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7622325 Integrated circuit package system including high-density small footprint system-in-package  
An integrated circuit package system including a high-density small footprint system-in-package with a substrate is provided. Passive components are mounted on the substrate. Solder separators are...
7622324 Wafer bonding hermetic encapsulation  
A method for providing encapsulation of an electronic device which obtains an encapsulating member configured to enclose the electronic device, prepares a surface of the encapsulating member for...
7618847 Bonding method of semiconductor and laminated structure fabricated thereby  
A bonding method (three-dimensional mounting) of semiconductor substrates is provided to sequentially bond a principal surface of a silicon wafer on which coupling bumps are formed, and a principal...
7615397 Micro-element package and manufacturing method thereof  
A method of manufacturing a micro-element package which can reduce a manufacturing cost and improve productivity by simplifying its structure and manufacturing process, and also can make...
7611926 Thermosetting die bonding film  
The thermosetting die bonding film of the invention is a thermosetting die bonding film used to produce a semiconductor device, which contains, as main components, 5 to 15% by weight of a...
7611925 Electronic device and method of manufacturing the same, chip carrier, circuit board, and electronic instrument  
An external terminal is formed on an interconnect pattern formed on a substrate by using a soldering material. Subsequently, a chip component having an electrode is mounted on the substrate. An...
7608480 Method of fabricating a semiconductor device incorporating a semiconductor constructing body and an interconnecting layer which is connected to a ground layer via a vertical conducting portion  
A semiconductor device includes metal foil to which a ground potential is applied, at a semiconductor constructing body provided on the metal foil and having a semiconductor substrate and a...
7605021 Manufacturing method of electronic device  
A manufacturing method of manufacturing an electronic device, includes the steps of: applying a thermosetting adhesive on a surface of a base having a conductive pattern formed on a film; mounting...
7605019 Semiconductor device with stacked chips and method for manufacturing thereof  
A semiconductor device includes a first semiconductor device and a second semiconductor device. Through-holes in the second semiconductor device extend from an upper side of the second...
7598124 System and method to increase die stand-off height  
In accordance with the present invention, a system and method to increase die stand-off height in a flip chip are provided. The system includes a plurality of separator pedestals disposed between a...
7598122 Die attach method and microarray leadframe structure  
In one aspect of the invention, a method of attaching a semiconductor die to a microarray leadframe is described. The method comprises stamping an adhesive onto discrete areas of the microarray...
7598117 Method for manufacturing semiconductor module using interconnection structure  
In a method for manufacturing a semiconductor module, a metal layer is formed on a support substrate. Then, first conductive posts and a first insulating layer are formed on the metal layer. The...
7595220 Image sensor package and fabrication method thereof  
The invention provides an image sensor package and method for fabricating the same. The image sensor package comprises a first substrate comprising a sensor device thereon and a hole therein. A...
7592708 Package board, semiconductor package, and fabricating method thereof  
With a semiconductor package according to an aspect of the present invention comprising a board having circuit lines, solder resist formed on a surface of the board, and a chip mounted on the board...
7588966 Chip mounting with flowable layer  
A circuit structure may be formed in a substrate having a face and an open trench, where one or more chips are to be mounted. At least one bridge may extend across an intermediate portion of the...
7588965 Stencil and method for depositing material onto a substrate  
A stencil and method for depositing a coupon of underfill material onto a substrate that is to receive an integrated circuit die.
7588963 Method of forming overhang support for a stacked semiconductor device  
A stacked, multi-die semiconductor device and method of forming thereof. A preferred embodiment comprises disposing a stack of semiconductor dies to a substrate. The stacking arrangement is such...
7588962 Method of making semiconductor device  
A method for manufacturing a semiconductor device that includes a housing, formed of a polyamide-series thermoplastic resin, and a semiconductor package sealed in the housing, which is formed of a...
7585701 Carrier sheet with adhesive film and method for producing semiconductor devices using the carrier sheet with adhesive film  
A carrier sheet with an adhesive film includes a heat-resistant base film with an upper side and an underside, and a thermoactive adhesive layer arranged on the underside of the base film and...
7585693 Method of forming a microelectronic package using control of die and substrate differential expansions and microelectronic package formed according to the method  
Method of forming a microelectronic package using control of die and substrate differential expansions. The method includes: providing a die-substrate combination including a substrate, a die...
7579268 Method of manufacturing an integrated circuit  
A method of manufacturing an integrated circuit including a first isolated chip electrically and mechanically connected via wafer bonding to a second isolated chip, wherein the active faces of the...
7579260 Method of dividing an adhesive film bonded to a wafer  
A method of dividing an adhesive film for die bonding which is bonded to the rear surface of a wafer having devices in a plurality of areas sectioned by dividing lines formed in a lattice pattern...
7579215 Method for fabricating a low cost integrated circuit (IC) package  
A method for fabricating a low cost integrated circuit package ( 600 ) includes separating a processed silicon wafer into a plurality of individual die ( 601 ) and then positioning the die ( 603 )...
7579206 Anchors for microelectromechanical systems having an SOI substrate, and method of fabricating same  
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a MEMS device, and technique of fabricating or manufacturing a MEMS device having...
7575955 Method for making electronic packages  
A process for fabricating an electronic package for a Thermally Enhanced BGA package including the steps of fabricating a thermally conductive support member, an adhesive bonding member, and a...
7572677 Arrangement in semiconductor packages for inhibiting adhesion of lid to substrate while providing compression support  
In a semiconductor flip-chip package having a semiconductor die as part of a substrate assembly, a lid (or lid assembly) and substrate are supported to prevent tilting and teetering of the lid. The...
7569921 Semiconductor device and manufacturing method thereof  
A semiconductor device has a plurality of bare chips stacked on at least one of first and second main surfaces oppositely arranged on a support substrate, spacers arranged between two bare chips...
7569474 Method and apparatus for soldering modules to substrates  
A method and apparatus for attaching a module such as a semiconductor device, having an array of contacts arranged thereon in a given pattern to a substrate such as a printed circuit board...
7569424 Method of forming a wall structure in a microelectronic assembly  
A method of forming a wall structure in a microelectronic assembly includes selectively depositing a flowable material on an upper surface of a first element in the microelectronic assembly,...
7566590 Low voltage drop and high thermal performance ball grid array package  
An apparatus and method for a low voltage drop and thermally enhanced integrated circuit (IC) package are described. A substantially planar substrate having a plurality of contact pads on a first...
7566589 Apparatus and method for signal bus line layout in semiconductor device  
A device and method for layout and fabrication of power supply bus lines in an integrated circuit such as a memory circuit are described. In accordance with the present invention, power bus lines...
7564496 Camera device, method of manufacturing a camera device, wafer scale package  
The invention relates to a camera device and a method for manufacturing such a device. The camera device comprises an image capturing element, a lens element for imaging an object at the image...
7563646 Molded ceramic surface mount package  
The surface mount package is assembled from a ceramic base which is imprinted on its upper and lower surfaces with conductive patterns for attachment of and connection to an electronic or...
7562428 Manufacturing an ink jet head  
A manufacturing method that includes the steps of forming an actuator unit, disposing a metallic bond and a thermosetting resin; pressing the land and the terminal; and heating the metallic bond...
7560308 Method for manufacturing bonded substrates and substrates for use in the bonded substrates  
A method for manufacturing bonded substrates includes: forming the first terminals on the first substrate, the first terminals each having a metal core projecting from a surface of the first...
7560305 Apparatus and method for high density multi-chip structures  
Devices and methods are described including a multi-chip assembly. Embodiments of multi-chip assemblies are provided that uses both lateral connection structures and through chip connection...
7560303 Method and apparatus for linear die transfer  
A method for assembling a semiconductor device including the steps of providing a penetrable substrate having an adhesive surface and a plurality of dies disposed on the adhesive surface; providing...
7553743 Wafer bonding method of system in package  
A method of bonding a wafer in a system in package is provided. A plating layer is formed on each of a first semiconductor substrate and a second semiconductor substrate. The plating layers are...
7553701 Semiconductor packaging method  
The present invention relates to a semiconductor packaging method. The method comprises (S 1 ) applying a die adhesive to an upper surface of a member through screen-printing; (S 2 ) B-stage curing...
7553698 Semiconductor package having semiconductor constructing body and method of manufacturing the same  
A semiconductor package includes at least one semiconductor constructing body which has a semiconductor substrate and a plurality of external connection electrodes formed thereon. An insulating...
7550836 Structure of package on package and method for fabricating the same  
A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins....
7550326 Method for manufacturing thin film device and semiconductor device  
The present invention relates to a method for manufacturing a thin film device. The thin film device is manufactured by bonding a second substrate ( 106 ) to a thin film device layer ( 103 )...
7547580 Method for manufacturing a semiconductor wiring base that includes a wiring base with wiring extending inside and outside of a mounting region  
A method for manufacturing a semiconductor device is provided. A resin paste is applied to a wiring base including a wiring pattern. Then, a semiconductor chip having a plurality of electrodes is...
7547579 Underfill process  
A method and apparatus for underfilling a gap between a semiconductor die or device and a substrate, where the semiconductor die or device is electrically connected to the substrate so that an...
7547577 Method of making circuitized substrate with solder paste connections  
A method of making a circuitized substrate assembly in which two or more subassemblies are aligned and bonded together. The bonding, preferably using lamination, results in effective electrical...
7544539 Forced heat transfer apparatus for heating stacked dice  
An apparatus and method are provided for effectively heating a first die stacked above a second die attached onto a substrate during wire bonding conducted on the first die. A gas outlet...
7540970 Methods of fabricating a semiconductor device  
Methods of fabricating a semiconductor device are provided. Methods of forming a finer pattern of a semiconductor device using a buffer layer for retarding, or preventing, bridge formation between...
7537668 Method of fabricating high density printed circuit board  
A method of fabricating a high density printed circuit board by applying a strippable adhesive layer on a reinforced substrate (rigid substrate or carrier film) used as a base substrate, forming a...
7534660 Methods for assembly and packaging of flip chip configured dice with interposer  
A method for assembly and packaging of one or more flip chip-configured semiconductor dice with an interposer substrate to form a flip chip-type semiconductor device assembly. The flip chip-type...
7534659 Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device  
A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first...