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9034695 Integrated thermal solutions for packaging integrated circuits  
A method includes attaching a wafer on a carrier through an adhesive, and forming trenches in the carrier to convert the carrier into a heat sink. The heat sink, the carrier, and the adhesive are...
9029202 Method of forming a high thermal conducting semiconductor device package  
A semiconductor device package (100) includes a heat spreader (503) formed by depositing a first thin film layer (301) of a first metal on a top surface (150) of a die (110) and to exposed...
9029949 Semiconductor-on-insulator (SOI) structures with local heat dissipater(s) and methods  
Disclosed are semiconductor-on-insulator (SOI) structures comprising an SOI device (e.g., an SOI metal oxide semiconductor field effect transistor (MOSFET)) with local heat dissipater(s). Each...
9029200 Method for manufacturing semiconductor devices having a metallisation layer  
A method for manufacturing semiconductor devices is disclosed. In one embodiment a semiconductor substrate having a first surface, a second surface opposite to the first surface and a plurality of...
9029201 Semiconductor-on-insulator with back side heat dissipation  
Embodiments of the present invention provide for the dissipation of heat from semiconductor-on-insulator (SOI) structures. In one embodiment, a method for fabricating an integrated circuit is...
9023688 Method of processing a semiconductor device  
A method for processing a semiconductor device, the method including; providing a first semiconductor layer including first transistors; forming interconnection layers overlying the transistors,...
9024421 Connection arrangement for semiconductor power modules  
A semiconductor power module includes at least two sub modules. The sub modules include at least one respective transistor having a collector, an emitter, and a gate. The module includes a...
9018744 Semiconductor device having a clip contact  
A semiconductor device comprises a carrier. Further, the semiconductor devices comprises a semiconductor chip comprising a first main surface and a second main surface opposite to the first main...
9018754 Heat dissipative electrical isolation/insulation structure for semiconductor devices and method of making  
An isolation structure can include a structure material with thermal conductivity greater than silicon dioxide, yet electrical conductivity such that the structure material can replace silicon...
9013035 Thermal improvement for hotspots on dies in integrated circuit packages  
Methods and apparatuses for improved integrated circuit (IC) packages are described herein. In an aspect, an IC device package includes an IC die having a contact pad, where the contact pad is...
9006784 Semiconductor device and manufacturing method thereof  
A semiconductor device includes a link portion that connects a second heat sink to a third heat sink via a solder. The solder is arranged on a connecting surface of a base portion of the link...
8999760 Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure  
A semiconductor device has a thermally conductive layer with a plurality of openings formed over a temporary carrier. The thermally conductive layer includes electrically non-conductive material....
9000590 Protruding terminals with internal routing interconnections semiconductor device  
A semiconductor package includes terminals extending from a bottom surface of the semiconductor package, and a layer of interconnection routings disposed within the semiconductor package. Each...
8994160 Resin-encapsulated semiconductor device and method of manufacturing the same  
A resin-encapsulated semiconductor device includes: a semiconductor element mounted on a die pad portion; a plurality of lead portions disposed so that distal end parts thereof are opposed to the...
8994169 Semiconductor packages usable with a mobile device  
A semiconductor package usable with a mobile device includes a circuit board including conductive wirings therein and contact terminals on a rear surface thereof, an integrated circuit chip...
8991028 Graphene nanoplatelet metal matrix  
A metal matrix composite is disclosed that includes graphene nanoplatelets dispersed in a metal matrix. The composite provides for improved thermal conductivity. The composite may be formed into...
8987062 Active thermal control for stacked IC devices  
Thermal conductivity in a stacked IC device can be improved by constructing one or more active temperature control devices within the stacked IC device. In one embodiment, the control devices are...
8987894 Underfill process and materials for singulated heat spreader stiffener for thin core panel processing  
A method of making a microelectronic package, and a microelectronic package made according to the method. The method includes: bonding and thermally coupling a plurality of IC dies to an IHS panel...
8987065 Forming functionalized carrier structures with coreless packages  
Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a die to a carrier material, wherein the...
8976529 Lid design for reliability enhancement in flip chip package  
In a package structure, a stiffener ring is over and bonded to a top surface of a first package component. A second package component is over and bonded to the top surface of the first package...
8959756 Method of manufacturing a printed circuit board having an embedded electronic component  
A method of manufacturing a core substrate having an electronic component, including providing a core substrate having a first surface and a second surface on an opposite side of the first...
8963317 Thermal dissipation through seal rings in 3DIC structure  
A package includes a die, which includes a semiconductor substrate, a plurality of through-vias penetrating through the semiconductor substrate, a seal ring overlapping and connected to the...
8963320 Integrated circuit packaging system with thermal structures and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: forming a thermal attach cluster includes: forming a heat collector having a heat dissipation surface, forming a cluster...
8963313 Heterogeneous chip integration with low loss interconnection through adaptive patterning  
Integrating a semiconductor component with a substrate through a low loss interconnection formed through adaptive patterning includes forming a cavity in the substrate, placing the semiconductor...
8963324 Semiconductor device  
In a semiconductor device, a semiconductor module is pressed against a cooler by a spring member. The spring member is compressed by a beam member that is connected with a strut fixed to the...
8962394 Semiconductor device and method of manufacturing the same  
A semiconductor device includes a substrate, a semiconductor element disposed on the substrate, and a heat conductive member composed of a solder material. The heat conductive member covers the...
8962393 Integrated circuit packaging system with heat shield and method of manufacture thereof  
A method of manufacture of an integrated circuit packaging system includes: mounting a device mounting structure over a bottom substrate; mounting a heat spreader having an opening formed by a...
8963321 Semiconductor device including cladded base plate  
A semiconductor device includes a semiconductor chip joined with a substrate and a base plate joined with the substrate. The base plate includes a first metal layer clad to a second metal layer....
8956915 Method of manufacturing a three-dimensional packaging semiconductor device  
Provided is a semiconductor device including a flexible circuit board which includes a first external electrode provided on a first face and second and third external electrodes provided on a...
8958207 Heat radiation material, electronic device and method of manufacturing electronic device  
The electronic device includes a heat generator 54, a heat radiator 58, and a heat radiation material 56 disposed between the heat generator 54 and the heat radiator 58 and including a plurality...
8957508 Semiconductor device and method of manufacturing the same  
A semiconductor device has a connection structure in which a power semiconductor chip is mounted on an insulating substrate having conductor patterns bonded to front and rear surfaces thereof, and...
8957516 Low cost and high performance flip chip package  
A low cost and high performance flip chip package is disclosed. By assembling the package using a substrate panel level process, a separate fabrication of a substrate is avoided, thus enabling the...
8951846 Controlling thermal interface material bleed out  
An extended preform of a thermal interface material (TIM) is formed between a heat spreader and a die on a substrate. The preform has an extension beyond a footprint of the die. The preform is...
8940584 Semiconductor packages and methods of forming the same  
A semiconductor package including a package substrate having a chip mounting region and a peripheral region and including a ground layer formed in the peripheral region, first solder balls on the...
8941228 Semiconductor module and manufacturing method thereof  
A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal...
8936955 Method for manufacturing light emitting diodes  
An LED manufacturing method includes following steps: providing an LED die; providing an electrode layer having a first section and a second section electrically insulated from the first section,...
8937385 Electronic component and fabrication process of this electronic component  
An electronic component comprising a substrate extending in a plane, having electrical connections to connect the component to a circuit, and having an upper face; an electronic chip arranged on...
8937383 Direct semiconductor contact ebullient cooling package  
The semiconductor package as well as a method for making it and using it is disclosed. The semiconductor package comprises a semiconductor chip having at least one heat-generating semiconductor...
8933545 Double-side exposed semiconductor device  
A double-side exposed semiconductor device includes an electric conductive first lead frame attached on top of a thermal conductive but electrical nonconductive second lead frame and a...
8921160 3D IC configuration with contactless communication  
A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face....
8921994 Thermally enhanced package with lid heat spreader  
A method and apparatus are provided for manufacturing a lead frame based thermally enhanced package (9) with exposed heat spreader lid array (96) designed to be optimized for compression mold...
8916962 III-nitride transistor with source-connected heat spreading plate  
Disclosed are semiconductor devices and methods for manufacturing them. An example device may include a III-nitride stack having a front side surface and a back side surface. The III-nitride stack...
8916963 Power module for an automobile  
The invention relates to a power module (10), preferably for a vehicle, in particular an electric vehicle, characterized in that said module includes two vertically adjacent semiconducting chips...
8916964 Semiconductor device and method of producing same  
A semiconductor device and a method of producing the same, wherein a joining member and a joined member are bonded by means of brazing in a way such that no voids are left inside the joining...
8907461 Heat dissipation device embedded within a microelectronic die  
The subject matter of the present application relates to a heat dissipation device that is embedded within a microelectronic die. The heat dissipation device may be fabricated by forming at least...
8907472 3DIC package comprising perforated foil sheet  
A structure includes a thermal interface material, and a Perforated Foil Sheet (PFS) including through-openings therein, with a first portion of the PFS embedded in the thermal interface material....
8906748 Method for packaging a semiconductor structure  
The present application provides a method and semiconductor packaging structure comprising a conductive substrate having a first surface, a first lateral surface and a second lateral surface...
8901732 Semiconductor device package and method  
Various packages and methods are disclosed. A package according to an embodiment includes a substrate, a chip attached to a surface of the substrate with electrical connectors, a molding compound...
8900927 Multichip electronic packages and methods of manufacture  
A multi-chip electronic package and methods of manufacture are provided. The method includes contacting pistons of a lid with respective ones of chips on a chip carrier. The method further...
8901755 Semiconductor device and method of forming conductive layer over metal substrate for electrical interconnect of semiconductor die  
A semiconductor device has a substrate with a cavity. A conductive layer is formed within the cavity and over the substrate outside the cavity. A plurality of indentations can be formed in a...