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7626259 |
Heat sink for a high capacity thin module system
Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and...
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7625781 |
Semiconductor device having a plastic housing and external connections and method for producing the same
A semiconductor device having a plastic housing and external connections, and to a method for producing the same is disclosed. In one embodiment, the plastic housing has a housing external contour...
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7622803 |
Heat sink assembly and related methods for semiconductor vacuum processing systems
An assembly for supporting a substrate during vacuum processing operations includes a thermally conductive heat sink tray including at least one wafer pocket recessed therein, and a thermally...
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7622327 |
Covered devices in a semiconductor package
An embodiment of the present invention is a technique to fabricate a cover assembly. A cover has a base plate and sidewalls attached to perimeter of the base plate. The sidewalls have a height. A...
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7618849 |
Integrated circuit package with etched leadframe for package-on-package interconnects
Methods, systems, and apparatuses for integrated circuit packages, and for package stacking, are provided. An electrically conductive frame is attached to a first surface of a substrate. The...
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7615862 |
Heat dissipating package structure and method for fabricating the same
A heat dissipating package structure includes a chip carrier; a semiconductor chip mounted and electrically connected to the chip carrier; a heat spreader having a first surface, an opposed second...
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7612448 |
Power module having a cooling device and semiconductor devices mounted on a resin substrate, method of producing same, and air conditioner
A power module includes a power semiconductor, a non-power semiconductor, one resin substrate, and a cooling device. The power semiconductor and the non-power semiconductor configure a power supply...
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7611923 |
Method and apparatus for forming stacked die and substrate structures for increased packing density
A stacked semiconductor apparatus has at least one die attached to a first side of a carrier substrate. A first circuitized substrate is attached to the first side of the carrier substrate and...
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7605022 |
Methods of manufacturing a three-dimensional semiconductor device and semiconductor devices fabricated thereby
A method of fabricating a three-dimensional semiconductor device is provided along with a three-dimensional semiconductor device fabricated thereby. The method includes forming a heat conductive...
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7595227 |
Integrated circuit device package having both wire bond and flip-chip interconnections and method of making the same
Methods for assembling a die-down array integrated circuit (IC) device packages with enhanced thermal, electrical, and input/output properties are presented. The method includes coupling a first...
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7592698 |
Power semiconductor modules having a cooling component and method for producing them
An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal...
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7592204 |
Package design of small diameter sensor
A small sensor assembly is produced by encapsulating an inner package within an outer package. The inner assembly can have electrical components and sensors attached to a lead frame. The electrical...
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7589418 |
Pressure contact power semiconductor module
A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion...
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7589417 |
Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one...
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7586189 |
Heat dissipation structure accommodated in electronic control device
A circuit board mounting electronic components including a heat generating element is accommodated in a casing. A heat dissipation member is disposed between the heat generating element and an...
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7585702 |
Structure and assembly procedure for low stress thin die flip chip packages designed for low-K Si and thin core substrate
Provided are semiconductor die flip chip packages and semiconductor die flip chip package components where certain properties of the packages/components are controlled to facilitate management of...
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7579688 |
Heat radiation structure of semiconductor device, and manufacturing method thereof
The invention of the present application provides a heat radiation structure of a semiconductor device, and includes a substrate having, on a surface thereof, a first area on which the...
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7579687 |
Circuit module turbulence enhancement systems and methods
Turbulence inducers are provided on circuit modules. Rising above a substrate or heat spreader surface, turbulence generators may be added to existing modules or integrated into substrates or heat...
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7579218 |
Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density
An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for...
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7579217 |
Methods of making a die-up ball grid array package with printed circuit board attachable heat spreader
An electrically and thermally enhanced die-up tape substrate ball grid array (BGA) package and die-up plastic substrate BGA package are described. A substrate that has a first surface and a second...
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7575956 |
Fabrication method for semiconductor package heat spreaders
A method for fabricating a semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least...
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7573131 |
Die-up integrated circuit package with grounded stiffener
A printed circuit substrate is disposed on a bottom side of a stiffener. An IC die is disposed on a top side of the stiffener. The die is electrically connected onto the printed circuit substrate...
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7572668 |
Method of patterning an organic thin film, an organic thin film transistor, a method of manufacturing an organic thin film transistor, and an organic electroluminescence display device having the organic thin film transistor
Provided is a method of patterning an organic thin film which can prevent surface damage of an organic semiconductor layer. Also, an organic thin film transistor that can reduce an off-current and...
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7569426 |
Apparatus and method integrating an electro-osmotic pump and microchannel assembly into a die package
A die package and a method and apparatus for integrating an electro-osmotic pump and a microchannel cooling assembly into a die package.
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7569425 |
Method for manufacturing thermal interface material with carbon nanotubes
A method for manufacturing a thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid...
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7566591 |
Method and system for secure heat sink attachment on semiconductor devices with macroscopic uneven surface features
Methods, systems, and apparatuses for attaching heat sinks to integrated circuit packages using thermally conductive adhesive materials are described. The adhesive materials can be shaped to...
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7566590 |
Low voltage drop and high thermal performance ball grid array package
An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first...
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7563647 |
Integrated circuit package system with interconnect support
An integrated circuit package system with interconnect support is provided including providing an integrated circuit, forming an electrical interconnect on the integrated circuit, forming a contact...
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7560310 |
Semiconductor constructions and semiconductor device fabrication methods
A method of fabricating a semiconductor device includes etching a substrate formed on a backside of a semiconductor wafer to form a recess in the substrate, and forming a sputter film in the...
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7560309 |
Drop-in heat sink and exposed die-back for molded flip die package
A system and method for modifying a molded flip die (MFD) integrated circuit package that includes an integrated circuit die to include a heat sink such that the heat sink is thermally coupled to...
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7553702 |
Integrating a heat spreader with an interface material having reduced void size
An integrated heat spreader and die coupled with solder are disclosed herein. The heat spreader may have solder reservoirs. Additionally, the heat spreader and die may be coupled during a reflow...
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7550840 |
Apparatus for effecting reliable heat transfer of bare die microelectronic device and method thereof
Apparatus and method include using a bare die microelectronic device; a heat sink assembly; a heat sink mounting assembly for mounting the heat sink assembly independently of the bare die...
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7550319 |
Low temperature co-fired ceramic (LTCC) tape compositions, light emitting diode (LED) modules, lighting devices and method of forming thereof
The present invention provides LTCC (low temperature co-fired ceramic) tape compositions and demonstrates the use of said LTCC tape(s) in the formation of Light-Emitting Diode (LED) chip carriers...
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7547412 |
Composite material, method for producing same and member using same
A composite material is a Mo—Cu based composite material having a Cu content of 30 to 70 weight % and containing a copper pool phase and an Mo—Cu based composite phase. The copper pool phase is...
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7545032 |
Integrated circuit package system with stiffener
An integrated circuit package system is provided including forming a mounting structure having an external interconnect, a paddle, and a tie bar; mounting an integrated circuit die on the paddle;...
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7544527 |
Method and apparatus for providing optoelectronic communication with an electronic device
An optoelectronic assembly for an electronic system includes a thermally conductive, metallized transparent substrate having a first surface and an opposite second surface. A support chip set is...
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7541220 |
Integrated circuit device having flexible leadframe
An integrated circuit device having a flexible leadframe, and techniques for fabricating the flexible leadframe and integrated circuit device, are provided. In one aspect of the invention, an...
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7538422 |
Integrated circuit micro-cooler having multi-layers of tubes of a CNT array
Heat sink structures employing multi-layers of carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. In...
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7534650 |
Carbon-carbon and/or metal-carbon fiber composite heat spreader
A heat spreader, comprised of a plurality of carbon fibers oriented in a plurality of directions, with a carbon or metal matrix material dispersed about the fibers, is described. The carbon fibers...
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7531386 |
Semiconductor package
There is provided a semiconductor package including: a substrate having a plurality of electrode pads on a surface thereof; a semiconductor chip mounted on the substrate, the semiconductor chip...
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7528012 |
Method for forming heat sinks on silicon on insulator wafers
An apparatus and method for a heat sink to dissipate the heat sourced by the encapsulated transistors in a SOI wafer. The apparatus includes a transistor formed in the active silicon layer of the...
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7528009 |
Wafer-leveled chip packaging structure and method thereof
This invention relates to a wafer-leveled chip packaging method, comprising the steps of: providing a wafer; attaching at least one first chip to the wafer; forming a first insulating layer on the...
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7524703 |
Integrated circuit stacking system and method
The present invention stacks integrated circuits (ICs) into modules that conserve PWB or other board surface area. In another aspect, the invention provides a lower capacitance memory expansion...
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7521794 |
Intrinsic thermal enhancement for FBGA package
A semiconductor device for dissipating heat generated by a die during operation and having a low height profile, a semiconductor die package incorporating the device, and methods of fabricating the...
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7518233 |
Sealing structure for multi-chip module
A sealing structure for multi-chip modules stable in cooling performance and excelling in sealing reliability is to be provided. The under face of a frame 5 compatible with a wiring board 1 in...
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7518219 |
Integrated heat spreader lid
A heat spreader lid includes an outer periphery region having a lip for bonding to an underlying substrate board, a center region, and one or more strain isolation regions. The strain isolation...
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7517730 |
Coreless substrate and manufacturing method thereof
The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via...
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7517729 |
Integrated circuit package system with heat slug
An integrated circuit package system is provided including providing a substrate having a die attached and electrically bonded thereto. The system includes forming heat slug pillars on the...
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7517728 |
Semiconductor light emitting devices including a luminescent conversion element
Methods of packaging a semiconductor light emitting device include dispensing a first quantity of encapsulant material into a cavity including the light emitting device. The first quantity of...
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7511315 |
Semiconductor device and manufacturing method therefor
A semiconductor device has an external wiring for GND formed over an underside surface of a wiring substrate. A plurality of via holes connecting to the external wiring for GND are formed to...
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