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7622325 |
Integrated circuit package system including high-density small footprint system-in-package
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
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7622324 |
Wafer bonding hermetic encapsulation
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
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7618847 |
Bonding method of semiconductor and laminated structure fabricated thereby
A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal...
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7615397 |
Micro-element package and manufacturing method thereof
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make...
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7611926 |
Thermosetting die bonding film
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a...
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7611925 |
Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
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7608480 |
Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
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7605021 |
Manufacturing method of electronic device
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
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7605019 |
Semiconductor device with stacked chips and method for manufacturing thereof
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
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7598124 |
System and method to increase die stand-off height
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a...
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7598122 |
Die attach method and microarray leadframe structure
In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray...
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7598117 |
Method for manufacturing semiconductor module using interconnection structure
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
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7595220 |
Image sensor package and fabrication method thereof
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
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7592708 |
Package board, semiconductor package, and fabricating method thereof
With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board...
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7588966 |
Chip mounting with flowable layer
A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the...
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7588965 |
Stencil and method for depositing material onto a substrate
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
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7588963 |
Method of forming overhang support for a stacked semiconductor device
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such...
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7588962 |
Method of making semiconductor device
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a...
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7585701 |
Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film
A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and...
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7585693 |
Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method
Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die...
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7579268 |
Method of manufacturing an integrated circuit
A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated chip, wherein the active faces of the...
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7579260 |
Method of dividing an adhesive film bonded to a wafer
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
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7579215 |
Method for fabricating a low cost integrated circuit (IC) package
A method for fabricating a low cost integrated circuit package ( 600 ) includes separating a processed silicon wafer into a plurality of individual die ( 601 ) and then positioning the die ( 603 )...
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7579206 |
Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
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7575955 |
Method for making electronic packages
A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a...
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7572677 |
Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support
In a semiconductor flip-chip package having a semiconductor die as part of a substrate assembly, a lid (or lid assembly) and substrate are supported to prevent tilting and teetering of the lid. The...
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7569921 |
Semiconductor device and manufacturing method thereof
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips...
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7569474 |
Method and apparatus for soldering modules to substrates
A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board...
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7569424 |
Method of forming a wall structure in a microelectronic assembly
A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly,...
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7566590 |
Low voltage drop and high thermal performance ball grid array package
An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first...
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7566589 |
Apparatus and method for signal bus line layout in semiconductor device
A device and method for layout and fabrication of power supply bus lines in an integrated circuit such as a memory circuit are described. In accordance with the present invention, power bus lines...
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7564496 |
Camera device, method of manufacturing a camera device, wafer scale package
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image...
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7563646 |
Molded ceramic surface mount package
The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or...
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7562428 |
Manufacturing an ink jet head
A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond...
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7560308 |
Method for manufacturing bonded substrates and substrates for use in the bonded substrates
A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first...
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7560305 |
Apparatus and method for high density multi-chip structures
Devices and methods are described including a multi-chip assembly. Embodiments of multi-chip assemblies are provided that uses both lateral connection structures and through chip connection...
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7560303 |
Method and apparatus for linear die transfer
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing...
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7553743 |
Wafer bonding method of system in package
A method of bonding a wafer in a system in package is provided. A plating layer is formed on each of a first semiconductor substrate and a second semiconductor substrate. The plating layers are...
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7553701 |
Semiconductor packaging method
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
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7553698 |
Semiconductor package having semiconductor constructing body and method of manufacturing the same
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating...
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7550836 |
Structure of package on package and method for fabricating the same
A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins....
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7550326 |
Method for manufacturing thin film device and semiconductor device
The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate ( 106 ) to a thin film device layer ( 103 )...
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7547580 |
Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is...
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7547579 |
Underfill process
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an...
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7547577 |
Method of making circuitized substrate with solder paste connections
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical...
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7544539 |
Forced heat transfer apparatus for heating stacked dice
An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet...
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7540970 |
Methods of fabricating a semiconductor device
Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between...
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7537668 |
Method of fabricating high density printed circuit board
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
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7534660 |
Methods for assembly and packaging of flip chip configured dice with interposer
A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type...
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7534659 |
Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first...
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