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6818477 |
Method of mounting a component in an edge-plated hole formed in a printed circuit board
A printed circuit board (PCB) assembly comprising a PCB having a top circuitry layer and a bottom layer with a hole through the PCB, a component, and a pallet. The printed circuit board...
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6818982 |
Heat dissipation type semiconductor package and method of fabricating the same
The present invention relates to a heat dissipation type semiconductor package with a heat-radiating canopy molded thereon and a method of fabricating the same. According to the present invention,...
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6812067 |
Method for integrating compound semiconductor with substrate or high thermal conductivity
A method for integrating a compound semiconductor with a substrate of high thermal conductivity is provided. The present invention employs a metal of low melting point, which is in the liquid state...
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6812550 |
Wafer pattern variation of integrated circuit fabrication
A method for manufacturing an integrated circuit on a semiconductor wafer is provided. The semiconductor wafer has complete die and partial die areas thereon. Functional circuit patterns are formed...
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6803252 |
Single and multiple layer packaging of high-speed/high-density ICs
Methods and apparatus for providing connection packages for high-speed integrated circuits (“ICs”) in optical, electronic, wired or wireless communications are disclosed. The connection package...
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6803653 |
Apparatus for suppressing packaged semiconductor chip curvature while minimizing thermal impedance and maximizing speed/reliability
A semiconductor structure includes a substrate and a semiconductor devices secured to the substrate. A stabilizing member is secured to the semiconductor device, and has a coefficient of thermal...
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6803257 |
Printed circuit board with a heat dissipation element, method for manufacturing the printed circuit board, and package comprising the printed circuit board
A printed circuit board (PCB) with a heat dissipation element, a method for manufacturing the PCB, and a semiconductor package using the PCB dissipates heat generated from the semiconductor chip...
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6794223 |
Structure and process for reducing die corner and edge stresses in microelectronic packages
A microelectronic die is aligned with a package substrate and attached to it using solder balls. A specially shaped heat spreader, preferably with a coefficient of thermal expansion (CTE) similar...
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6790710 |
Method of manufacturing an integrated circuit package
In one aspect, the present invention features a method of manufacturing an integrated circuit package including providing a substrate having a first surface, a second surface opposite the first...
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6791181 |
Semiconductor light emitting device
The present invention discloses a semiconductor light emitting device comprising at least one semiconductor light emitting element of edge-emission type, a first heat sink and a second heat sink,...
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6787895 |
Leadless chip carrier for reduced thermal resistance
According to one embodiment, a semiconductor die is situated in a cutout section of a substrate. In one embodiment, the substrate is situated on a printed circuit board such that the semiconductor...
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6784027 |
Light-emitting semiconductor component
A light-emitting semiconductor component having: a semiconductor element containing an active layer, electrical contacts for impressing a current into the active layer (heat being generated at the...
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6784538 |
Heat transfer structure for a semiconductor device utilizing a bismuth glass layer
The present invention is a semiconductor apparatus having at least a part of a semiconductor device conjugated to a metal material for heat sink via an electric insulating material, wherein said...
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6784022 |
Method of dicing a semiconductor wafer and heat sink into individual semiconductor integrated circuits
A method of producing semiconductor devices including the steps of providing a semiconductor wafer of substantially uniform thickness 22 , providing a heat-radiating plate 22 , and attaching the...
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6780678 |
Cooling of optoelectronic elements
Optical systems for cooling optoelectronic elements are provided. A representative optical system includes a substrate and a first optoelectronic element supported by the substrate. Additionally, a...
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6773964 |
Integrated circuit package including sealed gaps and prevention of vapor induced failures and method of manufacturing the same
There exist a need in the art for an IC package that prevents the popcorn effect through every process step in forming an electronic device, as well as during operation of the device. This need is...
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6773936 |
Method of reducing low-frequency noise for semiconductor devices and circuits
The present invention relates to a method for reducing low-frequency noise in a cooled circuit wherein low-frequency noise in a cryogenic semiconductor device is reduced by carrying out thermal...
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6773963 |
Apparatus and method for containing excess thermal interface material
A semiconductor package is provided. The semiconductor package includes a semiconductor device supported by a substrate. The package also includes a heat spreader having a surface divided into a...
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6770968 |
Method for bonding heat sinks to overmolds and device formed thereby
A method for bonding heat sinks to packaged electronic components comprises the steps of: (a) exposing to a plasma a surface of a molded polymer formed on a substrate; (b) allowing the plasma to at...
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6770513 |
Thermally enhanced flip chip packaging arrangement
An improved arrangement for attaching a heat sink to a flip chip type die is disclosed. More specifically, the heat sink is attached to the back surface of the flip chip die by a metallic solder...
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6767766 |
Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication
An electronic module and method of fabrication are provided employing an integrated thermal dissipation assembly. The thermal dissipation assembly includes a thermoelectric assembly configured to...
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6765290 |
Arrangement for back-biasing multiple integrated circuit substrates at maximum supply voltage among all circuits
A diode coupling-based arrangement back-biases each of the semiconductor substrates of a plurality of integrated circuits at the maximum (e.g., most negative) DC voltage applied to any individual...
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6759278 |
Method for surface mounted power transistor with heat sink
A surface mounted power transistor is provided with a heat sink by positioning a mounting plate of a heat sink between the power transistor and a solder pad on the circuit board. The mounting plate...
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6750082 |
Method of assembling a package with an exposed die backside with and without a heatsink for flip-chip
A method of assembling a package having an exposed die comprising the following steps. A die attached to a substrate by connectors is provided. The die having a backside. Encapsulate is formed...
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6750084 |
Method of mounting a leadless package and structure therefor
A method and circuit structure for mounting a leadless IC package to a substrate having a thermal pad on a first surface thereof, a plurality of contact pads surrounding the thermal pad, and one or...
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6746885 |
Method for making a semiconductor light source
A method for making a semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as a LED chip, laser chip, LED...
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6746898 |
Integrated chip package structure using silicon substrate and method of manufacturing the same
An integrated chip package structure and method of manufacturing the same is by adhering dies on a silicon substrate and forming a thin-film circuit layer on top of the dies and the silicon...
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6748350 |
Method to compensate for stress between heat spreader and thermal interface material
A device and method identify and compensate for tensile and/or shear stress due to heat-caused expansion and contraction between an integrated heat spreader and thermal interface material. This...
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6734043 |
Pressure-bonded heat sink method
This invention pertains to a method for removing heat from a heat source device and to a heat sink system characterized by a pressure bond having thermal resistance of less than about 5 K/kW-cm 2 ....
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6730543 |
Methods for multiple die stack apparatus employing
Multiple integrated circuit devices in a stacked configuration that uses a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor...
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6724078 |
Electronic assembly comprising solderable thermal interface
To accommodate high power densities associated with high performance integrated circuits, heat is dissipated from a surface of a die through a solderable thermal interface to a lid or integrated...
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6723582 |
Method of making a semiconductor package having exposed metal strap
Semiconductor devices and methods of forming such devices are disclosed. The devices include a package allowing for increased thermal dissipation. In one embodiment, the device includes a power...
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6716675 |
Semiconductor device, method of manufacturing semiconductor device, lead frame, method of manufacturing lead frame, and method of manufacturing semiconductor device with lead frame
The present invention relates to a leadless surface-mount resin-sealing semiconductor device and a manufacturing method thereof; in a semiconductor device comprising a semiconductor element, a...
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6716692 |
Fabrication process and structure of laminated capacitor
A fabrication process and a structure of a laminated capacitor. A substrate is provided, and multiple electrode and dielectric layers, formed using high-speed physical metal deposition and...
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6716676 |
Thermally-enhanced stacked-die ball grid array semiconductor package and method of fabricating the same
A new semiconductor packaging technology is proposed for the fabrication of a thermally-enhanced stacked-die BGA (Ball Grid Array) semiconductor package. By the proposed semiconductor packaging...
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6713321 |
Super low profile package with high efficiency of heat dissipation
A super low profile package with high efficiency of heat dissipation comprises the substrate, the heat sink, the die, the wires and the plastic mold. The heat sink adheres to the ground ring by the...
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6710462 |
Method of pressure curing for reducing voids in a die attach bondline and applications thereof
A method of curing adhesives of a die attach material to reduce the formation of voids at the resulting bondline, defined by the interface between the adhesive and the surface of a die being...
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6709897 |
Method of forming IC package having upward-facing chip cavity
A method of forming an integrated circuit package with an upward-facing chip cavity such that the fabrication of the substrate and the packaging of silicon chip are combined. By forming a patterned...
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6709895 |
Packaged microelectronic elements with enhanced thermal conduction
A semiconductor chip is mounted in face-up disposition on a dielectric element, with thermally conductive but flexible elements disposed between the chip bottom surface and the top surface of the...
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6709898 |
Die-in-heat spreader microelectronic package
Microelectronic packages including a microelectronic die disposed within a recess in a heat spreader and build-up layers of dielectric materials and conductive traces are then fabricated on the...
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6706563 |
Heat spreader interconnect methodology for thermally enhanced PBGA packages
A new method is provided for the interface between a heat spreader and the substrate of a thermally improved PBGA package. The heat spreader interfaces with the substrate with the standoff of the...
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6706560 |
Method of forming heat sink and semiconductor chip assemblies
Methods for applying a heat sink to a semiconductor chip. A heat sink frame is removably attached to one or more heat sinks and is used to align the heat sinks with corresponding semiconductor...
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6706562 |
Electronic assembly with high capacity thermal spreader and methods of manufacture
To accommodate high power densities associated with high performance integrated circuits, an integrated circuit package includes a heat-dissipating structure in which heat is dissipated from a...
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6706565 |
Methods of forming an integrated circuit device
The present invention includes integrated circuit devices, synchronous-link dynamic random access memory devices, methods of forming an integrated circuit device and methods of forming a...
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6699731 |
Substrate of semiconductor package
A fabricating method for a semiconductor package is proposed, in which a chip carrier accommodates at least one semiconductor chip, which is attached with an interface layer formed on a covering...
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6699736 |
Electrical coupling of a stiffener to a chip carrier
A method and structure for conductively coupling a metallic stiffener to a chip carrier. A substrate has a conductive pad on its surface and an adhesive layer is formed on the substrate surface....
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6692993 |
Windowed non-ceramic package having embedded frame
An integrated circuit (IC) package includes a mold compound, a die, and a window. The mold compound has a frame embedded within it. The frame has a coefficient of thermal expansion that is less...
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6689642 |
Semiconductor device and manufacturing method thereof
Recently, there have been increasing demands for the reduction in size and weight of mobile computing/communication terminals as well as the elongation of the use time of the internal batteries....
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6677185 |
Method of affixing a heat sink to a substrate and package thereof
A method of affixing a heat sink to a substrate and package thereof having a substrate with a position for receiving a semiconductor chip, at least a semiconductor chip for affixing on the position...
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6673655 |
Method of making semiconductor device having improved heat radiation plate arrangement
In a semiconductor device having a heat radiation plate, the tips of inner leads connected to a semiconductor chip have a lead width w and a lead thickness t, the width being less than the...
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