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6544817 |
Method for sawing a moulded leadframe package
The present invention relates to a new method for sawing a moulded leadframe package ( 1 ) into individual integrated circuits ( 11 ). In the present invention sawing of the moulded leadframe...
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6541307 |
Multimedia chip package
A substrate unit has a first surface and a corresponding second surface, and a plurality of nodes and at least a die pad are formed on the first surface of the substrate unit. A plurality of...
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6541702 |
Semiconductor device
In order to suppress defective lead forming and defective mounting, a semiconductor device includes a sealing body which has a square planar shape, a semiconductor chip which lies within the...
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6541306 |
Resin-sealed semiconductor device and method of manufacturing the device
A resin-sealed semiconductor device according to this invention is an LOC type semiconductor device comprising a semiconductor chip having a circuit surface on which an electrode is formed; a lead...
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6540927 |
Semiconductor packaging part and method producing the same
A semiconductor packaging part and a method of forming the part by applying a minute plating with a high positional accuracy to a semiconductor chip to be packaged. A pair of alignment holes 2, 3 ...
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6541311 |
Method of positioning a component mounted on a lead frame in a test socket
A lead frame is configured with conductor leads, a dam bar and an extension between the conductor leads. The extension projects from the dam bar toward a central region of the lead frame. An...
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6537856 |
Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned...
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6534343 |
Method of making electrically isolated power semiconductor package
A packaged power semiconductor device ( 24 ) with voltage isolation between a metal backside ( 34 ) and the terminals ( 38 ) of the device. A direct-bonded copper (“DBC”) substrate ( 28 ) is...
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6531342 |
Method for transverse hybrid loc package
A hybrid semiconductor package is formed from a die having two opposed elongate die edges with conductive bond pads arranged transversely relative to the rows of outer leads. A first portion of...
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6531341 |
Method of fabricating a microelectronic device package with an integral window
A method of fabricating a microelectronic device package with an integral window for providing optical access through an aperture in the package. The package is made of a multilayered insulating...
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6531335 |
Interposers including upwardly protruding dams, semiconductor device assemblies including the interposers, and methods
A dam for substantially laterally confining a quantity of encapsulant material over a region of a substrate, such as an interposer. The dam is configured to protrude upwardly from a surface of the...
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6531334 |
Method for fabricating hollow package with a solid-state image device
A hollow package includes a package body composed of an epoxy resin having a low thermal coefficient of linear expansion, wherein the package body includes a recess for receiving an electronic...
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6531336 |
Semiconductor apparatus, method of fabricating thereof, fabricating apparatus, circuit board, and electronic device
Thermal oxidation of lead frames is provided to thereby improve the adhesion with resin. The method includes the steps of disposing a lead frame having die pads on which semiconductor chips are...
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6528353 |
Chip stack-type semiconductor package and method for fabricating the same
Chip stack type semiconductor package and method for fabricating the same, the package including a lower chip having a center pad formation surface defined at a bottom thereof, an upper chip...
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6525411 |
Semiconductor package and method of fabricating the same
A semiconductor package includes a semiconductor package substrate having a frame type insulator which has a penetrating portion in a center portion of the substrate and a plurality of lead bars...
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6525406 |
Semiconductor device having increased moisture path and increased solder joint strength
Disclosed is a semiconductor package and a method for manufacturing the same. A planar or substantially planar die pad is disposed within a leadframe and is connected to the leadframe by a...
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6521484 |
Mold injection method for semiconductor device
The present invention provides a mold injection method for semiconductor device by which the problem of residual metal is overcome. The inventive method comprises following steps: die attaching;...
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6521482 |
Manufacturing method for a semiconductor device
A method of manufacturing individual semiconductor devices by forming island sections 26 on the surface of a common substrate 21 , forming electrodes 27 and 28 one on either side of each...
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6518099 |
Plated leadframes with cantilevered leads
A metal frame patterned by die stamping has the outermost end portion of each patterned pin extending freely, without constraints, from a line of metal bridge connections (dam bar). The end face of...
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6512286 |
Semiconductor package with no void in encapsulant and method for fabricating the same
A semiconductor package and a method for fabricating the same are proposed, in which a chip is attached to a die pad formed with an opening in a manner that the chip covers the opening and a...
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6506625 |
Semiconductor package having stacked dice and leadframes and method of fabrication
A semiconductor package, and a method for fabricating the package are provided. The package includes a plastic body, and a pair of stacked semiconductor dice encapsulated in the plastic body, and...
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6506629 |
Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages
An integrated circuit (IC) package includes a package body, such as a transfer molded plastic or preformed ceramic package body, having an IC die positioned therein. A lead frame, such as a...
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6506627 |
Semiconductor device, tab tape for semiconductor device, method of manufacturing the tab tape and method of manufacturing the semiconductor device
A structure of a semiconductor device of a chip scale package structure is provided. In the semiconductor device, the limitation to size reduction due to the bonding tool is small and the bonding...
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6504238 |
Leadframe with elevated small mount pads
A semiconductor device comprising a lead frame that includes a large area mount pad having small elevated pads to which a semiconductor chip is attached. The small mount pads coupled with usage of...
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6500698 |
Method for fabricating a stacked semiconductor chip package
A stacked semiconductor chip package includes: a substrate including a plurality of conductive pads; a first semiconductor chip mounted on the substrate; and electrically connected to the...
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6498051 |
Method of packaging semiconductor device using anisotropic conductive adhesive
A method of mounting a semiconductor device ( 16 ) comprises the steps of disposing an anisotropic conductive adhesive ( 13 ) on the surface of a circuit board ( 17 ), placing the semiconductor...
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6492199 |
Method of manufacturing a semiconductor package with improved cross talk and grounding
A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface...
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6482674 |
Semiconductor package having metal foil die mounting plate
A semiconductor package, and a method for fabricating the package are provided. The package includes a semiconductor die, a lead frame, and a metal foil die mounting plate adapted to mount the die...
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6483178 |
Semiconductor device package structure
A semiconductor device package structure is proposed, which allows the encapsulation body to be highly secured in position to the leads, making the encapsulation body hardly delaminated from the...
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6479326 |
Heat sink for microchip application
The present invention relates to method of forming a chip package that includes a heat management structure that allows for heat rejection away from a chip but that avoids the prior art problems of...
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6479322 |
Semiconductor device with two stacked chips in one resin body and method of producing
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam...
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6479323 |
Method for attaching a lead frame to a heat spreader/heat slug structure
A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the...
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6475833 |
Bumpless flip chip assembly with strips and via-fill
A flip chip assembly, and methods of making the same, including a substrate circuitry having a plurality of via apertures or holes, wherein preformed strips or wires hanging therein and filled...
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6475834 |
Method of manufacturing a semiconductor component and semiconductor component thereof
A method of manufacturing a semiconductor component includes coupling a clip bond ( 230 ) from a semiconductor chip ( 120 ) to a lead frame ( 110 ) and dividing the clip bond into at least first...
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6472250 |
Method for producing a chip module
A method for producing a chip module includes punching a chip carrier to form a chip carrier fixing section and chip carrier contact sections spaced apart from the chip carrier fixing section by...
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6472251 |
Method for integrated circuit packaging
A method of fabricating a microelectronic device package is provided. The method includes a continuous processing mode of microelectronic device packages wherein process steps for fabricating the...
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6465276 |
Power semiconductor package and method for making the same
A power semiconductor die has a drain contact, a source contact, and a gate contact. A lead frame has first, second, and third terminals. A metal sheet has first and second contacting portions and...
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6465278 |
Method and apparatus for delivering electrical power to a semiconductor die
A method and apparatus for delivering electrical power to a semiconductor die is provided in which a metal frame ( 104 ) is applied to the top surface of a semiconductor die. The metal frame...
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6465875 |
Semiconductor device package with plural pad lead frame
A semiconductor device package has a lead frame with four or more die receiving pads. The first pad is large enough to receive two or more of the die, laterally spaced from one another, while the...
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6465279 |
Lead frame and production method thereof, and semiconductor device and fabrication method thereof
A lead frame comprises: outer leads formed by a metal base member; first interconnection film portions formed by a metal plating layer, each of which is disposed inside the outer leads in such a...
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6455348 |
Lead frame, resin-molded semiconductor device, and method for manufacturing the same
A lead frame including signal-connecting leads, a die pad and support leads is provided. A semiconductor chip is bonded to the die pad with an adhesive. The semiconductor chip, electrode pads and...
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6455356 |
Methods for moding a leadframe in plastic integrated circuit devices
Methods for making packages and leadframes are enclosed. The package includes a die, a die pad, leads, bond wires, and an encapsulant. The lower surfaces of the die pad and leads are provided with...
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6451628 |
Method fabricating a semiconductor device with a decreased mounting area
An object of the present invention is to provide a method of manufacturing a semiconductor device which enables a decrease in mounting area on a printed circuit board and an increase in space...
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6451627 |
Semiconductor device and process for manufacturing and packaging a semiconductor device
A process for manufacturing a semiconductor device ( 70 ) using selective plating and etching to form the packaging for such device. A flat sheet ( 20 ) of conductive material is selectively plated...
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6452255 |
Low inductance leadless package
A variety of leadless packaging arrangements and methods of packaging integrated circuits in leadless packages that are arranged to have relatively low inductance are disclosed. In one aspect, a...
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6448107 |
Pin indicator for leadless leadframe packages
Leadframe based packages, such as leadless leadframe packages are described that include an orientation indicator that is integrally formed with the leadframe. In one aspect, the leadframe includes...
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6440779 |
Semiconductor package based on window pad type of leadframe and method of fabricating the same
A new semiconductor packaging technology is proposed for the fabrication of a semiconductor package based on window pad type of leadframe. The proposed semiconductor packaging technology is...
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6440772 |
Bow resistant plastic semiconductor package and method of fabrication
A bow resistant semiconductor package includes a semiconductor die, a leadframe and a plastic body. The plastic body includes a molded inner member encapsulating the die, and a molded outer member...
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6436734 |
Method of making a support circuit for a semiconductor chip assembly
A method of manufacturing a support circuit includes providing a conductive layer with top and bottom surfaces,,providing a top etch mask on the top surface that includes an opening that exposes a...
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6432750 |
Power module package having insulator type heat sink attached to rear surface of lead frame and manufacturing method thereof
A power module package in which a heat sink made of an insulating material is attached directly to a second surface of a lead frame, on which a down set is provided, and exposed to the outside, and...
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