Matches 451 - 500 out of 733 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >
Match Document Document Title
6251707 Attaching heat sinks directly to flip chips and ceramic chip carriers  
An aluminum or copper heat sink is attached to a ceramic cap or exposed semiconductor chip using an adhesive of silicone or flexible-epoxy adhesive. The aluminum may be coated by anodizing or...
6251706 Method for cooling the backside of a semiconductor device using an infrared transparent heat slug  
An apparatus and method that permits the removal of heat from the back side surface of an integrated circuit semiconductor substrate while performing optical based testing through or at the back...
6248612 Method for making a substrate for an integrated circuit package  
An enhanced ball grid array substrate package and method for manufacturing the same, where the substrate package includes a metal core having a first surface and a second surface opposite the first...
6245596 Method of producing semiconductor device with heat dissipation metal layer and metal projections  
A method of producing a semiconductor device having a heat dissipating metal layer wherein the number of patterning steps is reduced, laser dicing produces a better profile, and first and second...
6221694 Method of making a circuitized substrate with an aperture  
A method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and routing out a preselected portion of...
6215180 Dual-sided heat dissipating structure for integrated circuit package  
A dual-sided heat dissipating structure for BGA package includes a step-shaped first heat dissipating member adhering to an active side of the chip and a dish-shaped perforated second heat...
6214647 Method for bonding heatsink to multiple-height chip  
A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface...
6190945 Integrated heat sink  
A semiconductor device has an integrated heat sink. A package body encapsulates a die and a leadframe. A heat sink is in thermal contact with the die and the leadframe. The heat sink is...
6188579 Apparatus and methods for forming a printed wiring board assembly to reduce pallet warpage  
A printed wiring board assembly includes a pallet that is coupled to the bottom surface of a printed wiring board. An insert is provided having a first portion that is slidably mounted to the...
6180436 Method for removing heat from a flip chip semiconductor device  
A method and assembly (10) for conducting heat from a semiconductor device, such as a power flip chip (12). The assembly (10) is generally constructed to dissipate heat from the chip (12) when...
6162659 Method for manufacturing a package structure having a heat spreader for integrated circuit chips  
A method for manufacturing package structure integrated circuit chips having a heat spreader is disclosed. A wiring substrate is first provided. An integrated circuit chip, having a first surface...
6150196 Method of manufacturing automobile AC generator and method of manufacturing rectifier used in automobile AC generator  
First, a rectifier assembly is assembled from a negative heat sink assembly, a positive heat sink assembly, a circuit board assembly, and a guide. Subsequently, stator coil connecting terminals of...
6150195 Method for an integrated circuit thermal grease mesh structure  
The invention includes a method for assembling an integrated circuit package. In the method, a substrate is presented. Next, an integrated circuit may be mounted to the substrate. A retaining...
6146921 Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink  
An integrated circuit package which includes a thermal element that extends into a cavity of an injection molded housing. The cavity exposes at least a portion of an integrated circuit that is...
6143590 Multi-chip semiconductor device and method of producing the same  
A method of making a semiconductor device including: a ceramic base board formed of AlN; a CPU chip and a CMU chip which are flip-chip bonded on a circuit board which includes the ceramic base...
6133071 Semiconductor device with plate heat sink free from cracks due to thermal stress and process for assembling it with package  
A compound semiconductor pellet for a high electron mobility transistor is bonded to a metal plate heat sink of gold, and the metal plate heat sink is soldered to a package, wherein the metal plate...
6130113 Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process  
An apparatus and method of making a void free interface between a heatspreader and pressure sensitive adhesive (PSA) by attaching them in an air free environment. The PSA is placed on a pedestal in...
6118175 Wire bonding support structure and method for coupling a semiconductor chip to a leadframe  
A flexible shelf (12) and a method for coupling a semiconductor chip (33) to a leadframe (23) using the flexible shelf (12). The flexible shelf (12) has a mounting portion (16), a flexible portion...
6117709 Resin sealing type semiconductor device and method of manufacturing the same  
A heat sink with first and second sides are connected to a lead frame. The lead frame has a first group of inner leads having front end portions arranged to make a specific interval with the first...
6117797 Attachment method for heat sinks and devices involving removal of misplaced encapsulant  
A process for forming a thermally enhanced Chip On Board semiconductor device with a heat sink is described. In one aspect, a thermally conducting interface material of filled gel elastomer...
6110762 Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package  
An integrated circuit package. The package includes a substrate which has a first surface, a second opposite surface and four corners. Each corner has a conductive plane and at least one via. The...
6090643 Semiconductor chip-substrate attachment structure  
A semiconductor device soldered to a conical mounting pedestal of a metal substrate reduces the lateral shearing stress created by temperature changes. An angle between the bonding surfaces of the...
6049971 Casing for integrated circuit chips and method of fabrication  
A method for fabricating a lead frame that includes a platform attached thereto for mounting a chip. A base frame is provided for mounting chips of various sizes. The base frame includes connection...
6048754 Method of manufacturing a semiconductor device with an airtight space formed internally within a hollow package  
A process for manufacturing a package of a semiconductor device, and providing a semiconductor device in which a vapor-impermeable moistureproof plate is embedded in a bottom surface of a hollow...
6049469 Combination electromagnetic shield and heat spreader  
An apparatus for providing heat dissipation and electromagnetic shielding for an integrated circuit, such as a CPU, in a computer system includes a first surface thermally coupling the apparatus to...
6046077 Semiconductor device assembly method and semiconductor device produced by the method  
A method of assembling a semiconductor device dissipates the stress of hardening an underfill resin injected between the wiring board and a semiconductor chip mounted on the wiring board. The...
6040984 Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels  
High density bonding pads in a printed circuit board for mounting a semiconductor chip are provided using a simple structure and at a low cost, while minimizing the difference in levels of bonding...
6037193 Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity  
The present invention relates generally to a new process for hermetically sealing of a high thermally conductive substrate, such as, an aluminum nitride substrate, using a low thermally conductive...
6034425 Flat multiple-chip module micro ball grid array packaging  
A micro ball grid array package is devised for a multiple-chip module (MCM). The IC chips in the package are butted together to save space. The bonding pads for the lower IC chip or chips are...
6025213 Semiconductor light-emitting device package and method of manufacturing the same  
A surface-emission semiconductor light-emitting device package can radiate heat from the front surface while emitting light to the front surface of the device. The package includes a semiconductor...
6020219 Method of packaging fragile devices with a gel medium confined by a rim member  
A fragile device, such as an integrated circuit chip or a multichip assembly, is packaged by first dispensing a sol surrounding the sides of the device. The sol is laterally confined by means of a...
6020637 Ball grid array semiconductor package  
Disclosed is a semiconductor package arrangement. The package arrangement includes a heat spreader for dissipating heat generated within the semiconductor package arrangement. The package further...
6016006 Thermal grease insertion and retention  
An integrated circuit package. The package includes an integrated circuit that is mounted to a substrate. The integrated circuit is enclosed by a cover plate that is attached to the substrate. The...
6014064 Heterolithic voltage controlled oscillator  
A voltage controlled oscillator includes a varactor (201) and a transistor (202) and a ground via (203), of epitaxially grown silicon that is etched to provide respective pedestals embodying the...
5998240 Method of extracting heat from a semiconductor body and forming microchannels therein  
Cooling of densely packaged semiconductor devices is achieved by microchannels which extract heat by forced convection and the use of fluid coolant located as close as possible to the heat source....
5998238 Method of fabricating semiconductor device  
A method of fabricating a semiconductor device includes forming a first chip separating groove such that its depth is less than the total depth of the wafer, forming a first metallization layer...
5998239 Method of manufacturing a semiconductor device with a brazing mount  
A method of manufacturing a semiconductor device with a mount 2 secured on a circuit board 1 to support a diode chip 3 thereon. A plurality of legs 7, 12 formed in the mount 2 are in contact with...
5990560 Method and compositions for achieving a kinetically controlled solder bond  
An improved method and composition for achieving a kinetically-controlled solder bond is disclosed having particular application to the fabrication of hybrid integrated circuits and optical...
5985695 Method of making a molded flex circuit ball grid array  
A grid array assembly method uses a flex circuitry substrate and includes providing a series of conforming flex circuitry substrates, the flex circuitry substrates include bonding pads and...
5985697 Method and apparatus for mounting an integrated circuit to a printed circuit board  
An apparatus for mounting an integrated circuit chip to a main printed circuit board is disclosed. The mounting apparatus is particularly suitable for situations in which a cooling device of...
5985684 Process for manufacturing a laser diode having a heat sink  
A process for manufacturing a laser diode package including a laser diode, a heat sink and a lid. The laser diode has an emitting surface, a reflective surface opposing the emitting surface, and...
5981310 Multi-chip heat-sink cap assembly  
A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over...
5977627 Packaging construction for very large scale integrated-circuit chips  
A novel IC chip packaging construction in which the chip package materials are selected such that their thermal linear expansion curves are closely matched over the full operating temperature range...
5972737 Heat-dissipating package for microcircuit devices and process for manufacture  
High density heatsinks for microcircuit packages are formed by first mold-pressing a composite powder of free-flowing spray-dried particles of an inexpensive high thermal conductivity material...
5972736 Integrated circuit package and method  
An integrated circuit package with heat slug is disclosed. The heat slug is thermally coupled to one or more semiconductor die using a single layer of high conductivity adhesive. The assembly...
5963795 Method of assembling a heat sink assembly  
Method of cooling electronic systems an semiconductor devices as well as an electronic system and a semiconductor device with heat dissipating elements. The method includes the steps of providing...
5956576 Enhanced protection of semiconductors with dual surface seal  
The present invention relates generally to a new apparatus and method for encapsulating ceramic chip carriers. More particularly, the invention encompasses an apparatus and a method for providing a...
5953593 Method and mold for manufacturing a plastic package for an electronic device having a heat sink  
A method for forming a plastic package for a power semiconductor electronic device to be encapsulated within a plastic case and to be coupled thermally to a heat sink element having a major surface...
5953594 Method of making a circuitized substrate for chip carrier structure  
An improved method of making a circuitized substrate which may be utilized as a chip carrier structure. The method involves the steps of providing a dielectric member and partially routing this...
5946544 Circuit board-mounted IC package cooling and method  
In a circuit board/IC package assembly the die cavity in the IC package body portion is filled with a thermally conductive liquid to substantially facilitate the transfer of operational die heat...
Matches 451 - 500 out of 733 < 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >