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7632715 Method of packaging semiconductor devices  
A method of packaging a semiconductor includes providing a support structure. An adhesive layer is formed overlying the support structure and is in contact with the support structure. A plurality...
7582553 Method of bonding flying leads  
The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps...
7514788 Structure of mounting electronic component  
The structure of mounting an electronic component on a circuit board is capable of securely flip-chip-bonding the electronic component having bumps, whose separations are very short, to the circuit...
7507654 Method for mounting electronic element on a circuit board  
Method for mounting an electronic component on a circuit board firstly flip-chip bonding positioning bumps of the electronic component to pads of the circuit board by applying ultrasonic vibrations...
7439475 Thermally conductive body and method of manufacturing the same  
The thermally conductive body for use by being placed between a heat generating body and a heat radiating body, in which the body is molded from a thermally conductive polymer composition. The...
7435622 High performance reworkable heatsink and packaging structure with solder release layer and method of making  
A method of making and a high performance reworkable heatsink and packaging structure with solder release layer are provided. A heatsink structure includes a heatsink base frame. A selected one of...
7425499 Methods for forming interconnects in vias and microelectronic workpieces including such interconnects  
Methods for forming interconnects in blind vias or other types of holes, and microelectronic workpieces having such interconnects. The blind vias can be formed by first removing the bulk of the...
7397117 Chip package with die and substrate  
A thin film semiconductor die circuit package is provided utilizing low dielectric constant (k) polymer material for the insulating layers of the metal interconnect structure. Five embodiments...
7378616 Heating apparatus and method for semiconductor devices  
A heating apparatus and method for heating a semiconductor device during bonding of electrical contacts onto the device is provided, which includes a heating plate that is provided for heating the...
7285447 Method and apparatus for imprinting a circuit pattern using ultrasonic vibrations  
Embodiments of a method and apparatus for imprinting a trench pattern on a substrate using ultrasonic vibrations. The trench pattern corresponds to a circuit pattern that is to be formed on the...
7235429 Conductive block mounting process for electrical connection  
A process for mounting conductive blocks on a surface of a substrate is disclosed wherein the substrate may be an IC chip, carrier, or a PCB. An adhesive layer is formed on each of the pads of the...
7229854 Electronic component mounting method and apparatus and ultrasonic bonding head  
A component mounting apparatus includes a component feeder ( 20 ) that feeds a component ( 2 ) with its bump electrodes facing down, a mounting head ( 5 ) that mounts the component onto a substrate...
7217592 Method of magnetic field assisted self-assembly  
A method for assembling and integrating microstructures (pills) onto a substrate. A plurality of patterned recesses are formed on the substrates, the recesses having transverse cross-sections and...
7186586 Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities  
A packaging substrate ( 310 ) includes a semiconductor interposer ( 120 ) and at least one other intermediate substrate ( 110 ), e.g. a BT substrate. The semiconductor interposer has first contact...
7169245 Methods of using sonication to couple a heat sink to a heat-generating component  
Methods of using subsonic and/or sonic forces to couple a heat sink to a heat-generating component are described. Heat sinks coupled to heat-generating components via thermal interface materials...
7141443 Semiconductor wafer dividing method utilizing laser beam  
A method which can divide a semiconductor wafer sufficiently precisely along a street by use of a laser beam, while fully avoiding or suppressing contamination of circuits formed in rectangular...
7132310 Packaging substrate and manufacturing method thereof, integrated circuit device and manufacturing method thereof, and SAW device  
A basic portion layer 21 of a substrate electrode 12 a connected to a projecting electrode 13 electrically and mechanically on a substrate member of ceramics. The substrate member on which...
7033865 Thermally conductive substrate, thermally conductive substrate manufacturing method and power module  
By providing an end portion of a radiation plate located on and near an end portion of an insulator sheet, to which a lead frame extends, at a position away from the end portion of the insulator...
7034403 Durable electronic assembly with conductive adhesive  
An electronic assembly comprising a first electronic element, a second electronic element, and a durably flexible bond therebetween. The bond comprises an anisotropic conductive adhesive that...
7015071 Method of manufacturing a semiconductor device  
A method of manufacture of a semiconductor device can speedily peel extremely thin chips which are laminated to an adhesive tape without generating cracks or chippings. In this regard, the head of...
6943062 Contaminant particle removal by optical tweezers  
The invention describes how contaminant particles may be removed from a surface without in any way damaging that surface. First, the positional co-ordinates of all particles on the surface are...
6916687 Bump process for flip chip package  
A bump process for fabricating bumps and an underfill layer on the active surface of a chip inside a flip chip package is disclosed. An adhesive layer is formed on each of the die pads of the chip....
6867087 Formation of dual work function gate electrode  
In a method of making a dual work function gate electrode of a CMOS semiconductor structure, the improvement comprising formation of the dual work function gate electrode so that there is no boron...
6855578 Vibration-assisted method for underfilling flip-chip electronic devices  
A semiconductor assembly comprising an integrated circuit chip with a first plurality of metallic contact pads exposed, having a pitch center-to-center of less than 180 μm. A metallic bump of...
6849477 Method of fabricating and mounting flip chips  
A method of fabricating and mounting a flip chip includes using an environmentally friendly plasma gas, which minimizes safety hazards during an implementation of the method and does not require an...
6838316 Semiconductor device manufacturing method using ultrasonic flip chip bonding technique  
A bump is formed on at least one of a semiconductor chip and printed circuit board. A sealing material is applied to the surface of one of the semiconductor chip and printed circuit board. The...
6821813 Process for bonding solder bumps to a substrate  
A new and improved process for bonding solder bumps on an IC chip to a BT substrate in “flip chip” packaging technology. In one embodiment, the process includes providing a resilient chip...
6809044 Method for making a thin film using pressurization  
The invention relates to a process for making a thin film starting from a substrate ( 1 ) of a solid material with a plane face ( 2 ) comprising: the implantation of gaseous compounds in the...
6808962 Semiconductor device and method for fabricating the semiconductor device  
The semiconductor device comprises an insulation layer formed on surfaces of semiconductor chips where the electrodes are formed, and a wiring layer formed on the insulation layer. The wiring layer...
6716668 Method for forming semiconductor device  
A method for forming a semiconductor device includes providing a lead frame which has a die pad and a plurality of leads extending toward the outside of the die pad, mounting a semiconductor chip...
6653171 Flip-chip type semiconductor device having split voids within under-fill layer and its manufacturing method  
In a flip-chip type semiconductor device including a semiconductor chip having metal bumps on one surface thereof, an interposer substrate having pad electrodes on one surface thereof, and an...
6610560 Chip-on-chip based multi-chip module with molded underfill and method of fabricating the same  
A semiconductor packaging technology is proposed for the fabrication of a chip-on-chip (COC) based multi-chip module (MCM) with molded underfill. The proposed semiconductor packaging technology is...
6602733 Method for fabricating electronic circuit device, semiconductor device and electronic circuit device including bump bonding  
A method for fabricating an electric circuit device able to ensure bonding strength and bond bumps without occurrence of cratering or other mechanical damages. The method for fabricating an...
6586278 Method for mounting electronic component and structure having mounted thereon an electronic component  
A method for mounting an electronic component on a substrate is shown, which involves positioning an electronic component 1 on wiring electrodes 5 of a substrate 4 via bumps 3 , application...
6582993 Method of underfilling semiconductor device  
Prior to setting of a semiconductor device upon the surface of a wiring substrate, the fluid of a light curable reaction resin is supplied from a nozzle to the surface of the wiring substrate. When...
6524892 Method of fabricating multilayer flexible wiring boards  
A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring,...
6524885 Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques  
The present invention provides a method, apparatus and system for building a wafer-interposer assembly. The method includes the steps of forming a redistribution layer (RDL) pad on a semiconductor...
6492195 Method of thinning a semiconductor substrate using a perforated support substrate  
Disclosed herein is a technique which performs the thinning of a wafer and the separation thereof from a support substrate with high yields and in a short time. Described specifically, a hole-free...
6461890 Structure of semiconductor chip suitable for chip-on-board system and methods of fabricating and mounting the same  
A structure and a method which can reliably electrically connect opposed terminals with each other are disclosed. First and second terminals are opposed to each other, so that an anisotropic...
6424541 Electronic device attachment methods and apparatus for forming an assembly  
Improved methods and apparatus for forming an assembly by attaching an electronic package to a substrate are disclosed. The electronic package includes a microelectronic device, conductive leads to...
6387829 Separation process for silicon-on-insulator wafer fabrication  
A process for manufacturing a silicon-on-insulator wafer from a silicon wafer assembly. The assembly is made of two wafers. One of the wafers contains a fragile layer. The fragile layer is a layer...
6365436 Connecting multiple microelectronic elements with lead deformation  
A plurality of separate semiconductor chips, each having a contact-bearing surface and contacts on such surface, are disposed in an array so that the contact-bearing surfaces face and define a...
6346433 Method of coating semiconductor wafer with resin and mold used therefor  
In a method of coating a semiconductor wafer with a resin of the present invention, first, a semiconductor wafer is placed on a bottom surface of a cavity provided in a molding surface of a lower...
6284568 Method and system for producing semiconductor device  
A method for producing a semiconductor device, comprises the steps of: introducing a plurality of semiconductor element supporting substrates or semiconductor elements into a conductive-ball...
6269999 Semiconductor chip mounting method utilizing ultrasonic vibrations  
A semiconductor chip mounting method to prevent the occurrence of particles created while mounting the semiconductor chip onto a substrate using ultrasonic thermocompression bonding. The mounting...
6255138 Process for producing microencapsulated electroconductive filler  
A process for producing a microencapsulated electroconductive filler comprising conductive filler particles each having an insulating resin coated on the surface thereof, which comprises: a first...
6225145 Method of fabricating vacuum micro-structure  
Provided is a method of fabricating a vacuum micro-structure, which is used for an element operating in a vacuum, the method comprising the steps of: (1) entirely etching an epitaxial layer of a...
6214635 Method and apparatus for underfill of bumped or raised die  
A method and apparatus for attaching a semiconductor device to a substrate. One end of the substrate is elevated to position the substrate and the coupled semiconductor device on an inclined plane....
6204094 Method and apparatus for populating an adhesive sheet with particles  
A method for assembling electronic devices by moving particles (12) on an adhesive sheet (35) having a plurality of adhesive areas (30), comprising the steps of loading the particles (12) onto the...
6194250 Low-profile microelectronic package  
A microelectronic package (10) is formed by placing a lead frame (22) onto an adhesive polyimide tape (38). The lead frame (22) includes a plurality of metallic leads (16) and an opening. An...
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