An integrated circuit package system includes an elevated edge leadframe array, isolating leadframes of the elevated edge leadframe array, validating integrated circuit die attached to the...
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7473584 |
Method for fabricating a fan-in leadframe semiconductor package
A semiconductor package comprising a plurality of elongate leads which each have opposed inner and outer ends, opposed first and second surfaces, and a third surface which is disposed in opposed...
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7465607 |
Methods of fabrication of lead frame-based semiconductor device packages incorporating at least one land grid array package
Methods of fabrication of lead frame-based semiconductor device packages including at least one land grid array package. At least one semiconductor die is mounted to an interposer substrate, with...
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7462926 |
Leadframe comprising tin plating or an intermetallic layer formed therefrom
A method of producing a leadframe is provided, the method including the steps of providing a substrate, plating the substrate with a layer of tin, plating a layer of nickel over the layer of tin,...
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7462512 |
Floating gate field effect transistors for chemical and/or biological sensing
Specific ionic interactions with a sensing material that is electrically coupled with the floating gate of a floating gate-based ion sensitive field effect transistor (FGISFET) may be used to sense...
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7459345 |
Packaging method for an electronic element
A packaging method for an electronic element has: etching portions of a top surface of a metal board to form recesses between raised unetched segments and filling the recesses with a dielectric...
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7459347 |
Manufacturing method of a semiconductor device
A non-leaded resin-sealed semiconductor device is manufactured by the steps of providing a conductive flat substrate (metal plate) of copper plate or the like, fixing semiconductor elements...
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7456494 |
Surface mount electronic component and process for manufacturing same
A surface mount electronic component includes a set of a first lead terminal 2 a and a second lead terminal 3 b , a semiconductor element 6 a die-bonded to an island portion 4 a integrally...
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7449370 |
Production process for manufacturing such semiconductor package
In a semiconductor package including at least one plate-like mount, a semiconductor chip has at least one electrode formed on a top surface thereof, and is mounted on the plate-like mount such that...
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7446396 |
Stacked integrated circuit leadframe package system
A stacked integrated circuit leadframe package system including forming a leadframe, packaging a top integrated circuit on a one side of the leadframe, packaging a bottom integrated circuit on an...
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7445967 |
Method of packaging a semiconductor die and package thereof
A method of packaging a semiconductor die includes the steps of providing a flange ( 110 ), coupling one or more active die ( 341 ) to the flange with a lead-free die attach material ( 350 ),...
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7442582 |
Method for producing a chip-substrate connection
A method and an apparatus for producing a chip-substrate connection by alloying or brazing, using a solder containing two or more components with at least two metal-containing constituents X and Y....
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7439097 |
Taped lead frames and methods of making and using the same in semiconductor packaging
The invention provides a taped lead frame for use in manufacturing electronic packages. The taped lead frame is composed of a tape and a lead frame formed from a plurality of individual metal...
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7439100 |
Encapsulated chip scale package having flip-chip on lead frame structure and method
In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable...
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7434310 |
Process to reform a plastic packaged integrated circuit die
A process for reforming a plastic packaged integrated circuit die ( 100 ) includes grinding away ( 305 ) a bottom side ( 210 ) of a plastic package ( 205 ) and portions of a set of leads ( 110 )...
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