Matches 501 - 550 out of 734 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
5946544 Circuit board-mounted IC package cooling and method  
In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat...
5933709 Semiconductor package and method for fabricating same  
A semiconductor package including a first heat slug having a substantially flat shape and a second heat slug coupled to the first heat slug. A semiconductor chip is mounted on an inner surface of...
5930600 Diode-laser module with a bonded component and method for bonding same  
A method for bonding a component (14) to a substrate (18) via a thermally hardened or softened bonding medium, employs PTC or NTC thermistor (24) for heating the bonding medium during bonding of...
5930601 Heat assembly and method of transferring heat  
A heat sink assembly includes a printed wiring board, a metal case and a circuit package containing a gallium arsenide field effect transistor heat dissipating circuit. The circuit package includes...
5924190 Methods and apparatus for manufacturing encapsulated integrated circuits  
Methods and apparatuses for encapsulating thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks so...
5909056 High performance heat spreader for flip chip packages  
According to one aspect of the invention, a semiconductor package is provided including a package substrate having an upper surface and a lower surface, wherein electrical contacts on the lower...
5902120 Process for producing spatially patterned components  
A process is disclosed for producing spatially patterned components from a body. On the backside of the body, a retardation layer with openings is provided for retarding a removal of the material...
5896271 Integrated circuit with a chip on dot and a heat sink  
Disclosed is a flexible substrate having a thermal contact that provides a continuous high thermal conductivity path from a heat generating component to a heat sink. In one embodiment, the thermal...
5891759 Method of making a multiple heat sink resin sealing type semiconductor device  
A resin sealing type semiconductor device has first and second heat radiating portions located on opposite sides of a semiconductor element. The first heat radiating portion has an element placing...
5891755 Process for flat plate cooling a semiconductor chip using a thermal paste retainer  
A process wherein thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip...
5886396 Leadframe assembly for conducting thermal energy from a semiconductor die disposed in a package  
A semiconductor die (32) is disposed on a heat sink (22) in an electronic package (10). During assembly, a leadframe (20) is connected to the heat sink (22) by down-set tabs (14, 28), which are...
5885853 Hollow chip package and method of manufacture  
Semiconductor package and method in which a chip is mounted in an opening in a frame with the back side of the chip facing outside the package, and a heatsink is positioned in direct thermal...
5869891 Powdered metal heat sink with increased surface area  
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct...
5866263 Adsorbent lid construction  
An absorbent lid or cover for a hermetic enclosure comprises a coating applied via sputtering to at least a portion of at least one surface of the lid and consisting of at least one elemental metal...
5854741 Unit printed circuit board carrier frame for ball grid array semiconductor packages and method for fabricating ball grid array semiconductor packages using the same  
A unit printed circuit board (PCB) carrier frame used in the fabrication of a heat sink-attached ball grid array (BGA) semiconductor packages and a method for BGA semiconductor packages using the...
5846852 Process for mounting an electronic component to a substrate and process for spray-cooling the electronic component mounted to a substrate  
The electronic component (10) has a die (22) and a terminal (14) coupled to the die (22). The substrate has a first side (20) and a second side (82) and a passage (26) therethrough. The terminal...
5843810 Film circuit and method of manufacturing the same  
A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film...
5843808 Structure and method for automated assembly of a tab grid array package  
A TAB Grid Array (TGA) package allows automated assembly using established manufacturing equipment similar to those used in the production of plastic ball grid Array (PBGA) package assembly. The...
5834337 Integrated circuit heat transfer element and method  
An integrated circuit heat transfer element (6,30) is made by selecting thermally conductive fibers having aspect ratios of length to diameter of more than 1, selecting a resin and combining the...
5825623 Packaging assemblies for encapsulated integrated circuit devices  
Encapsulated thermally enhanced (TE) and electrically and thermally enhanced (ETE) integrated circuit assemblies that include bulky thermally conductive heat sinks are disclosed. The integrated...
5814536 Method of manufacturing powdered metal heat sinks having increased surface area  
A method and apparatus for dissipating heat from a semiconductor device. A heat sink embodying the method includes an exterior surface contoured to better facilitate heat dissipation and/or direct...
5807768 Method for fabricating a heat sink-integrated semiconductor package  
A heat sink-integrated semiconductor package is fabricated by a characteristic method comprising the steps of dispensing a liquid epoxy resin over at least the bare surface of a heat sink mounted...
5808359 Semiconductor device having a heat sink with bumpers for protecting outer leads  
A QFP adapted to lowering the heat resistance and increasing the number of pins includes a heat-radiating metal plate having bumpers formed at the four corners thereof as a unitary structure, a...
5805427 Ball grid array electronic package standoff design  
A surface mount package to encapsulate one or more semiconductor devices has a standoff that maintains the thickness of solder columns bonding the package to an external circuit. The standoff...
5804468 Process for manufacturing a packaged semiconductor having a divided leadframe stage  
A process for manufacturing semiconductor device having a package in which a semiconductor device is sealed includes a base, and a metallic film is formed on a surface of the base. The...
5792677 Embedded metal planes for thermal management  
In order to dissipate heat from an electronic device, there is disclosed a method whereby with the use of metal planes embedded in an insulating substrate, heat generated by the electronic device...
5789279 Method and apparatus for electrically insulating heat sinks in electronic power devices  
A method and apparatus for electrically insulating heat sinks in electronic power devices that includes the formation of an insulating layer on the face of the electronic device having the heat...
5779134 Method for surface mounting a heatsink to a printed circuit board  
A low cost method for attaching a heat slug to a printed circuit board using surface-mount technology. In one embodiment a metal coating is deposited about the periphery of an opening of a printed...
5776800 Paddleless molded plastic semiconductor chip package  
Disclosed is a semiconductor package and method in which a semiconductor chip is mounted within the opening of a lead frame by bonding wires extending between the active front side of the chip and...
5770468 Process for mounting a semiconductor chip to a chip carrier by exposing a solder layer to a reducing atmosphere  
A method of producing a semiconductor chip on a chip carrier includes preparing a semiconductor chip having opposite front and rear surfaces and an active element on the front surface, applying...
5766986 Method of transfer molding electronic packages and packages produced thereby  
A printed wiring board with either a pin grid array, a ball grid array, a land grid array, etc. of electrical contacts is prepared with a heat sink in the usual manner. A passage is provided either...
5766985 Process for encapsulating a semiconductor device having a heat sink  
A process for making a package for discrete semiconductor devices, wherein the insulating characteristics of the package are increased by introducing cuts, grooves and positioning holes in the...
5763296 Method for fabricating an electronic device structure with studs locating lead frame on backing plate  
A process for making an electronic device structure which comprises a metal plate, a semiconductor material chip attached to the plate, terminal leads, interconnection wires between the leads and...
5728601 Process for manufacturing a single in-line package for surface mounting  
A process for manufacturing semiconductor package of a single in-line type including a semiconductor chip, a package body for accommodating the semiconductor chip and a plurality of leads held by...
5702985 Hermetically sealed ceramic integrated circuit heat dissipating package fabrication method  
A method for achieving a hermetically sealed ceramic integrated circuit package having good thermal conductivity for efficiently transferring heat from an integrated circuit chip die contained...
5700724 Hermetically sealed package for a high power hybrid circuit  
A metal ring frame, having co-fired ceramic inserts, is hermetically sealed to a copper/molybdenum base using a brazing alloy having a melting temperature which is approximately the cross-over...
5693573 Semiconductor package lead deflash method  
A semiconductor package lead deflash method comprises the steps of forming a plating thin film on a plurality of leads, weakening an adhesive force of the plating thin film, and removing a flash...
5691567 Structure for attaching a lead frame to a heat spreader/heat slug structure  
A method and structure for attaching a lead frame to a heat sink are provided. In one embodiment, a layer of thermally conductive, electrically insulating epoxy is formed on a heat sink and the...
5686361 Method for manufacturing a semiconductor device having a heat radiator  
A highly reliable semiconductor device and a method of manufacturing the same. The semiconductor device is constituted by a semiconductor element which is disposed within a space portion defined by...
5683944 Method of fabricating a thermally enhanced lead frame  
The device has a semiconductor die (18) mounted upon a downset X-shape die support (12) of a lead frame (10, 40). The lead frame also has tie bars (16) which are connected to the X-shape die...
5683919 Transistor and circuit incorporating same  
A flip-chip integrated circuit having a transistor 300 with terminals 314, 312, 320 contacted from opposite sufaces of a semiconductor substrate 302. The terminals contacted from opposite surfaces...
5681777 Process for manufacturing a multi-layer tab tape semiconductor device  
One or two, or more, additional conductive layers, separated from one another (if two or more) and separated from a patterned (signal) conductive layer are formed in a flexible substrate, for...
5672547 Method for bonding a heat sink to a die paddle  
A method of bonding an integrated circuit die to a heat sink by first providing a lead frame that has a die paddle portion having a top surface, a bottom surface, and at least one aperture...
5652184 Method of manufacturing a thin semiconductor package having many pins and likely to dissipate heat  
The present invention provides a semiconductor device. In the device of the present invention, a metal lead wire is mounted to one surface of a carrier tape. One end of the metal lead wire is...
5643834 Process for manufacturing a semiconductor substrate comprising laminated copper, silicon oxide and silicon nitride layers  
A process for manufacturing a plastic package type semiconductor device composed of a rolled metal substrate made of copper or copper alloy and an insulating film formed on the surface of the...
5639694 Method for making single layer leadframe having groundplane capability  
A method of making an electronic package including providing a leadframe of a single layer of material. The leadframe includes a semiconductor device support, a plurality of signal leads, and a...
5614442 Method of making flip-chip microwave integrated circuit  
A flip-chip integrated circuit 1100 having a transistor 1108 formed at a frontside surface of a substrate 1104. An airbridge 1106 may be formed over portions of the transistor wherein a top surface...
5570502 Fabricating metal matrix composites containing electrical insulators  
A method of fabricating a metal matrix composite containing electrically isolated areas and the MMC formed from the method. The method comprises: (a) providing a liquid pool of unreinforced...
5556811 Method of optimizing operating parameters of an integrated circuit package having a voltage regulator mounted thereon  
A very large scale integrated (VLSI) chip designed to operate at 3.3 volts is modified to be compatible with prior systems having a 5 volt voltage supply. A central processing unit (CPU) is...
5533256 Method for directly joining a chip to a heat sink  
The present invention relates generally to a new apparatus and method for directly joining a chip to a heat sink. More particularly, the invention encompasses an apparatus and a method that uses a...
Matches 501 - 550 out of 734 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >