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Match Document Document Title
7429787 Semiconductor assembly including chip scale package and second substrate with exposed surfaces on upper and lower sides  
Semiconductor assemblies include a first package, each having at least one die affixed to, and electrically interconnected with, a die attach side of the first package substrate, and a second...
7425469 Method for encapsulating an electronic component using a foil layer  
The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil...
7422958 Method of fabricating a mixed substrate  
A method for fabricating a mixed substrate that include insulating material layer portions buried in a substrate of semiconductor material. The method includes providing a support substrate made of...
7422930 Integrated circuit with re-route layer and stacked die assembly  
An apparatus and a method of manufacture for a stacked-die assembly. A first die is placed on a substrate such that the backside of the die, i.e., the side opposite the side with the bond pads, is...
7419855 Apparatus and method for miniature semiconductor packages  
A method and apparatus for making reliable miniature semiconductor packages having a reduced height and footprint is provided. The package includes a semiconductor chip having an active surface and...
7416923 Underfill film having thermally conductive sheet  
An underfill film for an electronic device includes a thermally conductive sheet. The electronic device may include a printed circuit board, an electrical component, an underfill, and the thermally...
7416921 Method for flip-chip mounting utilizing a delay curing-type adhesive with two-part hardening resin  
A method of flip-chip mounting a semiconductor chip can carry out bonding at normal temperature and improves the positional accuracy of bonding. The method of flip-chip bonding a semiconductor chip...
7413995 Etched interposer for integrated circuit devices  
In one embodiment, a package-to-package stack is assembled comprising a first integrated circuit package, and a second integrated circuit package which are mechanically and electrically connected...
7413929 Integrated chip package structure using organic substrate and method of manufacturing the same  
An integrated chip package structure and method of manufacturing the same is by adhering dies on an organic substrate and forming a thin-film circuit layer on top of the dies and the organic...
7413919 Method of manufacturing a structural health monitoring layer  
Methods of manufacturing a diagnostic layer containing an array of sensing elements. The sensing elements, associated wires, and any accompanying circuit elements, are incorporated various layers...
7410832 Semiconductor chip package having an adhesive tape attached on bonding wires  
The invention provides a semiconductor chip package, and a means of forming such a semiconductor chip package, in which one or more semiconductor chips are electrically connected to a mounting...
7410827 Semiconductor device and method of fabricating the same, circuit board, and electronic instrument  
A method of fabricating a semiconductor device, including: preparing a wiring board on which is mounted a first semiconductor chip having a plurality of first pads; electrically connecting each of...
7408263 Anisotropic conductive coatings and electronic devices  
Anisotropic conductive coatings and electronic devices made using the coatings are provided. The anisotropic conductive coatings are particularly useful in electronic devices that contain flexible...
7402460 Method for production of contactless chip cards and for production of electrical units comprising chips with contact elements  
Method of producing electrical units consisting of chips with contact elements, wherein the contact elements are suited for the direct connection with contact terminals of external electric...
7402454 Molded integrated circuit package with exposed active area  
An integrated circuit die having an active area that must remain exposed after packaging is secured by a compliant die attachment by which the integrated circuit die is held in position within a...
7399661 Method for making an integrated circuit substrate having embedded back-side access conductors and vias  
A method for making an integrated circuit substrate having embedded back-side access conductors and vias provides a high-density mounting and interconnect structure for integrated circuits that is...
7399652 Method for manufacturing a micro-electro-mechanical device, in particular an optical microswitch, and micro-electro-mechanical device thus obtained  
A method for manufacturing a micro-electro-mechanical device, which has supporting parts and operative parts, includes providing a first semiconductor wafer, having a first layer of semiconductor...
7396703 Method of making a semiconductor chip assembly with a bumped terminal and a filler  
A method of making a semiconductor chip assembly includes providing a metal base, a routing line, a bumped terminal and a filler, wherein the routing line contacts the bumped terminal and the...
7396702 Module assembly and method for stacked BGA packages  
Ball grid array packages that can be stacked to form highly dense components and the method for stacking ball grid arrays are disclosed. The ball grid array packages comprise flexible or rigid...
7394163 Method of mounting semiconductor chip  
A method of mounting a semiconductor chip in which an IC chip is mounted by filling a gap between the chip and a substrate with adhesive which functions as an underfill. The fillet of the underfill...
7390696 Wafer, semiconductor device, and fabrication methods therefor  
In order to fabricate a semiconductor device that can perform at its full capacity, in which (i) a single-crystal silicon integrated circuit is formed on an insulating substrate without an adhesive...
7387928 Device and method for making air, gas or vacuum capacitors and other microwave components  
A device and method for making a capacitor and other high frequency and/or microwave components. In particular, an air dielectric capacitor has a first electrode and a second electrode that are...
7387914 Semiconductor device and process for fabrication thereof  
A semiconductor chip is attached to a lead frame with a filmy organic die-bonding material having a water absorption of 1.5% by volume or less; having a saturation moisture absorption of 1.0% by...
7387913 3D optoelectronic micro system  
A 3D micro optical switching system (3D-MOSS) is fabricated by dividing an optical switching system into several blocks, creating optoelectronic layers where optical switches or tunable filters in...
7382519 Method and device for fabricating a release structure to facilitate bonding of mirror devices onto a substrate  
A method of fabricating a spatial light modulator. The method includes providing a first substrate having a mirror layer, the mirror layer having an upper surface and a lower surface. The method...
7381591 Flip-chip adaptor package for bare die  
A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead...
7381590 Method and device including reworkable alpha particle barrier and corrosion barrier  
A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the...
7380333 Chip resistor fabrication method  
A method of making a chip resistor is provided. The method includes the following steps. First, a resistive element is provided on a substrate. Then, a resin layer is formed on the substrate to...
7376852 Method for controlling power change for a semiconductor module  
The present invention provides a method for controlling power change for a semiconductor module. Specifically, under the present invention power is applied to, or removed from a semiconductor...
7374965 Manufacturing method of semiconductor device  
A semiconductor device in the form of a resin sealed semiconductor package is disclosed, wherein a gate terminal connected to a gate pad electrode formed on a surface of a semiconductor chip and a...
7371614 Image sensor device and methods thereof  
An image sensor device and methods thereof. In an example method, a protective layer may be formed over at least one microlens. An adhesive layer may be formed over the protective layer. The...
7371608 Method of fabricating a stacked die having a recess in a die BGA package  
Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided.
7368323 Semiconductor device and manufacturing method thereof  
A semiconductor device is provided which includes a first semiconductor chip, a substrate onto which the first semiconductor chip is flip-chip bonded and on which a concave is formed along one side...
7368322 Method for mounting a chip on a base and arrangement produced by this method  
An electronic component includes a base and a chip attached to the base by a plurality of adhesive pads that are spaced apart from one another and are arranged in an intermediate space between the...
7365441 Semiconductor device fabricating apparatus and semiconductor device fabricating method  
A semiconductor device fabricating method comprises a substrate forming step of forming a plurality of separate conductive pads 20 on an adhesive layer included in an adhesive sheet 50 , and a...
7362577 Electronic component and radiating member, and method of manufacturing semiconductor device using the component and member  
A method for manufacturing an electronic component device in which an electronic component and a heat dissipating member are connected by a heat conducting member, the method comprising forming one...
7361993 Terminal pad structures and methods of fabricating same  
Terminal pads and methods of fabricating terminal pads. The methods including forming a conductive diffusion barrier under a conductive pad in or overlapped by a passivation layer comprised of...
7361519 Method of manufacturing a semiconductor device  
A method of manufacturing a semiconductor device, comprises the steps of: forming a first insulating film on a first substrate; forming a second insulating film on the first insulating film;...
7358118 Mounting method of flexible printed circuit and manufacturing method of electric optical device  
Aspects of the current invention are directed to a method of mounting a flexible printed circuit and a manufacturing method of an electric optical device. Each of the methods form semiconductor...
7354802 Thermal release wafer mount tape with B-stage adhesive  
In one aspect, an improved wafer mount tape is provided. The wafer mount tape includes a base layer, a release layer that expands when activated and a B-stageable adhesive layer that is positioned...
7348216 Rework process for removing residual UV adhesive from C4 wafer surfaces  
A method for the removal of residual UV radiation-sensitive adhesive from the surfaces of semiconductor wafers, remaining thereon from protective UV radiation-sensitive tapes which were stripped...
7344915 Method for manufacturing a semiconductor package with a laminated chip cavity  
A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated...
7342053 Resin composition, adhesive film using the same and multilayer printed circuit board  
Producing a printed circuit board, by coating a resin composition comprising an aromatic cyanate compound having two or more cyanato groups in a molecule and a radical-polymerizable resin on a...
7339281 Circuit device and manufacturing method thereof  
A circuit device which enables easy formation of a connection part that connects wiring layers to each other, and a manufacturing method thereof are provided. In a method for manufacturing a hybrid...
7335533 Methods for assembling semiconductor devices in superimposed relation with adhesive material defining the distance adjacent semiconductor devices are spaced apart from one another  
A method for assembling semiconductor devices includes providing a first semiconductor device, applying a predetermined volume of adhesive material to at least a surface of the first semiconductor...
7332372 Methods for forming assemblies and packages that include stacked semiconductor devices separated a distance defined by adhesive material interposed therebetween  
A method for assembling semiconductor devices includes providing a first semiconductor device, applying a volume of adhesive material to at least a surface of the first semiconductor device, and...
7331106 Underfill method  
A process for selectively depositing a filled underfill material onto a die surface without covering solder bumps present on the die. The process entails microjetting a polymer matrix material, a...
RE40061 Multi-chip stacked devices  
A multiple stacked die device is disclosed that contains up to four dies and does not exceed the height of current single die packages. Close-tolerance stacking is made possible by a...
7329603 Semiconductor device and manufacturing method thereof  
A semiconductor device having a semiconductor substrate, at least one of a protruding electrode and wiring formed on one surface of the semiconductor substrate, and a first resin film formed on...
7326934 Detector for the detection of electromagnetic radiation  
The invention relates to a detector for the detection of electromagnetic radiation, which detector includes at least one scintillator ( 6 ), at least one CMOS chip ( 3 ) and a ceramic basic element...
Matches 1 - 50 out of 1366 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 >