Matches 351 - 400 out of 734 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6673655 Method of making semiconductor device having improved heat radiation plate arrangement  
In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the...
6673708 Thermal and mechanical attachment of a heatspreader to a flip-chip integrated circuit structure using underfill  
An integrated circuit structure and a method for packaging an integrated circuit are described. The integrated structure includes an integrated circuit that is inverted and solder bump mounted to a...
6670216 Method for manufacturing a power semiconductor device and direct bonded substrate thereof  
Embodiments of the present invention are directed to packaged power semiconductor devices and direct-bonded metal substrates thereof. In one embodiment, a method for manufacturing a power...
6670269 Method of forming through-hole or recess in silicon substrate  
A method of forming a through-hole or a recess in a silicon substrate, having a conductor pattern formed on one side thereof by irradiating a laser beam to the silicon substrate, comprising the...
6670223 Coupled-cap flip chip BGA package with improved cap design for reduced interfacial stresses  
Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with a...
6667191 Chip scale integrated circuit package  
An integrated circuit package including a silicon wafer, a plate of intermetallic compound fixed to the back surface of the silicon wafer and a plurality of solder ball contacts. The solder ball...
6660566 Heat conductive molded body and manufacturing method thereof and semiconductor device  
A heat conductive molded body effectively radiating heat generated from semiconductor elements, power supply or light source used for electric apparatuses, and a manufacturing method thereof and a...
6656766 Semiconductor device having chip scale package  
A first surface of a semiconductor chip and an upper surface of a circuit board are bonded with a pad of the semiconductor chip fitted to a first opening of the circuit board. The pad is...
6653167 Facilitating heat transfer from an integrated circuit package  
In accordance with the present invention, a method is described which facilitates heat transfer from a silicon die after the silicon die is bonded to a substrate. The thermal conductor is placed on...
6651323 Method for making a printed wire board having a heat-sinking solder pad  
A method for manufacturing a surface mount solder pad that is adapted to function as a heat sink for an electronic component soldered to the pad. The method comprises a step of providing a printed...
6647310 Temperature control of an integrated circuit  
An apparatus and method for controlling temperature during pre-delivery testing of microprocessors and integrated circuits wherein a testing package, including a thermally conductive lid overlying...
6646340 Thermally coupling electrically decoupling cooling device for integrated circuits  
A thermally coupling electrically decoupling cooling device is described. The cooling device may be thermally disposed between a self-heating electrically conductive line and a semiconductor...
6635513 Pre-curved spring bolster plate  
A method and apparatus to mount a pre-curved bolster plate to a substrate. One embodiment of the invention involves a method to assemble a pre-curved bolster plate on a substrate. A second...
6624006 Methods of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip  
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned...
6617683 Thermal performance in flip chip/integral heat spreader packages using low modulus thermal interface material  
A microprocessor package and a method of dissipating heat therefrom have improved thermal performance by utilizing low modulus thermal interface material between the flip chip, central processing...
6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same  
A semiconductor packaging technology is proposed for the fabrication of a chip-on-chip (COC) based multi-chip module (MCM) with molded underfill. The proposed semiconductor packaging technology is...
6607942 Method of fabricating as grooved heat spreader for stress reduction in an IC package  
A new design is provided for the heat spreader of a semiconductor package. Grooves are provided in a surface of the heat spreader, subdividing the heat spreader for purposes of stress distribution...
6608379 Enhanced chip scale package for flip chips  
A chip scale package (CSP) comprises a flip chip and chip carrier with features to enhance its electrical and thermal performance. The flip chip connects to the chip carrier through alternating...
6607928 Integrated circuit device having an embedded heat slug  
An integrated circuit device having an embedded heat slug. The integrated circuit device comprises, in one embodiment, a semiconductor substrate having a frontside surface and a backside surface....
6607939 Method of making a multi-layer interconnect  
Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good...
6599779 PBGA substrate for anchoring heat sink  
In accordance with the objectives of the invention a new method is provided to position and secure a heat sink over the surface of a semiconductor device mounting support, the latter typically...
6586280 Method of manufacturing a semiconductor chip array with two-sided cooling  
A method of manufacturing a semiconductor device including a substrate and a die supported thereon. The substrate has at least one electrical connection region on a first portion of a surface of...
6586279 Method of integrating a heat spreader and a semiconductor, and package formed thereby  
A method of integrating a heat spreader into a semiconductor package includes depositing an adhesion metal layer on the back of a wafer at low temperature. A heat transfer metal layer is...
6579747 Method of making electronics package with specific areas having low coefficient of thermal expansion  
Method of making semiconductor package including at least one semiconductor chip disposed within a housing, the housing including a lid which overlies the at least one semiconductor chip and a...
6576496 Method and apparatus for encapsulating a multi-chip substrate array  
The present invention provides an encapsulation method and apparatus that allows high throughput production of reliable, high quality board-on-chip packages, or other semiconductor die packages,...
6576497 Chip-type electronic component  
A ceramic substrate having two side surfaces in a lengthwise direction and two side surfaces in a widthwise direction intersecting each other. The ceramic substrate also includes at least one flat...
6569712 Structure of a ball-grid array package substrate and processes for producing thereof  
An improved structure of a ball-grid array (BGA) package substrate and processes for producing thereof are disclosed, wherein one side of the BGA substrate has a single pattern layer for connecting...
6562662 Electronic package with bonded structure and method of making  
An electronic package comprising a semiconductor chip mounted on a substrate is formed by bonding a structure which covers at least an outer surface of the semiconductor chip and has the same or...
6549413 Tape ball grid array semiconductor package structure and assembly process  
A package structure includes a heat spreader, a ground plane affixed to the heat spreader, and a flex tape interconnect substrate affixed to the ground plane. An aperture in the ground plane...
6541310 Method of fabricating a thin and fine ball-grid array package with embedded heat spreader  
A method is proposed for fabricating a TFBGA (Thin & Fine Ball-Grid Array) package with embedded heat spreader. Conventionally, since an individual TFBGA package is quite small in size, it would be...
6537856 Method of attaching a semiconductor chip to a leadframe with a footprint of about the same size as the chip and packages formed thereby  
Methods for forming substantially chip scale packages and the resulting structures. The methods comprise applying an adhesive on an active surface of a semiconductor chip to form a patterned...
6538320 Heat spreader having holes for rivet-like adhesive connections  
A heat spreader-package assembly is provided having a heat spreader mounted to a package board with an adhesive. The heat spreader has an upper portion and a plurality of sidewalls extending from...
6534343 Method of making electrically isolated power semiconductor package  
A packaged power semiconductor device ( 24 ) with voltage isolation between a metal backside ( 34 ) and the terminals ( 38 ) of the device. A direct-bonded copper (“DBC”) substrate ( 28 ) is...
6534859 Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package  
A new method and package is provided for face-up packaging of semiconductor devices. The semiconductor device is mounted over the surface of a semiconductor device support surface using...
6531771 Dissipation of heat from a circuit board having bare silicon chips mounted thereon  
A method is disclosed for making a heat dissipation arrangement for a circuit board on which are mounted bare silicon chips having an exposed face. A heat spreader has a planar portion, on whose...
6525421 Molded integrated circuit package  
A mold for use in encapsulating an integrated circuit, wherein an encapsulant is injected into the mold during packaging of the integrated circuit. The improvement to the mold is a shaped member...
6514791 Method for fabricating thermoelectric coolers and semiconductor devices formed therefrom  
A system and method for fabricating a thermoelectric cooling (TEC) device and a semiconductor device using such a TEC device are described. Adhesive-containing support structures are used to...
6514790 Method for handling a plurality of circuit chips  
In a method for handling in parallel a plurality of circuit chips, which are arranged in a first arrangement, which corresponds to their arrangement in the original wafer, on the surface of an...
6509630 Flexible interconnecting substrate, film, carrier, tape-shaped semiconductor device, semiconductor device and method of manufacturing the same, circuit board, and electronic equipment  
The flexible interconnecting substrate ( 1 ) has a tape-shaped base substrate ( 10 ), a plurality of interconnecting patterns ( 20 ) formed on a base substrate ( 10 ), and a plurality of...
6506629 Varied-thickness heat sink for integrated circuit (IC) packages and method of fabricating IC packages  
An integrated circuit (IC) package includes a package body, such as a transfer molded plastic or preformed ceramic package body, having an IC die positioned therein. A lead frame, such as a...
6507102 Printed circuit board with integral heat sink for semiconductor package  
A low-cost printed circuit board for a semiconductor package having the footprint of a ball grid array package has an integral heat sink, or “slug,” for the mounting of one or more...
6498051 Method of packaging semiconductor device using anisotropic conductive adhesive  
A method of mounting a semiconductor device ( 16 ) comprises the steps of disposing an anisotropic conductive adhesive ( 13 ) on the surface of a circuit board ( 17 ), placing the semiconductor...
6492199 Method of manufacturing a semiconductor package with improved cross talk and grounding  
A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface...
6492202 Method of assembling components onto a circuit board  
An electronic component includes a semiconductor device ( 320 ) over a circuit board ( 210, 910 ), a heat sink ( 240, 940 ) over the semiconductor device, a clip ( 250, 950 ) over the heat sink and...
6492195 Method of thinning a semiconductor substrate using a perforated support substrate  
Disclosed herein is a technique which performs the thinning of a wafer and the separation thereof from a support substrate with high yields and in a short time. Described specifically, a hole-free...
6486562 Circuit device with bonding strength improved and method of manufacturing the same  
A circuit device with a ball grid array (BGA) package structure includes an interposer substrate, at least a flip chip, a unitary mold resin and a heat spreader. The interposer substrate has a...
6482674 Semiconductor package having metal foil die mounting plate  
A semiconductor package, and a method for fabricating the package are provided. The package includes a semiconductor die, a lead frame, and a metal foil die mounting plate adapted to mount the die...
6479325 Method of stacking semiconductor laser devices in a sub-mount and heatsink  
A method of manufacturing a semiconductor laser device includes the steps of: providing a laser chip, in which a semiconductor layer is formed on a substrate, a supporting plate which supports the...
6479323 Method for attaching a lead frame to a heat spreader/heat slug structure  
A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the...
6473310 Insulated power multichip package  
The invention includes a multichip integrated circuit package having at least two chips electrically isolated from one another. Within the multichip integrated circuit package is a slug that is...
Matches 351 - 400 out of 734 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >