Matches 451 - 500 out of 1066 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >
Match Document Document Title
6664133 Lead frame and method of manufacturing the same  
In a lead frame which comprises lead portions extended from a frame portion toward an inside like a teeth of a comb and each having a top end portion, a center portion, and a base portion connected...
6664135 Method of manufacturing a ball grid array type semiconductor package  
A ball grid array type semiconductor package includes a semiconductor chip formed with bonding pads, an elastomer bonded to the semiconductor chip, a flexible wiring substrate bonded to the...
6664136 Semiconductor device and manufacturing method thereof  
A semiconductor device comprises: a semiconductor chip; a copper series lead frame with no residual of a rustproof film, including a die pad mounted with said semiconductor chip, and a plurality of...
6661525 Method for monitoring the length of constant-wire-length bonds and apparatus therefor  
On a circuit-board intended for constant-wire-length (CWL) bonding, one or more special “test” pairs of bonding pads are provided along with, in each case, a series of markings adjacent the...
6656766 Semiconductor device having chip scale package  
A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is...
6657286 Microelectronic assembly formation with lead displacement  
Leads are connected between first and second elements so that a first end of each lead is connected to the first element and a second end of each lead is connected to the second element. and the...
6656772 Method for bonding inner leads to bond pads without bumps and structures formed  
A method for bonding inner leads of a film substrate such as TAB or COF to bond pads of an IC die without bumps and the structure formed by the method are described. In the method, a base film is...
6649447 Methods for plastic injection molding, with particular applicability in facilitating use of high density lead frames  
A lead frame assembly includes one or more lead frames each defining a plurality of package locations organized in rows and columns. An injection molding system includes a plurality of culls, each...
6650020 Resin-sealed semiconductor device  
The resin-sealed semiconductor device includes a die pad portion, a semiconductor element mounted on the die pad portion and having electrodes, a plurality of lead portions arranged with their...
6649450 Method of producing an integrated circuit and an integrated circuit  
A circuit is described which has a semiconductor component surrounded by a plastic housing and with which contact can be made via conductor tracks. Between each dividing surface of the conductor...
6646339 Thin and heat radiant semiconductor package and method for manufacturing  
A semiconductor package which is improved in thinness and heat radiation and a method for making the same. The package includes a semiconductor chip electrically connected to leads of a leadframe...
6643919 Method of fabricating a semiconductor device package having a core-hollowed portion without causing resin flash on lead frame  
A semiconductor device package fabrication method is proposed, which is used for the fabrication of a semiconductor device package of the type having a core-hollowed portion that is typically used...
6645792 Lead frame and method for fabricating resin-encapsulated semiconductor device  
The lead frame of the present invention is a lead frame used in resin encapsulation of a semiconductor chip using an encapsulation mold that includes a die cavity to be filled with an encapsulation...
6646330 Lead frame for semiconductor device, process for producing the same and semiconductor device using the same  
The present invention relates to a lead frame for semiconductor devices having an outer lead part improved in solder wettability which comprises i. a substrate comprising an alloy comprising at...
6638793 Methodology to pack standard staggered bond input-output buffer into linear input-output buffer  
A new method is provided that allows placing or stacking staggered bond I/O buffers into linear bond I/O buffers. The bond pads are linearly arranged, the interface between the staggered bond pad...
6639308 Near chip size semiconductor package  
A semiconductor package that can fit semiconductor chips of various sizes without having to change the footprint of the carrier package. One aspect of the semiconductor package comprises a...
6638790 Leadframe and method for manufacturing resin-molded semiconductor device  
In a leadframe for an LGA package, a lead member is pressed downward to form a land lead with a half-cut portion and a land portion. The land portion, whose bottom will be a land electrode, is...
6630372 Method for routing die interconnections using intermediate connection elements secured to the die face  
A semiconductor device, such as an integrated circuit die, includes a plurality of bond pads on an active surface thereof electrically connected to internal circuitry of the semiconductor device,...
6627481 Method of manufacturing a semiconductor package with a lead frame having a support structure  
The present invention relates to a method of manufacturing semiconductor packages and products thereof. The method of manufacturing comprises steps of: (a) providing a lead frame which comprises a...
6627982 Electric connection structure for electronic power devices, and method of connection  
On a semiconductor material body housing an electronic device a peripheral region of semiconductor material and at least one pad are initially formed. The peripheral region is connected to a first...
6624582 Method of an apparatus for performing circuit-processing, method of and apparatus for controlling the motion of the circuit-processing performance apparatus, and information storage medium  
A processed object, i.e., a circuit-constituting member is positioned by a member-transferring unit at a given position in a member-waiting portion when plasma starts to be generated in a...
6624007 Method of making leadframe by mechanical processing  
A semiconductor device is fabricated in the following manner. First, semiconductor chips are mounted on a leadframe prepared from an electroconductive strip of a uniform thickness. Then,...
6624006 Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip  
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned...
6620633 Method for testing bumped semiconductor components  
A bumped semiconductor component includes bumped contacts, a semiconductor die having die contacts, and a redistribution circuit having conductors for establishing electrical communication between...
6617197 Multi row leadless leadframe package  
A packaging arrangement is described that utilizes a conductive panel (such as a leadless leadframe) as its base. The conductive panel has a matrix of device areas that each include a plurality of...
6617200 System and method for fabricating a semiconductor device  
The present invention provides a semiconductor device that makes it possible to expose the back side of a die pad as well as a method for fabricating the same. The semiconductor device can include...
6617193 Semiconductor device, semiconductor device substrate, and methods of fabricating the same  
A semiconductor device comprising a substrate with a cavity portion for mounting a semiconductor chip is provided to achieve a high reliability and to decrease a size and a fabricating cost. The...
6617672 Method for producing contact chip cards with a low-cost dielectric  
In a method for manufacturing a contact chip card, a dielectric support film is provided in the form of a strip. A metal grid which defines contact pads on the upper surface thereof and connection...
6610561 Method of fabricating a semiconductor device  
The present invention provides a thin, inexpensive, high-performance semiconductor device provided with busbar leads, power leads and signal leads. A portion of the power lead connected to the...
6608369 Lead frame, semiconductor device and manufacturing method thereof, circuit board and electronic equipment  
The invention provides a highly reliable lead frame, in spite of its structure, in which a bottom surface of a die pad thereof is exposed. The invention also provides a semiconductor device, a...
6607939 Method of making a multi-layer interconnect  
Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good...
6607940 Method of manufacturing semiconductor devices and semiconductor devices made according to the method  
A method of manufacturing semiconductor devices. The method includes the steps of: providing a lead frame assembly having oppositely facing first and second sides; mounting a first semiconductor...
6602735 Method of fabricating a semiconductor chip package with a lead frame and multiple integrated circuit chips  
A lead frame for a semiconductor chip package includes a frame body and at least two chip-receiving windows formed in the frame body. Each chip-receiving window receives a respective integrated...
6602738 Method of manufacturing semiconductor device having tie bars for interconnecting leads  
A semiconductor element is first fixed on a frame. The semiconductor element and a plurality of leads are connected together. The semiconductor element is sealed with molding resin, to thereby...
6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding  
A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages. The method for fabricating an...
6599770 Process for manufacturing an optical device  
An optical device includes a package consisting of a lead frame and a molded resin integrally molded with the lead frame. The package has a cavity in which an optical element is installed. The...
6596549 Automatic wiring method for semiconductor package enabling design of high-speed wiring for semiconductor package with reduced labor  
An automatic wiring method for a semiconductor package includes: a provisional wiring step for sequentially specifying a plurality of lines of the terminals from the innermost periphery to the...
6593665 Protective envelope for a semiconductor integrated circuit  
A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions...
6590283 Method for hermetic leadless device interconnect using a submount  
In accordance with the invention, a semiconductor device having an electrical input/output contact surface is hermetically sealed and provided with connections via a submount such as a two-level...
6579747 Method of making electronics package with specific areas having low coefficient of thermal expansion  
Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a...
6580161 Semiconductor device and method of making the same  
A semiconductor device includes a plurality of conductors 2 A each of which includes a first surface 20 a , a second surface 20 b opposite to the first surface, a thickness defined between...
6573123 Semiconductor chip package and manufacturing method thereof  
A semiconductor chip package generally comprises a lead frame, a semiconductor die and a plastic package body. The lead frame includes a plurality of leads and a window pad. The window pad is...
6569698 Focusing cup on a folded frame for surface mount optoelectric semiconductor package  
A focusing cup is directly glued to two or more preformed folded metal frames. Parts of the top surfaces of the folded metal frames contact the electrodes of semiconductor device placed inside the...
6566168 Semiconductor package having implantable conductive lands and method for manufacturing the same  
A semiconductor package having implantable conductive lands for simplifying the manufacture of the semiconductor package, reducing the manufacturing cost by reducing the price of raw materials and...
6566982 Lead frame set and saw filter using the same  
A lead frame set includes a plurality of lead frames disposed in parallel and each lead frame includes a plurality of leads. Each of the leads includes an inner lead, an intermediate portion, and...
6563202 Lead frame, manufacturing method of a lead frame, semiconductor device, assembling method of a semiconductor device, and electronic apparatus  
Metal films (for instance, gold films or palladium films) to constitute bumps are formed on a metal base by electrolytic plating. Then, a circuit wiring including inner leads is formed by...
6563203 Motor driving device  
In a motor driving device, an IC chip of a drive circuit for driving a motor is die-bonded to one island of a leadframe, and a diode chip of a protection diode for preventing the drive circuit from...
6551858 Method of producing a semiconductor device having two semiconductor chips sealed by a resin  
A semiconductor device according to this invention, wherein two semiconductor chips are sealed by one resin body using two lead frames, includes a wide part extending in the width direction of dam...
6551859 Chip scale and land grid array semiconductor packages  
Techniques for improving the manufacture and structure of leadframe chip scale packages and land grid array packages are described. One aspect of the invention pertains to a method for patterning a...
6548328 Circuit device and manufacturing method of circuit device  
After a trench 54 is formed in a conductive foil 60 , the circuit elements are mounted, and the insulating resin is applied on the conductive foil 60 as the support substrate. After being...
Matches 451 - 500 out of 1066 < 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 >